{"id":"https://openalex.org/W2293394156","doi":"https://doi.org/10.1016/j.microrel.2016.03.005","title":"Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn\u20133.0Ag\u20130.5Cu solder joints","display_name":"Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn\u20133.0Ag\u20130.5Cu solder joints","publication_year":2016,"publication_date":"2016-03-10","ids":{"openalex":"https://openalex.org/W2293394156","doi":"https://doi.org/10.1016/j.microrel.2016.03.005","mag":"2293394156"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2016.03.005","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2016.03.005","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101514885","display_name":"Zhenyu Zhao","orcid":"https://orcid.org/0000-0002-5025-5576"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhenyu Zhao","raw_affiliation_strings":["Department of Mechanical Engineering, State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100349537","display_name":"Lei Liu","orcid":"https://orcid.org/0000-0002-2385-9956"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Lei Liu","raw_affiliation_strings":["Department of Mechanical Engineering, State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103149113","display_name":"Hyun Seok Choi","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyun Seok Choi","raw_affiliation_strings":["Samsung Electronics Co. Ltd, Asan-City, Chungnam 336711, Republic of Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics Co. Ltd, Asan-City, Chungnam 336711, Republic of Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101425174","display_name":"Jian Cai","orcid":"https://orcid.org/0000-0003-3940-6991"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jian Cai","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing 100084, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing 100084, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100718843","display_name":"Qian Wang","orcid":"https://orcid.org/0000-0002-8855-5371"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qian Wang","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing 100084, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing 100084, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030863313","display_name":"Yuming Wang","orcid":"https://orcid.org/0000-0002-1602-6868"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuming Wang","raw_affiliation_strings":["Training Center for Basic Industry, Tsinghua University, Beijing 100084, China"],"affiliations":[{"raw_affiliation_string":"Training Center for Basic Industry, Tsinghua University, Beijing 100084, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113541640","display_name":"Guisheng Zou","orcid":"https://orcid.org/0009-0003-8501-0370"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Guisheng Zou","raw_affiliation_strings":["Department of Mechanical Engineering, State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5100349537","https://openalex.org/A5113541640"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.8642,"has_fulltext":false,"cited_by_count":26,"citation_normalized_percentile":{"value":0.86374648,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"60","issue":null,"first_page":"126","last_page":"134"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10717","display_name":"Aluminum Alloys Composites Properties","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.9222539663314819},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8570350408554077},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.8249152898788452},{"id":"https://openalex.org/keywords/eutectic-system","display_name":"Eutectic system","score":0.7998883724212646},{"id":"https://openalex.org/keywords/nano","display_name":"Nano-","score":0.6249444484710693},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.6109182834625244},{"id":"https://openalex.org/keywords/wetting","display_name":"Wetting","score":0.60749351978302},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5263765454292297},{"id":"https://openalex.org/keywords/nanoparticle","display_name":"Nanoparticle","score":0.48231029510498047},{"id":"https://openalex.org/keywords/reinforcement","display_name":"Reinforcement","score":0.48041558265686035},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.4522949457168579},{"id":"https://openalex.org/keywords/grain-size","display_name":"Grain size","score":0.4498327672481537},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.10601204633712769}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.9222539663314819},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8570350408554077},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.8249152898788452},{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.7998883724212646},{"id":"https://openalex.org/C2780357685","wikidata":"https://www.wikidata.org/wiki/Q154357","display_name":"Nano-","level":2,"score":0.6249444484710693},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6109182834625244},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.60749351978302},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5263765454292297},{"id":"https://openalex.org/C155672457","wikidata":"https://www.wikidata.org/wiki/Q61231","display_name":"Nanoparticle","level":2,"score":0.48231029510498047},{"id":"https://openalex.org/C67203356","wikidata":"https://www.wikidata.org/wiki/Q1321905","display_name":"Reinforcement","level":2,"score":0.48041558265686035},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4522949457168579},{"id":"https://openalex.org/C192191005","wikidata":"https://www.wikidata.org/wiki/Q466491","display_name":"Grain size","level":2,"score":0.4498327672481537},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.10601204633712769},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2016.03.005","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2016.03.005","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G336152610","display_name":null,"funder_award_id":"AWJ-M14-05","funder_id":"https://openalex.org/F4320321940","funder_display_name":"Harbin Institute of Technology"},{"id":"https://openalex.org/G3438027810","display_name":null,"funder_award_id":"51520105007 51405258","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321940","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":32,"referenced_works":["https://openalex.org/W1968459445","https://openalex.org/W1972826144","https://openalex.org/W1978460966","https://openalex.org/W1984168419","https://openalex.org/W1985662878","https://openalex.org/W1994917532","https://openalex.org/W2002866051","https://openalex.org/W2010711742","https://openalex.org/W2025122868","https://openalex.org/W2030359624","https://openalex.org/W2035351237","https://openalex.org/W2046635574","https://openalex.org/W2047585911","https://openalex.org/W2052122949","https://openalex.org/W2057516257","https://openalex.org/W2062149841","https://openalex.org/W2065624114","https://openalex.org/W2077691330","https://openalex.org/W2080868759","https://openalex.org/W2083665903","https://openalex.org/W2100565609","https://openalex.org/W2122965286","https://openalex.org/W2124489736","https://openalex.org/W2161850268","https://openalex.org/W2164796016","https://openalex.org/W2460142124","https://openalex.org/W2461419281","https://openalex.org/W2464366157","https://openalex.org/W3043958734","https://openalex.org/W6678547855","https://openalex.org/W6683741025","https://openalex.org/W6684329819"],"related_works":["https://openalex.org/W2046959048","https://openalex.org/W2347920837","https://openalex.org/W2005590182","https://openalex.org/W2061892882","https://openalex.org/W2015138313","https://openalex.org/W2366020510","https://openalex.org/W2489329031","https://openalex.org/W2093454725","https://openalex.org/W2567931383","https://openalex.org/W2063425262"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":5},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2026-03-26T15:22:09.906841","created_date":"2025-10-10T00:00:00"}