{"id":"https://openalex.org/W1970025965","doi":"https://doi.org/10.1016/s0026-2692(03)00200-3","title":"How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002","display_name":"How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002","publication_year":2003,"publication_date":"2003-11-14","ids":{"openalex":"https://openalex.org/W1970025965","doi":"https://doi.org/10.1016/s0026-2692(03)00200-3","mag":"1970025965"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2692(03)00200-3","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2692(03)00200-3","pdf_url":null,"source":{"id":"https://openalex.org/S98831239","display_name":"Microelectronics Journal","issn_l":"1879-2391","issn":["1879-2391"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Journal","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003076382","display_name":"Yogendra Joshi","orcid":"https://orcid.org/0000-0002-8815-5212"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yogendra Joshi","raw_affiliation_strings":["G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA","G W Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332,\u00a0 USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"G W Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332,\u00a0 USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112730006","display_name":"Kaveh Azar","orcid":null},"institutions":[{"id":"https://openalex.org/I4210157171","display_name":"Creative Thermal Solutions","ror":"https://ror.org/053gdty29","country_code":"US","type":"facility","lineage":["https://openalex.org/I4210157171"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kaveh Azar","raw_affiliation_strings":["Advanced Thermal Solutions, Inc., 89-27 Access Road, Norwood, MA 02062, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Thermal Solutions, Inc., 89-27 Access Road, Norwood, MA 02062, USA","institution_ids":["https://openalex.org/I4210157171"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108412186","display_name":"David L. Blackburn","orcid":null},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"funder","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Blackburn","raw_affiliation_strings":["National Institute for Standards and Technology, 100 Bureau Drive, Stop 8120, Gaithersburg, MD 20899-8120, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Institute for Standards and Technology, 100 Bureau Drive, Stop 8120, Gaithersburg, MD 20899-8120, USA","institution_ids":["https://openalex.org/I1321296531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090615541","display_name":"Clemens Lasance","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122849","display_name":"Philips (Netherlands)","ror":"https://ror.org/02p2bgp27","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210122849"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Clemens J.M. Lasance","raw_affiliation_strings":["Philips Research Laboratories, Eindhoven The Netherlands","Philips' Research Laboratories, Eindhoven The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Philips Research Laboratories, Eindhoven The Netherlands","institution_ids":["https://openalex.org/I4210122849"]},{"raw_affiliation_string":"Philips' Research Laboratories, Eindhoven The Netherlands","institution_ids":["https://openalex.org/I4210122849"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088834533","display_name":"Ravi Mahajan","orcid":"https://orcid.org/0000-0003-2562-359X"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ravi Mahajan","raw_affiliation_strings":["Assembly Technology Development, Intel Corporation, Chandler, AZ, USA","[Assembly Technology Development, Intel Corporation, Chandler, AZ, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Assembly Technology Development, Intel Corporation, Chandler, AZ, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"[Assembly Technology Development, Intel Corporation, Chandler, AZ, USA]","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038527574","display_name":"Jukka Rantala","orcid":"https://orcid.org/0000-0001-5260-6029"},"institutions":[{"id":"https://openalex.org/I2738502077","display_name":"Nokia (Finland)","ror":"https://ror.org/04pkc8m17","country_code":"FI","type":"company","lineage":["https://openalex.org/I2738502077"]}],"countries":["FI"],"is_corresponding":false,"raw_author_name":"Jukka Rantala","raw_affiliation_strings":["Nokia Research Center, Helsinki, Finland","[Nokia Research Center, Helsinki, Finland]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nokia Research Center, Helsinki, Finland","institution_ids":["https://openalex.org/I2738502077"]},{"raw_affiliation_string":"[Nokia Research Center, Helsinki, Finland]","institution_ids":["https://openalex.org/I2738502077"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5003076382"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":{"value":2370,"currency":"USD","value_usd":2370},"apc_paid":null,"fwci":0.7064,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.70853359,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"34","issue":"12","first_page":"1195","last_page":"1201"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9966999888420105,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.807192862033844},{"id":"https://openalex.org/keywords/panel-discussion","display_name":"Panel discussion","score":0.7505180835723877},{"id":"https://openalex.org/keywords/focus","display_name":"Focus (optics)","score":0.5616976022720337},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.4946689307689667},{"id":"https://openalex.org/keywords/physics-of-failure","display_name":"Physics of failure","score":0.4812205135822296},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.46334725618362427},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.44616052508354187},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4186709225177765},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.41835877299308777},{"id":"https://openalex.org/keywords/data-science","display_name":"Data science","score":0.36291033029556274},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10817888379096985},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.0796085000038147}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.807192862033844},{"id":"https://openalex.org/C2781433648","wikidata":"https://www.wikidata.org/wiki/Q2100278","display_name":"Panel discussion","level":2,"score":0.7505180835723877},{"id":"https://openalex.org/C192209626","wikidata":"https://www.wikidata.org/wiki/Q190909","display_name":"Focus (optics)","level":2,"score":0.5616976022720337},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.4946689307689667},{"id":"https://openalex.org/C2778306610","wikidata":"https://www.wikidata.org/wiki/Q7189696","display_name":"Physics of failure","level":4,"score":0.4812205135822296},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46334725618362427},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.44616052508354187},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4186709225177765},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.41835877299308777},{"id":"https://openalex.org/C2522767166","wikidata":"https://www.wikidata.org/wiki/Q2374463","display_name":"Data science","level":1,"score":0.36291033029556274},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10817888379096985},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.0796085000038147},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C112698675","wikidata":"https://www.wikidata.org/wiki/Q37038","display_name":"Advertising","level":1,"score":0.0},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2692(03)00200-3","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2692(03)00200-3","pdf_url":null,"source":{"id":"https://openalex.org/S98831239","display_name":"Microelectronics Journal","issn_l":"1879-2391","issn":["1879-2391"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Journal","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W72371200","https://openalex.org/W2767411976","https://openalex.org/W2357256365","https://openalex.org/W2348502264","https://openalex.org/W2799334495","https://openalex.org/W2365486383","https://openalex.org/W2234602321","https://openalex.org/W4362504543","https://openalex.org/W2081105808","https://openalex.org/W1970025965"],"abstract_inverted_index":null,"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}