{"id":"https://openalex.org/W1970179159","doi":"https://doi.org/10.1016/s0026-2692(02)00154-4","title":"Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration","display_name":"Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration","publication_year":2003,"publication_date":"2003-01-30","ids":{"openalex":"https://openalex.org/W1970179159","doi":"https://doi.org/10.1016/s0026-2692(02)00154-4","mag":"1970179159"},"language":"en","primary_location":{"id":"doi:10.1016/s0026-2692(02)00154-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2692(02)00154-4","pdf_url":null,"source":{"id":"https://openalex.org/S98831239","display_name":"Microelectronics Journal","issn_l":"1879-2391","issn":["1879-2391"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Journal","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101755761","display_name":"Yiting Zheng","orcid":"https://orcid.org/0000-0003-2351-6707"},"institutions":[{"id":"https://openalex.org/I2799413724","display_name":"Singapore Science Park","ror":"https://ror.org/0023asr12","country_code":"SG","type":"archive","lineage":["https://openalex.org/I2799413724"]},{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"Y.S. Zheng","raw_affiliation_strings":["Institute of Microelectronics, Singapore Science Park II, Singapore 117685","Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park II, Singapore 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046025037","display_name":"Qiang Guo","orcid":"https://orcid.org/0000-0002-8399-1799"},"institutions":[{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]},{"id":"https://openalex.org/I2799413724","display_name":"Singapore Science Park","ror":"https://ror.org/0023asr12","country_code":"SG","type":"archive","lineage":["https://openalex.org/I2799413724"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Q. Guo","raw_affiliation_strings":["Institute of Microelectronics, Singapore Science Park II, Singapore 117685","Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park II, Singapore 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080108490","display_name":"Yi Su","orcid":"https://orcid.org/0000-0001-5345-7184"},"institutions":[{"id":"https://openalex.org/I2799413724","display_name":"Singapore Science Park","ror":"https://ror.org/0023asr12","country_code":"SG","type":"archive","lineage":["https://openalex.org/I2799413724"]},{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Y.J Su","raw_affiliation_strings":["Institute of Microelectronics, Singapore Science Park II, Singapore 117685","Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park II, Singapore 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112010775","display_name":"P.D. Foo","orcid":null},"institutions":[{"id":"https://openalex.org/I2799413724","display_name":"Singapore Science Park","ror":"https://ror.org/0023asr12","country_code":"SG","type":"archive","lineage":["https://openalex.org/I2799413724"]},{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"P.D. Foo","raw_affiliation_strings":["Institute of Microelectronics, Singapore Science Park II, Singapore 117685","Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park II, Singapore 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, Singapore Science Park-II, Singapore, 117685","institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5101755761"],"corresponding_institution_ids":["https://openalex.org/I2799413724","https://openalex.org/I4210090209"],"apc_list":{"value":2370,"currency":"USD","value_usd":2370},"apc_paid":null,"fwci":0.6158,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.62402188,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"34","issue":"2","first_page":"109","last_page":"113"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9891999959945679,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9815000295639038,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.8494161367416382},{"id":"https://openalex.org/keywords/copper-interconnect","display_name":"Copper interconnect","score":0.8398898243904114},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6603227853775024},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.647435188293457},{"id":"https://openalex.org/keywords/residue","display_name":"Residue (chemistry)","score":0.4160209596157074},{"id":"https://openalex.org/keywords/curing","display_name":"Curing (chemistry)","score":0.41327089071273804},{"id":"https://openalex.org/keywords/chemical-engineering","display_name":"Chemical engineering","score":0.35074254870414734},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.29966914653778076},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.26076725125312805},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.2602795958518982},{"id":"https://openalex.org/keywords/organic-chemistry","display_name":"Organic chemistry","score":0.10767737030982971}],"concepts":[{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.8494161367416382},{"id":"https://openalex.org/C116372231","wikidata":"https://www.wikidata.org/wiki/Q605757","display_name":"Copper interconnect","level":3,"score":0.8398898243904114},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6603227853775024},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.647435188293457},{"id":"https://openalex.org/C2781338088","wikidata":"https://www.wikidata.org/wiki/Q903495","display_name":"Residue (chemistry)","level":2,"score":0.4160209596157074},{"id":"https://openalex.org/C132976073","wikidata":"https://www.wikidata.org/wiki/Q2991861","display_name":"Curing (chemistry)","level":2,"score":0.41327089071273804},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.35074254870414734},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.29966914653778076},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.26076725125312805},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.2602795958518982},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.10767737030982971},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/s0026-2692(02)00154-4","is_oa":false,"landing_page_url":"https://doi.org/10.1016/s0026-2692(02)00154-4","pdf_url":null,"source":{"id":"https://openalex.org/S98831239","display_name":"Microelectronics Journal","issn_l":"1879-2391","issn":["1879-2391"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Journal","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/6","display_name":"Clean water and sanitation","score":0.5099999904632568}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2153877810"],"related_works":["https://openalex.org/W2546194799","https://openalex.org/W2130273821","https://openalex.org/W2474198271","https://openalex.org/W2477746199","https://openalex.org/W2091064386","https://openalex.org/W2163884646","https://openalex.org/W1965928658","https://openalex.org/W4255525795","https://openalex.org/W1834622852","https://openalex.org/W1994416434"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}