{"id":"https://openalex.org/W2592100538","doi":"https://doi.org/10.1007/978-3-319-54660-5_16","title":"A Modular Approach for Lean Product Development (LPD) Based on System Engineering","display_name":"A Modular Approach for Lean Product Development (LPD) Based on System Engineering","publication_year":2016,"publication_date":"2016-01-01","ids":{"openalex":"https://openalex.org/W2592100538","doi":"https://doi.org/10.1007/978-3-319-54660-5_16","mag":"2592100538"},"language":"en","primary_location":{"id":"doi:10.1007/978-3-319-54660-5_16","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-319-54660-5_16","pdf_url":null,"source":{"id":"https://openalex.org/S4210185096","display_name":"IFIP advances in information and communication technology","issn_l":"1868-422X","issn":["1868-422X","1868-4238"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP Advances in Information and Communication Technology","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://inria.hal.science/hal-01699685","any_repository_has_fulltext":null},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071833844","display_name":"Dao Yin","orcid":"https://orcid.org/0000-0001-5379-9643"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Dao Yin","raw_affiliation_strings":["Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People\u2019s Republic of China","Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People's Republic of China"],"affiliations":[{"raw_affiliation_string":"Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People\u2019s Republic of China","institution_ids":["https://openalex.org/I183067930"]},{"raw_affiliation_string":"Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People's Republic of China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078863002","display_name":"Xinguo Ming","orcid":"https://orcid.org/0000-0003-1750-4478"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xinguo Ming","raw_affiliation_strings":["Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People\u2019s Republic of China","Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People's Republic of China"],"affiliations":[{"raw_affiliation_string":"Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People\u2019s Republic of China","institution_ids":["https://openalex.org/I183067930"]},{"raw_affiliation_string":"Shanghai Institute of Producer Service Development, Shanghai Research Center for Industrial Informatics, Shanghai Key Lab of Advanced Manufacturing Environment, Institute of Computer Integrated Manufacturing, School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Minhang District, Shanghai City, People's Republic of China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5071833844"],"corresponding_institution_ids":["https://openalex.org/I183067930"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.38576201,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"171","last_page":"182"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11729","display_name":"Product Development and Customization","score":0.9919999837875366,"subfield":{"id":"https://openalex.org/subfields/1405","display_name":"Management of Technology and Innovation"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},"topics":[{"id":"https://openalex.org/T11729","display_name":"Product Development and Customization","score":0.9919999837875366,"subfield":{"id":"https://openalex.org/subfields/1405","display_name":"Management of Technology and Innovation"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9779999852180481,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14306","display_name":"Technology Assessment and Management","score":0.965399980545044,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reuse","display_name":"Reuse","score":0.7477566003799438},{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.726537823677063},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.6206372976303101},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.4894603490829468},{"id":"https://openalex.org/keywords/personalization","display_name":"Personalization","score":0.4733327031135559},{"id":"https://openalex.org/keywords/decomposition","display_name":"Decomposition","score":0.473032683134079},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4555742144584656},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.4535752534866333},{"id":"https://openalex.org/keywords/lean-manufacturing","display_name":"Lean manufacturing","score":0.4528544545173645},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.4470248520374298},{"id":"https://openalex.org/keywords/product-lifecycle","display_name":"Product lifecycle","score":0.43852710723876953},{"id":"https://openalex.org/keywords/variety","display_name":"Variety (cybernetics)","score":0.4381110668182373},{"id":"https://openalex.org/keywords/new-product-development","display_name":"New product development","score":0.43359172344207764},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.42833006381988525},{"id":"https://openalex.org/keywords/lead-time","display_name":"Lead time","score":0.41945797204971313},{"id":"https://openalex.org/keywords/mass-customization","display_name":"Mass customization","score":0.4122844934463501},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.40288251638412476},{"id":"https://openalex.org/keywords/operations-management","display_name":"Operations management","score":0.1698581576347351},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.09619778394699097},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.0855875015258789}],"concepts":[{"id":"https://openalex.org/C206588197","wikidata":"https://www.wikidata.org/wiki/Q846574","display_name":"Reuse","level":2,"score":0.7477566003799438},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.726537823677063},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.6206372976303101},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.4894603490829468},{"id":"https://openalex.org/C183003079","wikidata":"https://www.wikidata.org/wiki/Q1000371","display_name":"Personalization","level":2,"score":0.4733327031135559},{"id":"https://openalex.org/C124681953","wikidata":"https://www.wikidata.org/wiki/Q339062","display_name":"Decomposition","level":2,"score":0.473032683134079},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4555742144584656},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.4535752534866333},{"id":"https://openalex.org/C137335462","wikidata":"https://www.wikidata.org/wiki/Q380772","display_name":"Lean manufacturing","level":2,"score":0.4528544545173645},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.4470248520374298},{"id":"https://openalex.org/C194304873","wikidata":"https://www.wikidata.org/wiki/Q1967338","display_name":"Product lifecycle","level":3,"score":0.43852710723876953},{"id":"https://openalex.org/C136197465","wikidata":"https://www.wikidata.org/wiki/Q1729295","display_name":"Variety (cybernetics)","level":2,"score":0.4381110668182373},{"id":"https://openalex.org/C19351080","wikidata":"https://www.wikidata.org/wiki/Q1395034","display_name":"New product development","level":2,"score":0.43359172344207764},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.42833006381988525},{"id":"https://openalex.org/C2781468064","wikidata":"https://www.wikidata.org/wiki/Q1267117","display_name":"Lead time","level":2,"score":0.41945797204971313},{"id":"https://openalex.org/C72414096","wikidata":"https://www.wikidata.org/wiki/Q1367461","display_name":"Mass customization","level":3,"score":0.4122844934463501},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.40288251638412476},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.1698581576347351},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.09619778394699097},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0855875015258789},{"id":"https://openalex.org/C18903297","wikidata":"https://www.wikidata.org/wiki/Q7150","display_name":"Ecology","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C548081761","wikidata":"https://www.wikidata.org/wiki/Q180388","display_name":"Waste management","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/978-3-319-54660-5_16","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-319-54660-5_16","pdf_url":null,"source":{"id":"https://openalex.org/S4210185096","display_name":"IFIP advances in information and communication technology","issn_l":"1868-422X","issn":["1868-422X","1868-4238"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP Advances in Information and Communication Technology","raw_type":"book-chapter"},{"id":"pmh:oai:HAL:hal-01699685v1","is_oa":true,"landing_page_url":"https://inria.hal.science/hal-01699685","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"13th IFIP International Conference on Product Lifecycle Management (PLM), Jul 2016, Columbia, SC, United States. pp.171-182, ⟨10.1007/978-3-319-54660-5_16⟩","raw_type":"Conference papers"}],"best_oa_location":{"id":"pmh:oai:HAL:hal-01699685v1","is_oa":true,"landing_page_url":"https://inria.hal.science/hal-01699685","pdf_url":null,"source":null,"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"13th IFIP International Conference on Product Lifecycle Management (PLM), Jul 2016, Columbia, SC, United States. pp.171-182, ⟨10.1007/978-3-319-54660-5_16⟩","raw_type":"Conference papers"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.6800000071525574,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W183935398","https://openalex.org/W1040064831","https://openalex.org/W1482359621","https://openalex.org/W1525033182","https://openalex.org/W1536033451","https://openalex.org/W2058719009","https://openalex.org/W2230010135"],"related_works":["https://openalex.org/W2360874376","https://openalex.org/W2367660559","https://openalex.org/W2980152209","https://openalex.org/W2385360656","https://openalex.org/W2384720442","https://openalex.org/W2313029696","https://openalex.org/W4226344619","https://openalex.org/W2361099567","https://openalex.org/W4285264501","https://openalex.org/W1988129126"],"abstract_inverted_index":{"Metallurgical":[0],"equipment":[1,11,103],"belongs":[2],"to":[3,33,38,43,47,63,84,105],"the":[4,29,65,82,92,107,113],"discrete":[5],"manufacturing":[6],"industry,":[7],"in":[8],"which":[9],"large-scale":[10],"is":[12,79],"common,":[13],"and":[14,25,52,109],"has":[15],"feature":[16],"of":[17,20,31,59,100,112],"high":[18],"level":[19],"customization,":[21],"large":[22],"variety,":[23],"single":[24],"small":[26],"batch.":[27],"Under":[28],"model":[30],"design":[32,88],"order,":[34,45],"R&D":[35,66],"staff":[36],"have":[37],"modify":[39],"or":[40],"redesign":[41],"according":[42],"each":[44],"leading":[46],"longer":[48],"product":[49],"development":[50,104],"cycle":[51],"higher":[53],"cost.":[54],"This":[55],"paper":[56,95],"presents":[57],"w-model":[58],"system":[60],"engineering":[61],"framework":[62],"solve":[64],"cross":[67],"sectoral":[68],"collaborative":[69],"problem.":[70],"Top-down":[71],"functional":[72],"decomposition":[73],"integrated":[74],"with":[75],"bottom-up":[76],"component":[77],"clustering":[78],"suggested":[80],"by":[81],"author":[83],"form":[85],"module":[86],"for":[87],"knowledge":[89],"reuse.":[90],"In":[91],"end,":[93],"this":[94],"takes":[96],"an":[97],"illustrative":[98],"example":[99],"lean":[101],"metallurgical":[102],"demonstrate":[106],"feasibility":[108],"technical":[110],"advantage":[111],"approach.":[114]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}