{"id":"https://openalex.org/W1583698741","doi":"https://doi.org/10.1016/b978-0-444-89465-6.50040-5","title":"CAPP for Die Cavity Machining","display_name":"CAPP for Die Cavity Machining","publication_year":1992,"publication_date":"1992-01-01","ids":{"openalex":"https://openalex.org/W1583698741","doi":"https://doi.org/10.1016/b978-0-444-89465-6.50040-5","mag":"1583698741"},"language":"en","primary_location":{"id":"doi:10.1016/b978-0-444-89465-6.50040-5","is_oa":false,"landing_page_url":"https://doi.org/10.1016/b978-0-444-89465-6.50040-5","pdf_url":null,"source":{"id":"https://openalex.org/S4306463230","display_name":"Elsevier eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Human Aspects in Computer Integrated Manufacturing","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5056082957","display_name":"Woo Sik Yoo","orcid":"https://orcid.org/0000-0002-1479-8450"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"W.S. Yoo","raw_affiliation_strings":["IE Dept, KAIST, P.O. Box 150 Cheongryang, Seoul, Korea"],"affiliations":[{"raw_affiliation_string":"IE Dept, KAIST, P.O. Box 150 Cheongryang, Seoul, Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5079185664","display_name":"Byoung-Chul Choi","orcid":"https://orcid.org/0000-0003-3553-3539"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"B.K. Choi","raw_affiliation_strings":["IE Dept, KAIST, P.O. Box 150 Cheongryang, Seoul, Korea"],"affiliations":[{"raw_affiliation_string":"IE Dept, KAIST, P.O. Box 150 Cheongryang, Seoul, Korea","institution_ids":["https://openalex.org/I157485424"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5056082957"],"corresponding_institution_ids":["https://openalex.org/I157485424"],"apc_list":null,"apc_paid":null,"fwci":2.3994,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.88247146,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"437","last_page":"447"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13113","display_name":"Engineering Technology and Methodologies","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/machining","display_name":"Machining","score":0.7446795701980591},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.6520036458969116},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.5911484956741333},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.5103854537010193},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.5086201429367065},{"id":"https://openalex.org/keywords/ball","display_name":"Ball (mathematics)","score":0.45478522777557373},{"id":"https://openalex.org/keywords/numerical-control","display_name":"Numerical control","score":0.43163567781448364},{"id":"https://openalex.org/keywords/block","display_name":"Block (permutation group theory)","score":0.4166914224624634},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3599158823490143},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.28597331047058105},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.11072564125061035}],"concepts":[{"id":"https://openalex.org/C523214423","wikidata":"https://www.wikidata.org/wiki/Q192047","display_name":"Machining","level":2,"score":0.7446795701980591},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.6520036458969116},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.5911484956741333},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5103854537010193},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.5086201429367065},{"id":"https://openalex.org/C122041747","wikidata":"https://www.wikidata.org/wiki/Q838611","display_name":"Ball (mathematics)","level":2,"score":0.45478522777557373},{"id":"https://openalex.org/C175457265","wikidata":"https://www.wikidata.org/wiki/Q190247","display_name":"Numerical control","level":3,"score":0.43163567781448364},{"id":"https://openalex.org/C2777210771","wikidata":"https://www.wikidata.org/wiki/Q4927124","display_name":"Block (permutation group theory)","level":2,"score":0.4166914224624634},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3599158823490143},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.28597331047058105},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.11072564125061035}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/b978-0-444-89465-6.50040-5","is_oa":false,"landing_page_url":"https://doi.org/10.1016/b978-0-444-89465-6.50040-5","pdf_url":null,"source":{"id":"https://openalex.org/S4306463230","display_name":"Elsevier eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Human Aspects in Computer Integrated Manufacturing","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1602986785","https://openalex.org/W2051756836","https://openalex.org/W2055217391","https://openalex.org/W2064923348","https://openalex.org/W2068630443","https://openalex.org/W2068734648","https://openalex.org/W4301911764","https://openalex.org/W6664384752","https://openalex.org/W6666408893","https://openalex.org/W6667852289"],"related_works":["https://openalex.org/W2042913821","https://openalex.org/W2372289614","https://openalex.org/W2629813803","https://openalex.org/W2041067810","https://openalex.org/W2250518232","https://openalex.org/W3199170188","https://openalex.org/W2360137025","https://openalex.org/W2362738566","https://openalex.org/W2358281326","https://openalex.org/W2715761471"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}