{"id":"https://openalex.org/W1982119458","doi":"https://doi.org/10.1016/j.microrel.2006.02.017","title":"Inkjettable conductive adhesive for use in microelectronics and microsystems technology","display_name":"Inkjettable conductive adhesive for use in microelectronics and microsystems technology","publication_year":2006,"publication_date":"2006-05-09","ids":{"openalex":"https://openalex.org/W1982119458","doi":"https://doi.org/10.1016/j.microrel.2006.02.017","mag":"1982119458"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2006.02.017","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2006.02.017","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081366572","display_name":"Jana Kolbe","orcid":null},"institutions":[{"id":"https://openalex.org/I4210134580","display_name":"Fraunhofer Institute for Manufacturing Technology and Advanced Materials","ror":"https://ror.org/03pwyy961","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134580","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jana Kolbe","raw_affiliation_strings":["IFAM \u2013 Fraunhofer Institut fuer Fertigungstechnik und Angewandte Materialforschung, Klebtechnik und Oberflaechen, Wiener Strasse 12, D-28359 Bremen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IFAM \u2013 Fraunhofer Institut fuer Fertigungstechnik und Angewandte Materialforschung, Klebtechnik und Oberflaechen, Wiener Strasse 12, D-28359 Bremen, Germany","institution_ids":["https://openalex.org/I4210134580"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059748983","display_name":"A. Arp","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Andreas Arp","raw_affiliation_strings":["Microdrop Technologies Muehlenweg 143, D-22844 Norderstedt, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microdrop Technologies Muehlenweg 143, D-22844 Norderstedt, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030891261","display_name":"Francesco Calderone","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Francesco Calderone","raw_affiliation_strings":["Metalor Technologies SA, Avenue du Vignoble, CH-2009 Neuch\u00e2tel, Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Metalor Technologies SA, Avenue du Vignoble, CH-2009 Neuch\u00e2tel, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077360936","display_name":"\u00c9douard Marc Meyer","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Edouard Marc Meyer","raw_affiliation_strings":["Metalor Technologies SA, Avenue du Vignoble, CH-2009 Neuch\u00e2tel, Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Metalor Technologies SA, Avenue du Vignoble, CH-2009 Neuch\u00e2tel, Switzerland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078577367","display_name":"Wilhelm Meyer","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Wilhelm Meyer","raw_affiliation_strings":["Microdrop Technologies Muehlenweg 143, D-22844 Norderstedt, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microdrop Technologies Muehlenweg 143, D-22844 Norderstedt, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"Helmut Schaefer","orcid":null},"institutions":[{"id":"https://openalex.org/I4210134580","display_name":"Fraunhofer Institute for Manufacturing Technology and Advanced Materials","ror":"https://ror.org/03pwyy961","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134580","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Helmut Schaefer","raw_affiliation_strings":["IFAM \u2013 Fraunhofer Institut fuer Fertigungstechnik und Angewandte Materialforschung, Klebtechnik und Oberflaechen, Wiener Strasse 12, D-28359 Bremen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IFAM \u2013 Fraunhofer Institut fuer Fertigungstechnik und Angewandte Materialforschung, Klebtechnik und Oberflaechen, Wiener Strasse 12, D-28359 Bremen, Germany","institution_ids":["https://openalex.org/I4210134580"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006069695","display_name":"Manuela Stuve","orcid":null},"institutions":[{"id":"https://openalex.org/I4210134580","display_name":"Fraunhofer Institute for Manufacturing Technology and Advanced Materials","ror":"https://ror.org/03pwyy961","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134580","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Manuela Stuve","raw_affiliation_strings":["IFAM \u2013 Fraunhofer Institut fuer Fertigungstechnik und Angewandte Materialforschung, Klebtechnik und Oberflaechen, Wiener Strasse 12, D-28359 Bremen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IFAM \u2013 Fraunhofer Institut fuer Fertigungstechnik und Angewandte Materialforschung, Klebtechnik und Oberflaechen, Wiener Strasse 12, D-28359 Bremen, Germany","institution_ids":["https://openalex.org/I4210134580"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":3.8343,"has_fulltext":false,"cited_by_count":34,"citation_normalized_percentile":{"value":0.92761271,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"47","issue":"2-3","first_page":"331","last_page":"334"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9793999791145325,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9657999873161316,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.8996655344963074},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8653066754341125},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.7018465995788574},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.681353747844696},{"id":"https://openalex.org/keywords/curing","display_name":"Curing (chemistry)","score":0.6446715593338013},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.6369421482086182},{"id":"https://openalex.org/keywords/conductive-ink","display_name":"Conductive ink","score":0.6209024786949158},{"id":"https://openalex.org/keywords/inkwell","display_name":"Inkwell","score":0.502424955368042},{"id":"https://openalex.org/keywords/wetting","display_name":"Wetting","score":0.5018181800842285},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3689553141593933},{"id":"https://openalex.org/keywords/sheet-resistance","display_name":"Sheet resistance","score":0.10528677701950073}],"concepts":[{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.8996655344963074},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8653066754341125},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.7018465995788574},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.681353747844696},{"id":"https://openalex.org/C132976073","wikidata":"https://www.wikidata.org/wiki/Q2991861","display_name":"Curing (chemistry)","level":2,"score":0.6446715593338013},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.6369421482086182},{"id":"https://openalex.org/C2777892344","wikidata":"https://www.wikidata.org/wiki/Q5159386","display_name":"Conductive ink","level":4,"score":0.6209024786949158},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.502424955368042},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.5018181800842285},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3689553141593933},{"id":"https://openalex.org/C66825105","wikidata":"https://www.wikidata.org/wiki/Q354718","display_name":"Sheet resistance","level":3,"score":0.10528677701950073},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1016/j.microrel.2006.02.017","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2006.02.017","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},{"id":"pmh:oai:fraunhofer.de:N-60612","is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-60612.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer IFAM","raw_type":"Journal Article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/213036","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/213036","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"journal article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2143446069"],"related_works":["https://openalex.org/W2392889640","https://openalex.org/W2591709806","https://openalex.org/W3139677296","https://openalex.org/W1981851990","https://openalex.org/W2785936272","https://openalex.org/W2076314072","https://openalex.org/W3183808962","https://openalex.org/W2043696621","https://openalex.org/W2357946863","https://openalex.org/W4378445992"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":3},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":4}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2016-06-24T00:00:00"}