{"id":"https://openalex.org/W4415772820","doi":"https://doi.org/10.1007/s13198-025-03041-7","title":"Laser-textured superhydrophobic copper surfaces for enhanced heat transfer: a comprehensive review","display_name":"Laser-textured superhydrophobic copper surfaces for enhanced heat transfer: a comprehensive review","publication_year":2025,"publication_date":"2025-11-02","ids":{"openalex":"https://openalex.org/W4415772820","doi":"https://doi.org/10.1007/s13198-025-03041-7"},"language":"en","primary_location":{"id":"doi:10.1007/s13198-025-03041-7","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s13198-025-03041-7","pdf_url":null,"source":{"id":"https://openalex.org/S40280859","display_name":"International Journal of Systems Assurance Engineering and Management","issn_l":"0975-6809","issn":["0975-6809","0976-4348"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of System Assurance Engineering and Management","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027046883","display_name":"S. Paramasivan","orcid":null},"institutions":[{"id":"https://openalex.org/I118826373","display_name":"Tirunelveli Medical College","ror":"https://ror.org/01c4srk95","country_code":"IN","type":"education","lineage":["https://openalex.org/I118826373"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"S. Paramasivan","raw_affiliation_strings":["Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India","institution_ids":["https://openalex.org/I118826373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062539244","display_name":"N. Vijay Ponraj","orcid":null},"institutions":[{"id":"https://openalex.org/I118826373","display_name":"Tirunelveli Medical College","ror":"https://ror.org/01c4srk95","country_code":"IN","type":"education","lineage":["https://openalex.org/I118826373"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"N. Vijay Ponraj","raw_affiliation_strings":["Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India","institution_ids":["https://openalex.org/I118826373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055448319","display_name":"P. Selvakumar","orcid":null},"institutions":[{"id":"https://openalex.org/I118826373","display_name":"Tirunelveli Medical College","ror":"https://ror.org/01c4srk95","country_code":"IN","type":"education","lineage":["https://openalex.org/I118826373"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"P. Selvakumar","raw_affiliation_strings":["Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India","institution_ids":["https://openalex.org/I118826373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017628110","display_name":"M. Armstrong","orcid":null},"institutions":[{"id":"https://openalex.org/I118826373","display_name":"Tirunelveli Medical College","ror":"https://ror.org/01c4srk95","country_code":"IN","type":"education","lineage":["https://openalex.org/I118826373"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"M. Armstrong","raw_affiliation_strings":["Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India","institution_ids":["https://openalex.org/I118826373"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077492195","display_name":"K. Arunprasath","orcid":"https://orcid.org/0000-0002-9078-3808"},"institutions":[{"id":"https://openalex.org/I118826373","display_name":"Tirunelveli Medical College","ror":"https://ror.org/01c4srk95","country_code":"IN","type":"education","lineage":["https://openalex.org/I118826373"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"K. Arunprasath","raw_affiliation_strings":["Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India"],"raw_orcid":"https://orcid.org/0000-0002-9078-3808","affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, PSN College of Engineering and Technology, Tirunelveli, Tamil Nadu, India","institution_ids":["https://openalex.org/I118826373"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5077492195"],"corresponding_institution_ids":["https://openalex.org/I118826373"],"apc_list":{"value":2990,"currency":"USD","value_usd":2990},"apc_paid":null,"fwci":0.3238,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.54407779,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":"17","issue":"4","first_page":"1209","last_page":"1221"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10313","display_name":"Surface Modification and Superhydrophobicity","score":0.9768999814987183,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10313","display_name":"Surface Modification and Superhydrophobicity","score":0.9768999814987183,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12141","display_name":"Fluid Dynamics and Thin Films","score":0.0052999998442828655,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11382","display_name":"Fluid Dynamics and Heat Transfer","score":0.003599999938160181,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.5845999717712402},{"id":"https://openalex.org/keywords/heat-exchanger","display_name":"Heat exchanger","score":0.5332000255584717},{"id":"https://openalex.org/keywords/wetting","display_name":"Wetting","score":0.454800009727478},{"id":"https://openalex.org/keywords/enhanced-heat-transfer","display_name":"Enhanced heat transfer","score":0.42969998717308044},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.4228000044822693},{"id":"https://openalex.org/keywords/underpinning","display_name":"Underpinning","score":0.4214000105857849},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.41819998621940613},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.4027000069618225}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6674000024795532},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.6402999758720398},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.5845999717712402},{"id":"https://openalex.org/C107706546","wikidata":"https://www.wikidata.org/wiki/Q189124","display_name":"Heat exchanger","level":2,"score":0.5332000255584717},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.454800009727478},{"id":"https://openalex.org/C2781410879","wikidata":"https://www.wikidata.org/wiki/Q5378802","display_name":"Enhanced heat transfer","level":3,"score":0.42969998717308044},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.4228000044822693},{"id":"https://openalex.org/C2780871342","wikidata":"https://www.wikidata.org/wiki/Q7883752","display_name":"Underpinning","level":2,"score":0.4214000105857849},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.41819998621940613},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.4027000069618225},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3560999929904938},{"id":"https://openalex.org/C3020168488","wikidata":"https://www.wikidata.org/wiki/Q65069798","display_name":"High heat","level":2,"score":0.35499998927116394},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.35409998893737793},{"id":"https://openalex.org/C163114375","wikidata":"https://www.wikidata.org/wiki/Q11260161","display_name":"Surface engineering","level":2,"score":0.353300005197525},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.35100001096725464},{"id":"https://openalex.org/C115537861","wikidata":"https://www.wikidata.org/wiki/Q7645993","display_name":"Surface modification","level":2,"score":0.33329999446868896},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3091000020503998},{"id":"https://openalex.org/C177606310","wikidata":"https://www.wikidata.org/wiki/Q5674297","display_name":"Adaptability","level":2,"score":0.29899999499320984},{"id":"https://openalex.org/C2776799497","wikidata":"https://www.wikidata.org/wiki/Q484298","display_name":"Surface (topology)","level":2,"score":0.28450000286102295},{"id":"https://openalex.org/C200093464","wikidata":"https://www.wikidata.org/wiki/Q166583","display_name":"Condensation","level":2,"score":0.2825999855995178},{"id":"https://openalex.org/C186187911","wikidata":"https://www.wikidata.org/wiki/Q1093894","display_name":"Nanostructure","level":2,"score":0.25380000472068787},{"id":"https://openalex.org/C167735695","wikidata":"https://www.wikidata.org/wiki/Q1777507","display_name":"Femtosecond","level":3,"score":0.25279998779296875},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2526000142097473},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.25130000710487366}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s13198-025-03041-7","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s13198-025-03041-7","pdf_url":null,"source":{"id":"https://openalex.org/S40280859","display_name":"International Journal of Systems Assurance Engineering and Management","issn_l":"0975-6809","issn":["0975-6809","0976-4348"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of System Assurance Engineering and Management","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":51,"referenced_works":["https://openalex.org/W2154255972","https://openalex.org/W2204134246","https://openalex.org/W2319103600","https://openalex.org/W2548200126","https://openalex.org/W2765557171","https://openalex.org/W2896364639","https://openalex.org/W2945122667","https://openalex.org/W2949046098","https://openalex.org/W2983019546","https://openalex.org/W2995300208","https://openalex.org/W3006712690","https://openalex.org/W3006996615","https://openalex.org/W3014415453","https://openalex.org/W3023927841","https://openalex.org/W3026301725","https://openalex.org/W3027078125","https://openalex.org/W3035885034","https://openalex.org/W3037456341","https://openalex.org/W3054049896","https://openalex.org/W3086382894","https://openalex.org/W3122406474","https://openalex.org/W3125618588","https://openalex.org/W3130036247","https://openalex.org/W3156407742","https://openalex.org/W3177263571","https://openalex.org/W3178752081","https://openalex.org/W3190664124","https://openalex.org/W3207950282","https://openalex.org/W3216710288","https://openalex.org/W4200073183","https://openalex.org/W4210571593","https://openalex.org/W4214928085","https://openalex.org/W4221070349","https://openalex.org/W4225372855","https://openalex.org/W4280512777","https://openalex.org/W4285803074","https://openalex.org/W4289890727","https://openalex.org/W4291731942","https://openalex.org/W4296060428","https://openalex.org/W4296820379","https://openalex.org/W4307269787","https://openalex.org/W4308734752","https://openalex.org/W4384027820","https://openalex.org/W4384103872","https://openalex.org/W4385256010","https://openalex.org/W4385383536","https://openalex.org/W4385589032","https://openalex.org/W4385678989","https://openalex.org/W4391392689","https://openalex.org/W4392797977","https://openalex.org/W4408830595"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-07-23T08:03:31.855105","created_date":"2025-11-02T00:00:00"}