{"id":"https://openalex.org/W2070008088","doi":"https://doi.org/10.1016/s0026-2714(01)00014-2","title":"Reliability evaluation of a silicon-on-silicon MCM-D package","display_name":"Reliability evaluation of a silicon-on-silicon MCM-D package","publication_year":2001,"publication_date":"2001-06-01","ids":{"openalex":"https://openalex.org/W2070008088","doi":"https://doi.org/10.1016/s0026-2714(01)00014-2","mag":"2070008088"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(01)00014-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00014-2","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5060234215","display_name":"John Barton","orcid":"https://orcid.org/0000-0002-0671-5678"},"institutions":[{"id":"https://openalex.org/I4210099932","display_name":"National Microelectronics Applications Centre (Ireland)","ror":"https://ror.org/012k6p920","country_code":"IE","type":"company","lineage":["https://openalex.org/I4210099932"]}],"countries":["IE"],"is_corresponding":true,"raw_author_name":"J Barton","raw_affiliation_strings":["National Microelectronics Research Centre (NMRC), Lee Maltings, Prospect Row, Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Microelectronics Research Centre (NMRC), Lee Maltings, Prospect Row, Cork, Ireland","institution_ids":["https://openalex.org/I4210099932"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013121681","display_name":"Geraldine McCarthy","orcid":"https://orcid.org/0000-0002-1312-0998"},"institutions":[{"id":"https://openalex.org/I4210107060","display_name":"DELL (Ireland)","ror":"https://ror.org/012x04f41","country_code":"IE","type":"company","lineage":["https://openalex.org/I4210107060","https://openalex.org/I4210149435"]}],"countries":["IE"],"is_corresponding":false,"raw_author_name":"G McCarthy","raw_affiliation_strings":["EMC, Ovens, Co. Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EMC, Ovens, Co. Cork, Ireland","institution_ids":["https://openalex.org/I4210107060"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112009933","display_name":"Richard L. Doyle","orcid":null},"institutions":[{"id":"https://openalex.org/I4210099932","display_name":"National Microelectronics Applications Centre (Ireland)","ror":"https://ror.org/012k6p920","country_code":"IE","type":"company","lineage":["https://openalex.org/I4210099932"]}],"countries":["IE"],"is_corresponding":false,"raw_author_name":"R Doyle","raw_affiliation_strings":["Inpact Microelectronics, Pouladuff Road, Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Inpact Microelectronics, Pouladuff Road, Cork, Ireland","institution_ids":["https://openalex.org/I4210099932"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083660725","display_name":"Kieran Delaney","orcid":"https://orcid.org/0000-0001-8720-5778"},"institutions":[{"id":"https://openalex.org/I4210099932","display_name":"National Microelectronics Applications Centre (Ireland)","ror":"https://ror.org/012k6p920","country_code":"IE","type":"company","lineage":["https://openalex.org/I4210099932"]}],"countries":["IE"],"is_corresponding":false,"raw_author_name":"K Delaney","raw_affiliation_strings":["National Microelectronics Research Centre (NMRC), Lee Maltings, Prospect Row, Cork, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Microelectronics Research Centre (NMRC), Lee Maltings, Prospect Row, Cork, Ireland","institution_ids":["https://openalex.org/I4210099932"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034232955","display_name":"E. Cabruja","orcid":"https://orcid.org/0000-0003-4505-6465"},"institutions":[{"id":"https://openalex.org/I123044942","display_name":"Universitat Aut\u00f2noma de Barcelona","ror":"https://ror.org/052g8jq94","country_code":"ES","type":"education","lineage":["https://openalex.org/I123044942"]},{"id":"https://openalex.org/I4210147934","display_name":"Centro Nacional de Microelectr\u00f3nica","ror":"https://ror.org/03ycqrz18","country_code":"ES","type":"facility","lineage":["https://openalex.org/I134820265","https://openalex.org/I4210147934"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"E Cabruja","raw_affiliation_strings":["Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]},{"raw_affiliation_string":"Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100758473","display_name":"M. Lozano","orcid":"https://orcid.org/0000-0001-5826-5544"},"institutions":[{"id":"https://openalex.org/I123044942","display_name":"Universitat Aut\u00f2noma de Barcelona","ror":"https://ror.org/052g8jq94","country_code":"ES","type":"education","lineage":["https://openalex.org/I123044942"]},{"id":"https://openalex.org/I4210147934","display_name":"Centro Nacional de Microelectr\u00f3nica","ror":"https://ror.org/03ycqrz18","country_code":"ES","type":"facility","lineage":["https://openalex.org/I134820265","https://openalex.org/I4210147934"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"M Lozano","raw_affiliation_strings":["Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]},{"raw_affiliation_string":"Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045145486","display_name":"Ana Collado","orcid":"https://orcid.org/0000-0002-7576-2291"},"institutions":[{"id":"https://openalex.org/I123044942","display_name":"Universitat Aut\u00f2noma de Barcelona","ror":"https://ror.org/052g8jq94","country_code":"ES","type":"education","lineage":["https://openalex.org/I123044942"]},{"id":"https://openalex.org/I4210147934","display_name":"Centro Nacional de Microelectr\u00f3nica","ror":"https://ror.org/03ycqrz18","country_code":"ES","type":"facility","lineage":["https://openalex.org/I134820265","https://openalex.org/I4210147934"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"A Collado","raw_affiliation_strings":["Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]},{"raw_affiliation_string":"Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083029874","display_name":"J. Santander","orcid":"https://orcid.org/0000-0001-5864-4552"},"institutions":[{"id":"https://openalex.org/I123044942","display_name":"Universitat Aut\u00f2noma de Barcelona","ror":"https://ror.org/052g8jq94","country_code":"ES","type":"education","lineage":["https://openalex.org/I123044942"]},{"id":"https://openalex.org/I4210147934","display_name":"Centro Nacional de Microelectr\u00f3nica","ror":"https://ror.org/03ycqrz18","country_code":"ES","type":"facility","lineage":["https://openalex.org/I134820265","https://openalex.org/I4210147934"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"J Santander","raw_affiliation_strings":["Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Centro Nacional de Microelectronica, CNM-IMB (CSIC), Campus Universidad Autonoma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]},{"raw_affiliation_string":"Centro Nacional de Microelectr\u00f3nica, CNM-IMB (CSIC), Campus Universidad Aut\u00f3noma de Barcelona, 08193 Bellaterra, Barcelona, Spain","institution_ids":["https://openalex.org/I123044942","https://openalex.org/I4210147934"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5060234215"],"corresponding_institution_ids":["https://openalex.org/I4210099932"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.3978,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.68531572,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"41","issue":"6","first_page":"887","last_page":"899"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9897000193595886,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9890999794006348,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.8484283685684204},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.7194682955741882},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.6702306270599365},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6425884366035461},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6183083653450012},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5958664417266846},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.545669674873352},{"id":"https://openalex.org/keywords/power-cycling","display_name":"Power cycling","score":0.4984700679779053},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.462157279253006},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4532625675201416},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.44671839475631714},{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.41969162225723267},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3823871314525604},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.35568615794181824},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3339127004146576},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3266853988170624},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.2822026014328003},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.26332294940948486},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.25975924730300903},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.15835347771644592},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.14808952808380127},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.12905296683311462},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.10405778884887695},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.09791576862335205}],"concepts":[{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.8484283685684204},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7194682955741882},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.6702306270599365},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6425884366035461},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6183083653450012},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5958664417266846},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.545669674873352},{"id":"https://openalex.org/C2777900271","wikidata":"https://www.wikidata.org/wiki/Q17105337","display_name":"Power cycling","level":4,"score":0.4984700679779053},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.462157279253006},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4532625675201416},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.44671839475631714},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.41969162225723267},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3823871314525604},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.35568615794181824},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3339127004146576},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3266853988170624},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.2822026014328003},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.26332294940948486},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25975924730300903},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.15835347771644592},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.14808952808380127},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12905296683311462},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.10405778884887695},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.09791576862335205},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(01)00014-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(01)00014-2","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W569687111","https://openalex.org/W1838434021","https://openalex.org/W1953234087","https://openalex.org/W2019490781","https://openalex.org/W2106611233","https://openalex.org/W2163061361","https://openalex.org/W2565361917","https://openalex.org/W4249376809","https://openalex.org/W4298252551"],"related_works":["https://openalex.org/W1951801788","https://openalex.org/W2050959455","https://openalex.org/W2155941634","https://openalex.org/W2167784957","https://openalex.org/W2042345646","https://openalex.org/W2134467738","https://openalex.org/W1825276086","https://openalex.org/W4387231751","https://openalex.org/W1985884902","https://openalex.org/W2090138976"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}