{"id":"https://openalex.org/W1979927257","doi":"https://doi.org/10.1016/s0026-2714(01)00151-2","title":"Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation","display_name":"Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation","publication_year":2001,"publication_date":"2001-09-01","ids":{"openalex":"https://openalex.org/W1979927257","doi":"https://doi.org/10.1016/s0026-2714(01)00151-2","mag":"1979927257"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00151-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00151-2","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044721658","display_name":"David Dalleau","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158530","display_name":"Hannoversche Informationstechnologien (Germany)","ror":"https://ror.org/05d5xcc98","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210158530"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"D. Dalleau","raw_affiliation_strings":["Laboratorium f\u00fcr Informationstechnologie, University of Hannover, Germany"],"affiliations":[{"raw_affiliation_string":"Laboratorium f\u00fcr Informationstechnologie, University of Hannover, Germany","institution_ids":["https://openalex.org/I4210158530"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113548883","display_name":"K. Weide-Zaage","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158530","display_name":"Hannoversche Informationstechnologien (Germany)","ror":"https://ror.org/05d5xcc98","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210158530"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"K. Weide-Zaage","raw_affiliation_strings":["Laboratorium f\u00fcr Informationstechnologie, University of Hannover, Germany"],"affiliations":[{"raw_affiliation_string":"Laboratorium f\u00fcr Informationstechnologie, University of Hannover, Germany","institution_ids":["https://openalex.org/I4210158530"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5044721658"],"corresponding_institution_ids":["https://openalex.org/I4210158530"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":4.8105,"has_fulltext":false,"cited_by_count":112,"citation_normalized_percentile":{"value":0.93526527,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":"41","issue":"9-10","first_page":"1625","last_page":"1630"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11201","display_name":"Metallurgy and Material Forming","score":0.9661999940872192,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11201","display_name":"Metallurgy and Material Forming","score":0.9661999940872192,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.7073638439178467},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.6249701380729675},{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.6200686097145081},{"id":"https://openalex.org/keywords/joule-heating","display_name":"Joule heating","score":0.6046000123023987},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5706794857978821},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.4672985374927521},{"id":"https://openalex.org/keywords/weibull-distribution","display_name":"Weibull distribution","score":0.465842604637146},{"id":"https://openalex.org/keywords/overheating","display_name":"Overheating (electricity)","score":0.4282679557800293},{"id":"https://openalex.org/keywords/power-cycling","display_name":"Power cycling","score":0.4274788796901703},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.42740464210510254},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.42293936014175415},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.36844897270202637},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3578832745552063},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3074701428413391},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.29919058084487915},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.27937614917755127},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2777252197265625}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7073638439178467},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6249701380729675},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.6200686097145081},{"id":"https://openalex.org/C117926987","wikidata":"https://www.wikidata.org/wiki/Q210009","display_name":"Joule heating","level":2,"score":0.6046000123023987},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5706794857978821},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4672985374927521},{"id":"https://openalex.org/C173291955","wikidata":"https://www.wikidata.org/wiki/Q732332","display_name":"Weibull distribution","level":2,"score":0.465842604637146},{"id":"https://openalex.org/C2778284599","wikidata":"https://www.wikidata.org/wiki/Q25340000","display_name":"Overheating (electricity)","level":2,"score":0.4282679557800293},{"id":"https://openalex.org/C2777900271","wikidata":"https://www.wikidata.org/wiki/Q17105337","display_name":"Power cycling","level":4,"score":0.4274788796901703},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.42740464210510254},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.42293936014175415},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36844897270202637},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3578832745552063},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3074701428413391},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.29919058084487915},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.27937614917755127},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2777252197265625},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00151-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00151-2","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2380377017","https://openalex.org/W1811598931","https://openalex.org/W1523184867","https://openalex.org/W2391203258","https://openalex.org/W2354827036","https://openalex.org/W2057683340","https://openalex.org/W2348807422","https://openalex.org/W2361025757","https://openalex.org/W2043907596","https://openalex.org/W2752463234"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":6},{"year":2022,"cited_by_count":5},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":5},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":4},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}