{"id":"https://openalex.org/W1983450894","doi":"https://doi.org/10.1016/s0026-2714(00)00239-0","title":"Reliability considerations for ESD protection under wire bonding pads","display_name":"Reliability considerations for ESD protection under wire bonding pads","publication_year":2001,"publication_date":"2001-03-01","ids":{"openalex":"https://openalex.org/W1983450894","doi":"https://doi.org/10.1016/s0026-2714(00)00239-0","mag":"1983450894"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2714(00)00239-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(00)00239-0","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5004033669","display_name":"Warren Anderson","orcid":"https://orcid.org/0000-0002-9315-5233"},"institutions":[{"id":"https://openalex.org/I4210122731","display_name":"Digital Wave (United States)","ror":"https://ror.org/02t3fqk56","country_code":"US","type":"company","lineage":["https://openalex.org/I4210122731"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Warren R. Anderson","raw_affiliation_strings":["Alpha Development Group, Compaq Computer Corporation, 334 South Street, Shrewsbury, MA 01545, USA","Digital Equipment Corporation, Hudson, MA 01749, USA"],"affiliations":[{"raw_affiliation_string":"Alpha Development Group, Compaq Computer Corporation, 334 South Street, Shrewsbury, MA 01545, USA","institution_ids":[]},{"raw_affiliation_string":"Digital Equipment Corporation, Hudson, MA 01749, USA","institution_ids":["https://openalex.org/I4210122731"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027873898","display_name":"William M. Gonzalez","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122731","display_name":"Digital Wave (United States)","ror":"https://ror.org/02t3fqk56","country_code":"US","type":"company","lineage":["https://openalex.org/I4210122731"]},{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"William M. Gonzalez","raw_affiliation_strings":["Digital Equipment Corporation, Hudson, MA 01749, USA","Intel Massachusetts, Inc., Hudson, MA 01749, USA"],"affiliations":[{"raw_affiliation_string":"Digital Equipment Corporation, Hudson, MA 01749, USA","institution_ids":["https://openalex.org/I4210122731"]},{"raw_affiliation_string":"Intel Massachusetts, Inc., Hudson, MA 01749, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009411802","display_name":"Sheera S. Knecht","orcid":null},"institutions":[{"id":"https://openalex.org/I912377674","display_name":"Newbury College","ror":"https://ror.org/01g4a4162","country_code":"US","type":"education","lineage":["https://openalex.org/I912377674"]},{"id":"https://openalex.org/I4210122731","display_name":"Digital Wave (United States)","ror":"https://ror.org/02t3fqk56","country_code":"US","type":"company","lineage":["https://openalex.org/I4210122731"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheera S. Knecht","raw_affiliation_strings":["Digital Equipment Corporation, Hudson, MA 01749, USA","NeuMath, Inc., 22 Bailey's Lane, W. Newbury, MA 01985, USA"],"affiliations":[{"raw_affiliation_string":"Digital Equipment Corporation, Hudson, MA 01749, USA","institution_ids":["https://openalex.org/I4210122731"]},{"raw_affiliation_string":"NeuMath, Inc., 22 Bailey's Lane, W. Newbury, MA 01985, USA","institution_ids":["https://openalex.org/I912377674"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027095011","display_name":"W. C. Fowler","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122731","display_name":"Digital Wave (United States)","ror":"https://ror.org/02t3fqk56","country_code":"US","type":"company","lineage":["https://openalex.org/I4210122731"]},{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wendy Fowler","raw_affiliation_strings":["Digital Equipment Corporation, Hudson, MA 01749, USA","Intel Massachusetts, Inc., Hudson, MA 01749, USA"],"affiliations":[{"raw_affiliation_string":"Digital Equipment Corporation, Hudson, MA 01749, USA","institution_ids":["https://openalex.org/I4210122731"]},{"raw_affiliation_string":"Intel Massachusetts, Inc., Hudson, MA 01749, USA","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5004033669"],"corresponding_institution_ids":["https://openalex.org/I4210122731"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.4355,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.66560563,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"41","issue":"3","first_page":"367","last_page":"373"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9929999709129333,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9905999898910522,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.7828578948974609},{"id":"https://openalex.org/keywords/electrostatic-discharge","display_name":"Electrostatic discharge","score":0.7068123817443848},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.556868851184845},{"id":"https://openalex.org/keywords/wedge","display_name":"Wedge (geometry)","score":0.4624946117401123},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4513978362083435},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4253776967525482},{"id":"https://openalex.org/keywords/diode","display_name":"Diode","score":0.4151294529438019},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.390184223651886},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3516612648963928},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.34604066610336304},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.33930450677871704},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.12886101007461548},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.08089956641197205}],"concepts":[{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.7828578948974609},{"id":"https://openalex.org/C205483674","wikidata":"https://www.wikidata.org/wiki/Q3574961","display_name":"Electrostatic discharge","level":3,"score":0.7068123817443848},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.556868851184845},{"id":"https://openalex.org/C47422493","wikidata":"https://www.wikidata.org/wiki/Q2755127","display_name":"Wedge (geometry)","level":2,"score":0.4624946117401123},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4513978362083435},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4253776967525482},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.4151294529438019},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.390184223651886},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3516612648963928},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.34604066610336304},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.33930450677871704},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.12886101007461548},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.08089956641197205},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2714(00)00239-0","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2714(00)00239-0","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1951111830","https://openalex.org/W2050807680","https://openalex.org/W2053036304"],"related_works":["https://openalex.org/W2124694210","https://openalex.org/W2153609444","https://openalex.org/W2544244340","https://openalex.org/W3160715487","https://openalex.org/W1889262262","https://openalex.org/W2157426934","https://openalex.org/W2017385525","https://openalex.org/W2533798643","https://openalex.org/W1943383333","https://openalex.org/W2347609878"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}