{"id":"https://openalex.org/W2051892856","doi":"https://doi.org/10.1016/s0026-2714(01)00111-1","title":"Mechanism of pre-annealing effect on electromigration immunity of Al\u2013Cu line","display_name":"Mechanism of pre-annealing effect on electromigration immunity of Al\u2013Cu line","publication_year":2001,"publication_date":"2001-08-01","ids":{"openalex":"https://openalex.org/W2051892856","doi":"https://doi.org/10.1016/s0026-2714(01)00111-1","mag":"2051892856"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00111-1","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00111-1","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109179188","display_name":"M.K. Mazumder","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133125","display_name":"Mitsubishi Electric (Japan)","ror":"https://ror.org/033y26782","country_code":"JP","type":"company","lineage":["https://openalex.org/I1306287861","https://openalex.org/I4210133125"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"M.K Mazumder","raw_affiliation_strings":["ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan","institution_ids":["https://openalex.org/I4210133125"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079796779","display_name":"Shigeyuki Yamamoto","orcid":"https://orcid.org/0000-0003-2450-3297"},"institutions":[{"id":"https://openalex.org/I4210133125","display_name":"Mitsubishi Electric (Japan)","ror":"https://ror.org/033y26782","country_code":"JP","type":"company","lineage":["https://openalex.org/I1306287861","https://openalex.org/I4210133125"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"S Yamamoto","raw_affiliation_strings":["ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan","institution_ids":["https://openalex.org/I4210133125"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032649593","display_name":"H. Maeda","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133125","display_name":"Mitsubishi Electric (Japan)","ror":"https://ror.org/033y26782","country_code":"JP","type":"company","lineage":["https://openalex.org/I1306287861","https://openalex.org/I4210133125"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"H Maeda","raw_affiliation_strings":["ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan","institution_ids":["https://openalex.org/I4210133125"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114101600","display_name":"J. Komori","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133125","display_name":"Mitsubishi Electric (Japan)","ror":"https://ror.org/033y26782","country_code":"JP","type":"company","lineage":["https://openalex.org/I1306287861","https://openalex.org/I4210133125"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"J Komori","raw_affiliation_strings":["ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan","institution_ids":["https://openalex.org/I4210133125"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113537674","display_name":"Y. Mashiko","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133125","display_name":"Mitsubishi Electric (Japan)","ror":"https://ror.org/033y26782","country_code":"JP","type":"company","lineage":["https://openalex.org/I1306287861","https://openalex.org/I4210133125"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Y Mashiko","raw_affiliation_strings":["ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ULSI Development Center, Mitsubishi Electric Corp., 4-1 Mizuhara, Itami-shi, Hyogo 664-8641, Japan","institution_ids":["https://openalex.org/I4210133125"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210133125"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.2627,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.53165683,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"41","issue":"8","first_page":"1259","last_page":"1264"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9749283790588379},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.719228982925415},{"id":"https://openalex.org/keywords/mechanism","display_name":"Mechanism (biology)","score":0.5868618488311768},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5286388993263245},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.4227997362613678},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.24245059490203857},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10011118650436401}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9749283790588379},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.719228982925415},{"id":"https://openalex.org/C89611455","wikidata":"https://www.wikidata.org/wiki/Q6804646","display_name":"Mechanism (biology)","level":2,"score":0.5868618488311768},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5286388993263245},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4227997362613678},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.24245059490203857},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10011118650436401},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00111-1","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00111-1","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1548886830","https://openalex.org/W1976691218","https://openalex.org/W1978088456","https://openalex.org/W1983391782","https://openalex.org/W1984377651","https://openalex.org/W2029739744","https://openalex.org/W2041747552","https://openalex.org/W2053224959","https://openalex.org/W2066110919","https://openalex.org/W2078800903","https://openalex.org/W2079594025","https://openalex.org/W2088082062","https://openalex.org/W2093578104","https://openalex.org/W2132598416","https://openalex.org/W2316605038","https://openalex.org/W6611068095"],"related_works":["https://openalex.org/W2073706146","https://openalex.org/W2421549311","https://openalex.org/W4253328832","https://openalex.org/W2070338356","https://openalex.org/W4231413117","https://openalex.org/W2022507789","https://openalex.org/W2127088278","https://openalex.org/W3094131129","https://openalex.org/W3046190049","https://openalex.org/W2322722469"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}