{"id":"https://openalex.org/W2601372870","doi":"https://doi.org/10.1016/j.microrel.2017.03.022","title":"Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board","display_name":"Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board","publication_year":2017,"publication_date":"2017-03-29","ids":{"openalex":"https://openalex.org/W2601372870","doi":"https://doi.org/10.1016/j.microrel.2017.03.022","mag":"2601372870"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2017.03.022","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2017.03.022","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080839422","display_name":"Chong Hooi Lim","orcid":"https://orcid.org/0000-0002-9930-3823"},"institutions":[{"id":"https://openalex.org/I139322472","display_name":"Universiti Sains Malaysia","ror":"https://ror.org/02rgb2k63","country_code":"MY","type":"education","lineage":["https://openalex.org/I139322472"]}],"countries":["MY"],"is_corresponding":true,"raw_author_name":"C.H. Lim","raw_affiliation_strings":["School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia","institution_ids":["https://openalex.org/I139322472"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033707489","display_name":"M.Z. Abdullah","orcid":"https://orcid.org/0000-0002-5353-6162"},"institutions":[{"id":"https://openalex.org/I139322472","display_name":"Universiti Sains Malaysia","ror":"https://ror.org/02rgb2k63","country_code":"MY","type":"education","lineage":["https://openalex.org/I139322472"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"M.Z. Abdullah","raw_affiliation_strings":["School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia","institution_ids":["https://openalex.org/I139322472"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111734977","display_name":"Ishak Abdul Azid","orcid":null},"institutions":[{"id":"https://openalex.org/I4528857","display_name":"University of Kuala Lumpur","ror":"https://ror.org/026wwrx19","country_code":"MY","type":"education","lineage":["https://openalex.org/I4528857"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"I.A. Azid","raw_affiliation_strings":["Mechanical Section, Universiti Kuala Lumpur Malaysian Spanish Institute, Kulim Hi-TechPark, 09000 Kulim, Kedah, Malaysia"],"affiliations":[{"raw_affiliation_string":"Mechanical Section, Universiti Kuala Lumpur Malaysian Spanish Institute, Kulim Hi-TechPark, 09000 Kulim, Kedah, Malaysia","institution_ids":["https://openalex.org/I4528857"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5057810377","display_name":"Mohd Sharizal Abdul Aziz","orcid":"https://orcid.org/0000-0002-3271-9242"},"institutions":[{"id":"https://openalex.org/I139322472","display_name":"Universiti Sains Malaysia","ror":"https://ror.org/02rgb2k63","country_code":"MY","type":"education","lineage":["https://openalex.org/I139322472"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"M.S. Abdul Aziz","raw_affiliation_strings":["School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia","institution_ids":["https://openalex.org/I139322472"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5080839422"],"corresponding_institution_ids":["https://openalex.org/I139322472"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.0164,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.76827163,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"72","issue":null,"first_page":"5","last_page":"17"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12206","display_name":"Vibration and Dynamic Analysis","score":0.9764999747276306,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12206","display_name":"Vibration and Dynamic Analysis","score":0.9764999747276306,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.9739999771118164,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11595","display_name":"Textile materials and evaluations","score":0.973800003528595,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.7566033601760864},{"id":"https://openalex.org/keywords/deflection","display_name":"Deflection (physics)","score":0.6794763803482056},{"id":"https://openalex.org/keywords/fluent","display_name":"Fluent","score":0.5967531204223633},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5260643362998962},{"id":"https://openalex.org/keywords/computational-fluid-dynamics","display_name":"Computational fluid dynamics","score":0.5166590213775635},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"Flexible electronics","score":0.48861104249954224},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.46928155422210693},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.4322393834590912},{"id":"https://openalex.org/keywords/computer-simulation","display_name":"Computer simulation","score":0.41319596767425537},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.35603201389312744},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.34065482020378113},{"id":"https://openalex.org/keywords/simulation","display_name":"Simulation","score":0.3128712773323059},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23403817415237427},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.15631002187728882},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.14463943243026733},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.08813360333442688},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0852106511592865}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7566033601760864},{"id":"https://openalex.org/C2781355719","wikidata":"https://www.wikidata.org/wiki/Q2080698","display_name":"Deflection (physics)","level":2,"score":0.6794763803482056},{"id":"https://openalex.org/C2780411076","wikidata":"https://www.wikidata.org/wiki/Q5462653","display_name":"Fluent","level":3,"score":0.5967531204223633},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5260643362998962},{"id":"https://openalex.org/C1633027","wikidata":"https://www.wikidata.org/wiki/Q815820","display_name":"Computational fluid dynamics","level":2,"score":0.5166590213775635},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.48861104249954224},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.46928155422210693},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4322393834590912},{"id":"https://openalex.org/C500300565","wikidata":"https://www.wikidata.org/wiki/Q925667","display_name":"Computer simulation","level":2,"score":0.41319596767425537},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.35603201389312744},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34065482020378113},{"id":"https://openalex.org/C44154836","wikidata":"https://www.wikidata.org/wiki/Q45045","display_name":"Simulation","level":1,"score":0.3128712773323059},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23403817415237427},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.15631002187728882},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.14463943243026733},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.08813360333442688},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0852106511592865},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2017.03.022","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2017.03.022","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8399999737739563,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321147","display_name":"Ministry of Higher Education","ror":"https://ror.org/0512bh102"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":33,"referenced_works":["https://openalex.org/W1767070283","https://openalex.org/W1970425441","https://openalex.org/W1972654804","https://openalex.org/W1977994081","https://openalex.org/W1978400550","https://openalex.org/W1979176388","https://openalex.org/W1988291931","https://openalex.org/W1993717547","https://openalex.org/W2004092245","https://openalex.org/W2012070828","https://openalex.org/W2019613500","https://openalex.org/W2022690816","https://openalex.org/W2028126674","https://openalex.org/W2033522982","https://openalex.org/W2036839466","https://openalex.org/W2045497399","https://openalex.org/W2046305519","https://openalex.org/W2054235832","https://openalex.org/W2063064440","https://openalex.org/W2076581894","https://openalex.org/W2077292447","https://openalex.org/W2092673750","https://openalex.org/W2094800097","https://openalex.org/W2115455177","https://openalex.org/W2118073664","https://openalex.org/W2121372662","https://openalex.org/W2153884005","https://openalex.org/W2170630110","https://openalex.org/W2181686924","https://openalex.org/W2513912255","https://openalex.org/W2540745597","https://openalex.org/W4251532619","https://openalex.org/W6685923581"],"related_works":["https://openalex.org/W1975509756","https://openalex.org/W2122379732","https://openalex.org/W1916213107","https://openalex.org/W2359189194","https://openalex.org/W567677580","https://openalex.org/W2117825347","https://openalex.org/W3118337685","https://openalex.org/W2046583344","https://openalex.org/W2102024339","https://openalex.org/W2024808593"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}