{"id":"https://openalex.org/W1974839229","doi":"https://doi.org/10.1016/0167-8655(89)90017-2","title":"Geometric modelling of IC die bonds for inspection","display_name":"Geometric modelling of IC die bonds for inspection","publication_year":1989,"publication_date":"1989-07-01","ids":{"openalex":"https://openalex.org/W1974839229","doi":"https://doi.org/10.1016/0167-8655(89)90017-2","mag":"1974839229"},"language":"en","primary_location":{"id":"doi:10.1016/0167-8655(89)90017-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/0167-8655(89)90017-2","pdf_url":null,"source":{"id":"https://openalex.org/S151820558","display_name":"Pattern Recognition Letters","issn_l":"0167-8655","issn":["0167-8655","1872-7344"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Pattern Recognition Letters","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5062332580","display_name":"King Ngi Ngan","orcid":"https://orcid.org/0000-0003-1946-3235"},"institutions":[{"id":"https://openalex.org/I165932596","display_name":"National University of Singapore","ror":"https://ror.org/01tgyzw49","country_code":"SG","type":"education","lineage":["https://openalex.org/I165932596"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"King N. Ngan","raw_affiliation_strings":["Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511, Republic of Singapore","Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511 Republic of Singapore"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511, Republic of Singapore","institution_ids":["https://openalex.org/I165932596"]},{"raw_affiliation_string":"Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511 Republic of Singapore","institution_ids":["https://openalex.org/I165932596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5004671096","display_name":"Sing Bing Kang","orcid":"https://orcid.org/0000-0003-2016-2915"},"institutions":[{"id":"https://openalex.org/I165932596","display_name":"National University of Singapore","ror":"https://ror.org/01tgyzw49","country_code":"SG","type":"education","lineage":["https://openalex.org/I165932596"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Sing B. Kang","raw_affiliation_strings":["Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511, Republic of Singapore","Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511 Republic of Singapore"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511, Republic of Singapore","institution_ids":["https://openalex.org/I165932596"]},{"raw_affiliation_string":"Department of Electrical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 0511 Republic of Singapore","institution_ids":["https://openalex.org/I165932596"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5062332580"],"corresponding_institution_ids":["https://openalex.org/I165932596"],"apc_list":{"value":2500,"currency":"USD","value_usd":2500},"apc_paid":null,"fwci":3.2975,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.90174672,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"10","issue":"1","first_page":"47","last_page":"52"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.8324531316757202},{"id":"https://openalex.org/keywords/bond","display_name":"Bond","score":0.6042789816856384},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4888765215873718},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.45264673233032227},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3356240391731262},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.32528170943260193},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.205000102519989}],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.8324531316757202},{"id":"https://openalex.org/C69738904","wikidata":"https://www.wikidata.org/wiki/Q11693","display_name":"Bond","level":2,"score":0.6042789816856384},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4888765215873718},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.45264673233032227},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3356240391731262},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.32528170943260193},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.205000102519989},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/0167-8655(89)90017-2","is_oa":false,"landing_page_url":"https://doi.org/10.1016/0167-8655(89)90017-2","pdf_url":null,"source":{"id":"https://openalex.org/S151820558","display_name":"Pattern Recognition Letters","issn_l":"0167-8655","issn":["0167-8655","1872-7344"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Pattern Recognition Letters","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1877032164","https://openalex.org/W1974093195","https://openalex.org/W2045181334","https://openalex.org/W4240978933"],"related_works":["https://openalex.org/W2042913821","https://openalex.org/W2372289614","https://openalex.org/W2629813803","https://openalex.org/W2041067810","https://openalex.org/W2250518232","https://openalex.org/W3199170188","https://openalex.org/W2360137025","https://openalex.org/W2362738566","https://openalex.org/W2469843853","https://openalex.org/W2051487156"],"abstract_inverted_index":null,"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}