{"id":"https://openalex.org/W7160546367","doi":"https://doi.org/10.1016/j.mejo.2026.107239","title":"An efficient modeling method for signal integrity analysis: Facing multi-dielectric-layer 2.5D integration","display_name":"An efficient modeling method for signal integrity analysis: Facing multi-dielectric-layer 2.5D integration","publication_year":2026,"publication_date":"2026-05-07","ids":{"openalex":"https://openalex.org/W7160546367","doi":"https://doi.org/10.1016/j.mejo.2026.107239"},"language":"en","primary_location":{"id":"doi:10.1016/j.mejo.2026.107239","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mejo.2026.107239","pdf_url":null,"source":{"id":"https://openalex.org/S98831239","display_name":"Microelectronics Journal","issn_l":"1879-2391","issn":["1879-2391"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Journal","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5042237918","display_name":"Yanlin Zhu","orcid":"https://orcid.org/0000-0003-0044-9433"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]},{"id":"https://openalex.org/I4210153682","display_name":"Intelligent Health (United Kingdom)","ror":"https://ror.org/0576zak10","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210153682"]}],"countries":["CN","GB"],"is_corresponding":false,"raw_author_name":"Yanlin Zhu","raw_affiliation_strings":["School of Microelectronics, Tianjin University, Tianjin, 300072, China","State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University, Tianjin, 300072, China","institution_ids":["https://openalex.org/I162868743"]},{"raw_affiliation_string":"State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","institution_ids":["https://openalex.org/I4210153682"]},{"raw_affiliation_string":"Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","institution_ids":[]},{"raw_affiliation_string":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5135581626","display_name":"Yongtao Ma","orcid":null},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]},{"id":"https://openalex.org/I4210153682","display_name":"Intelligent Health (United Kingdom)","ror":"https://ror.org/0576zak10","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210153682"]}],"countries":["CN","GB"],"is_corresponding":true,"raw_author_name":"Yongtao Ma","raw_affiliation_strings":["School of Microelectronics, Tianjin University, Tianjin, 300072, China","State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University, Tianjin, 300072, China","institution_ids":["https://openalex.org/I162868743"]},{"raw_affiliation_string":"State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","institution_ids":["https://openalex.org/I4210153682"]},{"raw_affiliation_string":"Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","institution_ids":[]},{"raw_affiliation_string":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5135581921","display_name":"Xiaolin Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]},{"id":"https://openalex.org/I4210112130","display_name":"Tianjin International Joint Academy of Biomedicine","ror":"https://ror.org/01v11cc68","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210112130"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaolin Wang","raw_affiliation_strings":["International Joint Institute of Tianjin University, Fuzhou, 300072, China","School of Microelectronics, Tianjin University, Tianjin, 300072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"International Joint Institute of Tianjin University, Fuzhou, 300072, China","institution_ids":["https://openalex.org/I4210112130"]},{"raw_affiliation_string":"School of Microelectronics, Tianjin University, Tianjin, 300072, China","institution_ids":["https://openalex.org/I162868743"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009153078","display_name":"Leyang Li","orcid":"https://orcid.org/0000-0001-9566-4501"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]},{"id":"https://openalex.org/I4210153682","display_name":"Intelligent Health (United Kingdom)","ror":"https://ror.org/0576zak10","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210153682"]}],"countries":["CN","GB"],"is_corresponding":false,"raw_author_name":"Leyang Li","raw_affiliation_strings":["School of Microelectronics, Tianjin University, Tianjin, 300072, China","State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University, Tianjin, 300072, China","institution_ids":["https://openalex.org/I162868743"]},{"raw_affiliation_string":"State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","institution_ids":["https://openalex.org/I4210153682"]},{"raw_affiliation_string":"Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","institution_ids":[]},{"raw_affiliation_string":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068548487","display_name":"Xuran Zhang","orcid":"https://orcid.org/0000-0003-1177-5189"},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]},{"id":"https://openalex.org/I4210153682","display_name":"Intelligent Health (United Kingdom)","ror":"https://ror.org/0576zak10","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210153682"]}],"countries":["CN","GB"],"is_corresponding":false,"raw_author_name":"Xuran Zhang","raw_affiliation_strings":["School of Microelectronics, Tianjin University, Tianjin, 300072, China","State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University, Tianjin, 300072, China","institution_ids":["https://openalex.org/I162868743"]},{"raw_affiliation_string":"State Key Laboratory of Advanced Materials for Intelligent Sensing, Tianjin, 300072, China","institution_ids":["https://openalex.org/I4210153682"]},{"raw_affiliation_string":"Tianjin Digital Information Technology Research Center, Tianjin, 300072, China","institution_ids":[]},{"raw_affiliation_string":"Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin, 300072, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5135584600","display_name":"Huan Yan","orcid":null},"institutions":[{"id":"https://openalex.org/I162868743","display_name":"Tianjin University","ror":"https://ror.org/012tb2g32","country_code":"CN","type":"education","lineage":["https://openalex.org/I162868743"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huan Yan","raw_affiliation_strings":["School of Microelectronics, Tianjin University, Tianjin, 300072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Tianjin University, Tianjin, 300072, China","institution_ids":["https://openalex.org/I162868743"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5135581626"],"corresponding_institution_ids":["https://openalex.org/I162868743","https://openalex.org/I4210153682"],"apc_list":{"value":2370,"currency":"USD","value_usd":2370},"apc_paid":null,"fwci":4.828,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.95511106,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":"174","issue":null,"first_page":"107239","last_page":"107239"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.7996000051498413,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.7996000051498413,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.16500000655651093,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.00559999980032444,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.7512000203132629},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6589000225067139},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5396000146865845},{"id":"https://openalex.org/keywords/sensitivity","display_name":"Sensitivity (control systems)","score":0.5022000074386597},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.49410000443458557},{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.4918999969959259},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.4569000005722046},{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.438400000333786},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4099000096321106},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.4050000011920929}],"concepts":[{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.7512000203132629},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.707099974155426},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6589000225067139},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5396000146865845},{"id":"https://openalex.org/C21200559","wikidata":"https://www.wikidata.org/wiki/Q7451068","display_name":"Sensitivity (control systems)","level":2,"score":0.5022000074386597},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.49410000443458557},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.4918999969959259},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.4569000005722046},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.45089998841285706},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.438400000333786},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4099000096321106},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4050000011920929},{"id":"https://openalex.org/C141490761","wikidata":"https://www.wikidata.org/wiki/Q5384728","display_name":"Equivalent series inductance","level":4,"score":0.39969998598098755},{"id":"https://openalex.org/C139945424","wikidata":"https://www.wikidata.org/wiki/Q1940696","display_name":"Mean squared error","level":2,"score":0.396699994802475},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.38929998874664307},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.3864000141620636},{"id":"https://openalex.org/C166501922","wikidata":"https://www.wikidata.org/wiki/Q1786523","display_name":"Signal-flow graph","level":2,"score":0.37139999866485596},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3619999885559082},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.3490000069141388},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.33880001306533813},{"id":"https://openalex.org/C2777561913","wikidata":"https://www.wikidata.org/wiki/Q19599527","display_name":"Power integrity","level":4,"score":0.328000009059906},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.3262999951839447},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.3246999979019165},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.31709998846054077},{"id":"https://openalex.org/C204323151","wikidata":"https://www.wikidata.org/wiki/Q905424","display_name":"Range (aeronautics)","level":2,"score":0.29910001158714294},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.29829999804496765},{"id":"https://openalex.org/C122383733","wikidata":"https://www.wikidata.org/wiki/Q865920","display_name":"Approximation error","level":2,"score":0.28139999508857727},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.2768999934196472},{"id":"https://openalex.org/C2781038218","wikidata":"https://www.wikidata.org/wiki/Q1773875","display_name":"Small-signal model","level":3,"score":0.27000001072883606},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.25589999556541443},{"id":"https://openalex.org/C4292930","wikidata":"https://www.wikidata.org/wiki/Q17009341","display_name":"Distributed element model","level":2,"score":0.2551000118255615}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.mejo.2026.107239","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mejo.2026.107239","pdf_url":null,"source":{"id":"https://openalex.org/S98831239","display_name":"Microelectronics Journal","issn_l":"1879-2391","issn":["1879-2391"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Journal","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W2117351545","https://openalex.org/W2160837841","https://openalex.org/W2801180791","https://openalex.org/W2890547595","https://openalex.org/W4312629419","https://openalex.org/W4385517483","https://openalex.org/W4385627237","https://openalex.org/W4385834382","https://openalex.org/W4389776630","https://openalex.org/W4399310878","https://openalex.org/W4399729212","https://openalex.org/W4401687419","https://openalex.org/W4402742572"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-06-14T06:11:07.267592","created_date":"2026-05-08T00:00:00"}