{"id":"https://openalex.org/W3043532440","doi":"https://doi.org/10.1007/s10462-020-09876-9","title":"A review on machine learning in 3D printing: applications, potential, and challenges","display_name":"A review on machine learning in 3D printing: applications, potential, and challenges","publication_year":2020,"publication_date":"2020-07-16","ids":{"openalex":"https://openalex.org/W3043532440","doi":"https://doi.org/10.1007/s10462-020-09876-9","mag":"3043532440"},"language":"en","primary_location":{"id":"doi:10.1007/s10462-020-09876-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10462-020-09876-9","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10462-020-09876-9.pdf","source":{"id":"https://openalex.org/S122814990","display_name":"Artificial Intelligence Review","issn_l":"0269-2821","issn":["0269-2821","1573-7462"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Artificial Intelligence Review","raw_type":"journal-article"},"type":"review","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://link.springer.com/content/pdf/10.1007/s10462-020-09876-9.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073914612","display_name":"Guo Dong Goh","orcid":"https://orcid.org/0000-0001-8461-7064"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"G. D. Goh","raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore"],"affiliations":[{"raw_affiliation_string":"Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048808022","display_name":"Swee Leong Sing","orcid":"https://orcid.org/0000-0002-3980-6605"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"S. L. Sing","raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore"],"affiliations":[{"raw_affiliation_string":"Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5066648757","display_name":"Wai Yee Yeong","orcid":"https://orcid.org/0000-0003-3640-0877"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"W. Y. Yeong","raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore"],"affiliations":[{"raw_affiliation_string":"Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5073914612"],"corresponding_institution_ids":["https://openalex.org/I172675005"],"apc_list":{"value":2490,"currency":"EUR","value_usd":3090},"apc_paid":null,"fwci":30.0362,"has_fulltext":true,"cited_by_count":606,"citation_normalized_percentile":{"value":0.99863067,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":99,"max":100},"biblio":{"volume":"54","issue":"1","first_page":"63","last_page":"94"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9753000140190125,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/workflow","display_name":"Workflow","score":0.8226906061172485},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7598360776901245},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.6451244950294495},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5599532723426819},{"id":"https://openalex.org/keywords/data-sharing","display_name":"Data sharing","score":0.46945828199386597},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4648847281932831},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.46460574865341187},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.45760536193847656},{"id":"https://openalex.org/keywords/data-acquisition","display_name":"Data acquisition","score":0.44926780462265015},{"id":"https://openalex.org/keywords/service","display_name":"Service (business)","score":0.44416049122810364},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3891295790672302},{"id":"https://openalex.org/keywords/data-science","display_name":"Data science","score":0.3347780406475067},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.32705995440483093},{"id":"https://openalex.org/keywords/database","display_name":"Database","score":0.18012583255767822},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12596306204795837},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.11896190047264099}],"concepts":[{"id":"https://openalex.org/C177212765","wikidata":"https://www.wikidata.org/wiki/Q627335","display_name":"Workflow","level":2,"score":0.8226906061172485},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7598360776901245},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6451244950294495},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5599532723426819},{"id":"https://openalex.org/C2779965156","wikidata":"https://www.wikidata.org/wiki/Q5227350","display_name":"Data sharing","level":3,"score":0.46945828199386597},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4648847281932831},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.46460574865341187},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.45760536193847656},{"id":"https://openalex.org/C163985040","wikidata":"https://www.wikidata.org/wiki/Q1172399","display_name":"Data acquisition","level":2,"score":0.44926780462265015},{"id":"https://openalex.org/C2780378061","wikidata":"https://www.wikidata.org/wiki/Q25351891","display_name":"Service (business)","level":2,"score":0.44416049122810364},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3891295790672302},{"id":"https://openalex.org/C2522767166","wikidata":"https://www.wikidata.org/wiki/Q2374463","display_name":"Data science","level":1,"score":0.3347780406475067},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.32705995440483093},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.18012583255767822},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12596306204795837},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.11896190047264099},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C136264566","wikidata":"https://www.wikidata.org/wiki/Q159810","display_name":"Economy","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10462-020-09876-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10462-020-09876-9","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10462-020-09876-9.pdf","source":{"id":"https://openalex.org/S122814990","display_name":"Artificial Intelligence Review","issn_l":"0269-2821","issn":["0269-2821","1573-7462"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Artificial Intelligence Review","raw_type":"journal-article"},{"id":"pmh:oai:dr.ntu.edu.sg:10356/143418","is_oa":false,"landing_page_url":"https://hdl.handle.net/10356/143418","pdf_url":null,"source":{"id":"https://openalex.org/S4306402609","display_name":"DR-NTU (Nanyang Technological University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I172675005","host_organization_name":"Nanyang Technological University","host_organization_lineage":["https://openalex.org/I172675005"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Journal Article"}],"best_oa_location":{"id":"doi:10.1007/s10462-020-09876-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10462-020-09876-9","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10462-020-09876-9.pdf","source":{"id":"https://openalex.org/S122814990","display_name":"Artificial Intelligence Review","issn_l":"0269-2821","issn":["0269-2821","1573-7462"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Artificial Intelligence Review","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.6499999761581421,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"},{"id":"https://openalex.org/F4320320709","display_name":"National Research Foundation Singapore","ror":"https://ror.org/03cpyc314"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W3043532440.pdf","grobid_xml":"https://content.openalex.org/works/W3043532440.grobid-xml"},"referenced_works_count":110,"referenced_works":["https://openalex.org/W357338074","https://openalex.org/W1600545872","https://openalex.org/W1932181459","https://openalex.org/W1982514318","https://openalex.org/W1993309788","https://openalex.org/W2003110013","https://openalex.org/W2004211019","https://openalex.org/W2016034459","https://openalex.org/W2025138352","https://openalex.org/W2041887419","https://openalex.org/W2045825900","https://openalex.org/W2050490309","https://openalex.org/W2051363668","https://openalex.org/W2057031580","https://openalex.org/W2065657250","https://openalex.org/W2082674896","https://openalex.org/W2091653176","https://openalex.org/W2093500299","https://openalex.org/W2099446180","https://openalex.org/W2138767560","https://openalex.org/W2143366758","https://openalex.org/W2145185417","https://openalex.org/W2148430292","https://openalex.org/W2156740851","https://openalex.org/W2157660645","https://openalex.org/W2203015770","https://openalex.org/W2204263695","https://openalex.org/W2214432672","https://openalex.org/W2232325893","https://openalex.org/W2250894080","https://openalex.org/W2299930271","https://openalex.org/W2392582480","https://openalex.org/W2412321691","https://openalex.org/W2463730712","https://openalex.org/W2497658411","https://openalex.org/W2508304991","https://openalex.org/W2524869550","https://openalex.org/W2529881562","https://openalex.org/W2552227324","https://openalex.org/W2556543406","https://openalex.org/W2560171758","https://openalex.org/W2563395460","https://openalex.org/W2586687371","https://openalex.org/W2587631633","https://openalex.org/W2590124693","https://openalex.org/W2591507999","https://openalex.org/W2606076871","https://openalex.org/W2622110699","https://openalex.org/W2622422653","https://openalex.org/W2745286906","https://openalex.org/W2762176217","https://openalex.org/W2766463156","https://openalex.org/W2766966300","https://openalex.org/W2769988472","https://openalex.org/W2771371125","https://openalex.org/W2774444928","https://openalex.org/W2784327700","https://openalex.org/W2794251843","https://openalex.org/W2795186263","https://openalex.org/W2795937275","https://openalex.org/W2796229351","https://openalex.org/W2799328997","https://openalex.org/W2799780169","https://openalex.org/W2800813736","https://openalex.org/W2805274191","https://openalex.org/W2809775572","https://openalex.org/W2883482411","https://openalex.org/W2884601396","https://openalex.org/W2886172404","https://openalex.org/W2886652653","https://openalex.org/W2888026150","https://openalex.org/W2890311545","https://openalex.org/W2891043551","https://openalex.org/W2891059300","https://openalex.org/W2891411686","https://openalex.org/W2892740310","https://openalex.org/W2895046268","https://openalex.org/W2897822284","https://openalex.org/W2901057844","https://openalex.org/W2902229037","https://openalex.org/W2904536334","https://openalex.org/W2905819506","https://openalex.org/W2909096226","https://openalex.org/W2911933660","https://openalex.org/W2911966883","https://openalex.org/W2914427457","https://openalex.org/W2914830398","https://openalex.org/W2915627018","https://openalex.org/W2922468642","https://openalex.org/W2931028544","https://openalex.org/W2941420794","https://openalex.org/W2948771102","https://openalex.org/W2951165878","https://openalex.org/W2955239464","https://openalex.org/W2956046114","https://openalex.org/W2957350396","https://openalex.org/W2972112647","https://openalex.org/W2979648678","https://openalex.org/W2981593109","https://openalex.org/W2991549751","https://openalex.org/W2992344706","https://openalex.org/W3001039722","https://openalex.org/W3004460425","https://openalex.org/W3010951961","https://openalex.org/W3022263385","https://openalex.org/W3035472862","https://openalex.org/W3150575387","https://openalex.org/W3213553391","https://openalex.org/W4285719527","https://openalex.org/W4293090411"],"related_works":["https://openalex.org/W1981780420","https://openalex.org/W2182707996","https://openalex.org/W45233828","https://openalex.org/W2964988449","https://openalex.org/W2397952901","https://openalex.org/W2029380707","https://openalex.org/W188202134","https://openalex.org/W4255934811","https://openalex.org/W2465382974","https://openalex.org/W2362834542"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":30},{"year":2025,"cited_by_count":145},{"year":2024,"cited_by_count":136},{"year":2023,"cited_by_count":113},{"year":2022,"cited_by_count":103},{"year":2021,"cited_by_count":71},{"year":2020,"cited_by_count":8}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}