{"id":"https://openalex.org/W2791857094","doi":"https://doi.org/10.1016/j.microrel.2018.02.024","title":"Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables","display_name":"Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables","publication_year":2018,"publication_date":"2018-03-20","ids":{"openalex":"https://openalex.org/W2791857094","doi":"https://doi.org/10.1016/j.microrel.2018.02.024","mag":"2791857094"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2018.02.024","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2018.02.024","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://eprints.nottingham.ac.uk/51681/","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"P. Rajaguru","orcid":"https://orcid.org/0000-0003-1657-6584"},"institutions":[{"id":"https://openalex.org/I55060895","display_name":"University of Greenwich","ror":"https://ror.org/00bmj0a71","country_code":"GB","type":"education","lineage":["https://openalex.org/I55060895"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"P. Rajaguru","raw_affiliation_strings":["Computational Mechanics and Reliability Group, University of Greenwich, London, United Kingdom"],"raw_orcid":"https://orcid.org/0000-0003-1657-6584","affiliations":[{"raw_affiliation_string":"Computational Mechanics and Reliability Group, University of Greenwich, London, United Kingdom","institution_ids":["https://openalex.org/I55060895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102837305","display_name":"Hua Lu","orcid":"https://orcid.org/0000-0002-4392-6562"},"institutions":[{"id":"https://openalex.org/I55060895","display_name":"University of Greenwich","ror":"https://ror.org/00bmj0a71","country_code":"GB","type":"education","lineage":["https://openalex.org/I55060895"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"H. Lu","raw_affiliation_strings":["Computational Mechanics and Reliability Group, University of Greenwich, London, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computational Mechanics and Reliability Group, University of Greenwich, London, United Kingdom","institution_ids":["https://openalex.org/I55060895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060460052","display_name":"C. Bailey","orcid":"https://orcid.org/0000-0002-9438-3879"},"institutions":[{"id":"https://openalex.org/I55060895","display_name":"University of Greenwich","ror":"https://ror.org/00bmj0a71","country_code":"GB","type":"education","lineage":["https://openalex.org/I55060895"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"C. Bailey","raw_affiliation_strings":["Computational Mechanics and Reliability Group, University of Greenwich, London, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computational Mechanics and Reliability Group, University of Greenwich, London, United Kingdom","institution_ids":["https://openalex.org/I55060895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056248361","display_name":"Alberto Castellazzi","orcid":"https://orcid.org/0000-0003-0079-3293"},"institutions":[{"id":"https://openalex.org/I142263535","display_name":"University of Nottingham","ror":"https://ror.org/01ee9ar58","country_code":"GB","type":"education","lineage":["https://openalex.org/I142263535"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"A. Castellazzi","raw_affiliation_strings":["Power Electronics, Machines and Control Group, University of Nottingham, Nottingham, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Power Electronics, Machines and Control Group, University of Nottingham, Nottingham, United Kingdom","institution_ids":["https://openalex.org/I142263535"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079949715","display_name":"V. Pathirana","orcid":"https://orcid.org/0000-0001-8188-9232"},"institutions":[{"id":"https://openalex.org/I241749","display_name":"University of Cambridge","ror":"https://ror.org/013meh722","country_code":"GB","type":"education","lineage":["https://openalex.org/I241749"]},{"id":"https://openalex.org/I4210115950","display_name":"Cambridge Microelectronics (United Kingdom)","ror":"https://ror.org/01j8bzd71","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210115950"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"V. Pathirana","raw_affiliation_strings":["University of Cambridge, Cambridge Microelectronics Ltd, Cambridge, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cambridge, Cambridge Microelectronics Ltd, Cambridge, United Kingdom","institution_ids":["https://openalex.org/I4210115950","https://openalex.org/I241749"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006316510","display_name":"N. Udugampola","orcid":"https://orcid.org/0000-0001-7806-677X"},"institutions":[{"id":"https://openalex.org/I241749","display_name":"University of Cambridge","ror":"https://ror.org/013meh722","country_code":"GB","type":"education","lineage":["https://openalex.org/I241749"]},{"id":"https://openalex.org/I4210115950","display_name":"Cambridge Microelectronics (United Kingdom)","ror":"https://ror.org/01j8bzd71","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210115950"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"N. Udugampola","raw_affiliation_strings":["University of Cambridge, Cambridge Microelectronics Ltd, Cambridge, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cambridge, Cambridge Microelectronics Ltd, Cambridge, United Kingdom","institution_ids":["https://openalex.org/I4210115950","https://openalex.org/I241749"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5066534887","display_name":"Florin Udrea","orcid":"https://orcid.org/0000-0002-7288-3370"},"institutions":[{"id":"https://openalex.org/I241749","display_name":"University of Cambridge","ror":"https://ror.org/013meh722","country_code":"GB","type":"education","lineage":["https://openalex.org/I241749"]},{"id":"https://openalex.org/I4210115950","display_name":"Cambridge Microelectronics (United Kingdom)","ror":"https://ror.org/01j8bzd71","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210115950"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"F. Udrea","raw_affiliation_strings":["University of Cambridge, Cambridge Microelectronics Ltd, Cambridge, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cambridge, Cambridge Microelectronics Ltd, Cambridge, United Kingdom","institution_ids":["https://openalex.org/I4210115950","https://openalex.org/I241749"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I55060895"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.02171962,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":"83","issue":null,"first_page":"146","last_page":"156"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.7381800413131714},{"id":"https://openalex.org/keywords/insulated-gate-bipolar-transistor","display_name":"Insulated-gate bipolar transistor","score":0.6395896673202515},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6267623901367188},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6259638667106628},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.5972700119018555},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5812313556671143},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.46499955654144287},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.44955217838287354},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.4363994598388672},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.43364930152893066},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3628082275390625},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.32214289903640747},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20930927991867065},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.11159354448318481},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.10194465517997742},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.08375364542007446},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.08014509081840515}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.7381800413131714},{"id":"https://openalex.org/C28285623","wikidata":"https://www.wikidata.org/wiki/Q176110","display_name":"Insulated-gate bipolar transistor","level":3,"score":0.6395896673202515},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6267623901367188},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6259638667106628},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5972700119018555},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5812313556671143},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.46499955654144287},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.44955217838287354},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4363994598388672},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.43364930152893066},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3628082275390625},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.32214289903640747},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20930927991867065},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.11159354448318481},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10194465517997742},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.08375364542007446},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.08014509081840515},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1016/j.microrel.2018.02.024","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2018.02.024","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},{"id":"pmh:oai:gala.gre.ac.uk:4123","is_oa":false,"landing_page_url":null,"pdf_url":null,"source":{"id":"https://openalex.org/S4306401244","display_name":"Greenwich Academic Literature Archive (University of Greenwich)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I55060895","host_organization_name":"University of Greenwich","host_organization_lineage":["https://openalex.org/I55060895"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"","raw_type":"Article"},{"id":"pmh:oai:eprints.nottingham.ac.uk:51681","is_oa":true,"landing_page_url":"http://eprints.nottingham.ac.uk/51681/","pdf_url":null,"source":{"id":"https://openalex.org/S4306402013","display_name":"Nottingham ePrints (University of Nottingham)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I142263535","host_organization_name":"University of Nottingham","host_organization_lineage":["https://openalex.org/I142263535"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"},{"id":"pmh:oai:nottingham-repository.worktribe.com:929947","is_oa":true,"landing_page_url":"https://nottingham-repository.worktribe.com/output/929947","pdf_url":null,"source":{"id":"https://openalex.org/S4306402483","display_name":"Repository@Nottingham (University of Nottingham)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I142263535","host_organization_name":"University of Nottingham","host_organization_lineage":["https://openalex.org/I142263535"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Journal Article"}],"best_oa_location":{"id":"pmh:oai:eprints.nottingham.ac.uk:51681","is_oa":true,"landing_page_url":"http://eprints.nottingham.ac.uk/51681/","pdf_url":null,"source":{"id":"https://openalex.org/S4306402013","display_name":"Nottingham ePrints (University of Nottingham)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I142263535","host_organization_name":"University of Nottingham","host_organization_lineage":["https://openalex.org/I142263535"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8199999928474426,"id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G3201286531","display_name":null,"funder_award_id":"EP/K035304/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"},{"id":"https://openalex.org/G324759819","display_name":null,"funder_award_id":"EP/L007010/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"},{"id":"https://openalex.org/G5529577317","display_name":"Underpinning Power Electronics 2012: Hub","funder_award_id":"EP/K035304/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"}],"funders":[{"id":"https://openalex.org/F4320334627","display_name":"Engineering and Physical Sciences Research Council","ror":"https://ror.org/0439y7842"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1764928133","https://openalex.org/W1971528004","https://openalex.org/W1987466081","https://openalex.org/W2003688086","https://openalex.org/W2008499862","https://openalex.org/W2031534830","https://openalex.org/W2070688518","https://openalex.org/W2072620509","https://openalex.org/W2086541482","https://openalex.org/W2088309369","https://openalex.org/W2094009285","https://openalex.org/W2109364787","https://openalex.org/W2112998659","https://openalex.org/W2154867083","https://openalex.org/W2162041926","https://openalex.org/W2165549046","https://openalex.org/W2325476654","https://openalex.org/W2495045225","https://openalex.org/W2581883625","https://openalex.org/W2753011923","https://openalex.org/W4232303077","https://openalex.org/W4248984769","https://openalex.org/W4253524291","https://openalex.org/W4292864963","https://openalex.org/W6643005886","https://openalex.org/W6652304802","https://openalex.org/W6668338273","https://openalex.org/W6676058556","https://openalex.org/W6677165926","https://openalex.org/W6723482406"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W4232272518","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2046757767","https://openalex.org/W2086209657","https://openalex.org/W1018338587","https://openalex.org/W4251140533"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":3},{"year":2022,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2018-03-29T00:00:00"}