{"id":"https://openalex.org/W2031698916","doi":"https://doi.org/10.1016/s0026-2714(01)00126-3","title":"The effects of curing parameters on the properties development of an epoxy encapsulant material","display_name":"The effects of curing parameters on the properties development of an epoxy encapsulant material","publication_year":2002,"publication_date":"2002-01-01","ids":{"openalex":"https://openalex.org/W2031698916","doi":"https://doi.org/10.1016/s0026-2714(01)00126-3","mag":"2031698916"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00126-3","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00126-3","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5030864656","display_name":"Christine M. Naito","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Christine Naito","raw_affiliation_strings":["Electronic Materials, Dexter Corporation, 15051 East Don Julian Road, Industry, CA 91746, USA"],"affiliations":[{"raw_affiliation_string":"Electronic Materials, Dexter Corporation, 15051 East Don Julian Road, Industry, CA 91746, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040100411","display_name":"Michael Todd","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michael Todd","raw_affiliation_strings":["Electronic Materials, Dexter Corporation, 15051 East Don Julian Road, Industry, CA 91746, USA"],"affiliations":[{"raw_affiliation_string":"Electronic Materials, Dexter Corporation, 15051 East Don Julian Road, Industry, CA 91746, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5030864656"],"corresponding_institution_ids":[],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":2.1516,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.86300987,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"42","issue":"1","first_page":"119","last_page":"125"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9939000010490417,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flexural-strength","display_name":"Flexural strength","score":0.81844562292099},{"id":"https://openalex.org/keywords/epoxy","display_name":"Epoxy","score":0.7667977809906006},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.731346845626831},{"id":"https://openalex.org/keywords/curing","display_name":"Curing (chemistry)","score":0.7205073237419128},{"id":"https://openalex.org/keywords/flexural-modulus","display_name":"Flexural modulus","score":0.7141575217247009},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.6521366834640503},{"id":"https://openalex.org/keywords/modulus","display_name":"Modulus","score":0.5036386847496033},{"id":"https://openalex.org/keywords/glass-transition","display_name":"Glass transition","score":0.4818931221961975},{"id":"https://openalex.org/keywords/thermal-expansion","display_name":"Thermal expansion","score":0.4597274661064148},{"id":"https://openalex.org/keywords/material-properties","display_name":"Material properties","score":0.4546509087085724},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.10747143626213074}],"concepts":[{"id":"https://openalex.org/C178405089","wikidata":"https://www.wikidata.org/wiki/Q857201","display_name":"Flexural strength","level":2,"score":0.81844562292099},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.7667977809906006},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.731346845626831},{"id":"https://openalex.org/C132976073","wikidata":"https://www.wikidata.org/wiki/Q2991861","display_name":"Curing (chemistry)","level":2,"score":0.7205073237419128},{"id":"https://openalex.org/C809718","wikidata":"https://www.wikidata.org/wiki/Q5459047","display_name":"Flexural modulus","level":3,"score":0.7141575217247009},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6521366834640503},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.5036386847496033},{"id":"https://openalex.org/C122865956","wikidata":"https://www.wikidata.org/wiki/Q825643","display_name":"Glass transition","level":3,"score":0.4818931221961975},{"id":"https://openalex.org/C47463417","wikidata":"https://www.wikidata.org/wiki/Q6583695","display_name":"Thermal expansion","level":2,"score":0.4597274661064148},{"id":"https://openalex.org/C31555180","wikidata":"https://www.wikidata.org/wiki/Q3523867","display_name":"Material properties","level":2,"score":0.4546509087085724},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.10747143626213074}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00126-3","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00126-3","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4099999964237213,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2006964693","https://openalex.org/W2153697661","https://openalex.org/W2982613302","https://openalex.org/W4285719527","https://openalex.org/W4414900596"],"related_works":["https://openalex.org/W1975100110","https://openalex.org/W2967314242","https://openalex.org/W1765087222","https://openalex.org/W3158021141","https://openalex.org/W1983141745","https://openalex.org/W2170968765","https://openalex.org/W210446445","https://openalex.org/W2081085647","https://openalex.org/W2065321040","https://openalex.org/W2185938412"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}