{"id":"https://openalex.org/W7161139319","doi":"https://doi.org/10.1016/j.displa.2026.103536","title":"A receiving tape etching scheme for high-yield bonding after direct laser mass transfer process of micro-LEDs","display_name":"A receiving tape etching scheme for high-yield bonding after direct laser mass transfer process of micro-LEDs","publication_year":2026,"publication_date":"2026-05-14","ids":{"openalex":"https://openalex.org/W7161139319","doi":"https://doi.org/10.1016/j.displa.2026.103536"},"language":"en","primary_location":{"id":"doi:10.1016/j.displa.2026.103536","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.displa.2026.103536","pdf_url":null,"source":{"id":"https://openalex.org/S191329154","display_name":"Displays","issn_l":"0141-9382","issn":["0141-9382","1872-7387"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Displays","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5136120505","display_name":"Zhu Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Zhu Yang","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136174113","display_name":"Wenya Tian","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Wenya Tian","raw_affiliation_strings":["BOE TECHNOLOGY GROUP CO., LTD, Beijing 100176, China","School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"BOE TECHNOLOGY GROUP CO., LTD, Beijing 100176, China","institution_ids":["https://openalex.org/I4210100976"]},{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136179195","display_name":"Jianxin Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]},{"id":"https://openalex.org/I4210133338","display_name":"Suzhou Academy of Agricultural Sciences","ror":"https://ror.org/03kcfmk89","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210133338"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Jianxin Wang","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","tesa Plant (Suzhou) Co., Ltd, Suzhou 215026, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]},{"raw_affiliation_string":"tesa Plant (Suzhou) Co., Ltd, Suzhou 215026, China","institution_ids":["https://openalex.org/I4210133338"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136176279","display_name":"Yang Shi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133338","display_name":"Suzhou Academy of Agricultural Sciences","ror":"https://ror.org/03kcfmk89","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210133338"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Shi","raw_affiliation_strings":["tesa Plant (Suzhou) Co., Ltd, Suzhou 215026, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"tesa Plant (Suzhou) Co., Ltd, Suzhou 215026, China","institution_ids":["https://openalex.org/I4210133338"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136138530","display_name":"Hao Fu","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Hao Fu","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079465474","display_name":"Haojie Zhou","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Haojie Zhou","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136153218","display_name":"Xinyi Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Xinyi Wang","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058818827","display_name":"Xiaoxiao Ji","orcid":"https://orcid.org/0009-0008-3446-9540"},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Xiaoxiao Ji","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136098513","display_name":"Yanlei Hu","orcid":null},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yanlei Hu","raw_affiliation_strings":["Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230026, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230026, China","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136150215","display_name":"Ming Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Chen","raw_affiliation_strings":["BOE TECHNOLOGY GROUP CO., LTD, Beijing 100176, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"BOE TECHNOLOGY GROUP CO., LTD, Beijing 100176, China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136159668","display_name":"Xiuzhen Lu","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Xiuzhen Lu","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5136177352","display_name":"Luqiao Yin","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":true,"raw_author_name":"Luqiao Yin","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5136180530","display_name":"Jianhua Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I113940042","display_name":"Shanghai University","ror":"https://ror.org/006teas31","country_code":"CN","type":"education","lineage":["https://openalex.org/I113940042"]},{"id":"https://openalex.org/I4210105785","display_name":"Intelligent Systems Research (United States)","ror":"https://ror.org/01reevc91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210105785"]}],"countries":["CN","US"],"is_corresponding":true,"raw_author_name":"Jianhua Zhang","raw_affiliation_strings":["School of Microelectronics, Shanghai University, Shanghai 201800, China","Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Shanghai University, Shanghai 201800, China","institution_ids":["https://openalex.org/I113940042"]},{"raw_affiliation_string":"Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle, Shanghai 201800, China","institution_ids":["https://openalex.org/I4210105785"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5136177352","https://openalex.org/A5136180530"],"corresponding_institution_ids":["https://openalex.org/I113940042","https://openalex.org/I4210105785"],"apc_list":{"value":2470,"currency":"USD","value_usd":2470},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.52753003,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"94","issue":null,"first_page":"103536","last_page":"103536"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.19930000603199005,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.19930000603199005,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.1988999992609024,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.1420000046491623,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.6638000011444092},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6200000047683716},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.5270000100135803},{"id":"https://openalex.org/keywords/direct-bonding","display_name":"Direct bonding","score":0.3758000135421753},{"id":"https://openalex.org/keywords/transfer","display_name":"Transfer (computing)","score":0.3741999864578247},{"id":"https://openalex.org/keywords/pulsed-laser","display_name":"Pulsed laser","score":0.36899998784065247}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.828499972820282},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6638000011444092},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6200000047683716},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5770999789237976},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.5270000100135803},{"id":"https://openalex.org/C2778071519","wikidata":"https://www.wikidata.org/wiki/Q5280309","display_name":"Direct bonding","level":3,"score":0.3758000135421753},{"id":"https://openalex.org/C2776175482","wikidata":"https://www.wikidata.org/wiki/Q1195816","display_name":"Transfer (computing)","level":2,"score":0.3741999864578247},{"id":"https://openalex.org/C2778979257","wikidata":"https://www.wikidata.org/wiki/Q15928349","display_name":"Pulsed laser","level":3,"score":0.36899998784065247},{"id":"https://openalex.org/C77618280","wikidata":"https://www.wikidata.org/wiki/Q1155772","display_name":"Scheme (mathematics)","level":2,"score":0.3644999861717224},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.33889999985694885},{"id":"https://openalex.org/C1291036","wikidata":"https://www.wikidata.org/wiki/Q1191918","display_name":"Dry etching","level":4,"score":0.3034999966621399},{"id":"https://openalex.org/C51038369","wikidata":"https://www.wikidata.org/wiki/Q909534","display_name":"Mass transfer","level":2,"score":0.2944999933242798},{"id":"https://openalex.org/C37982897","wikidata":"https://www.wikidata.org/wiki/Q901321","display_name":"Pulsed laser deposition","level":3,"score":0.29420000314712524},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2854999899864197},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.27619999647140503},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.2752000093460083},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.27399998903274536}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.displa.2026.103536","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.displa.2026.103536","pdf_url":null,"source":{"id":"https://openalex.org/S191329154","display_name":"Displays","issn_l":"0141-9382","issn":["0141-9382","1872-7387"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Displays","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5549073219299316,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W2024401254","https://openalex.org/W3036700343","https://openalex.org/W4224143507","https://openalex.org/W4289520671","https://openalex.org/W4291019959","https://openalex.org/W4296381452","https://openalex.org/W4315490537","https://openalex.org/W4376149125","https://openalex.org/W4383552833","https://openalex.org/W4385223416","https://openalex.org/W4385423108","https://openalex.org/W4389161283","https://openalex.org/W4389479757","https://openalex.org/W4402166103","https://openalex.org/W4403562505","https://openalex.org/W4403599979","https://openalex.org/W4403601497","https://openalex.org/W4406817248","https://openalex.org/W4410130499","https://openalex.org/W4411799350","https://openalex.org/W4416827830"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-06-14T06:11:07.267592","created_date":"2026-05-15T00:00:00"}