{"id":"https://openalex.org/W7124435511","doi":"https://doi.org/10.1007/s11432-025-4698-1","title":"Ultrahigh thermal-stable p-type WSe2 transistors with silicon processing-compatible metal-semiconductor contacts","display_name":"Ultrahigh thermal-stable p-type WSe2 transistors with silicon processing-compatible metal-semiconductor contacts","publication_year":2026,"publication_date":"2026-01-07","ids":{"openalex":"https://openalex.org/W7124435511","doi":"https://doi.org/10.1007/s11432-025-4698-1"},"language":"en","primary_location":{"id":"doi:10.1007/s11432-025-4698-1","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11432-025-4698-1","pdf_url":null,"source":{"id":"https://openalex.org/S4210218743","display_name":"Science China Information Sciences","issn_l":"1674-733X","issn":["1674-733X","1869-1919"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Science China Information Sciences","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Junlin Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junlin Huang","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101534440","display_name":"Li Gao","orcid":"https://orcid.org/0000-0001-6362-5487"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Gao","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035752332","display_name":"Zhangyi Chen","orcid":"https://orcid.org/0000-0002-0129-6857"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhangyi Chen","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5123196709","display_name":"Zeen Jia","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zeen Jia","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112881100","display_name":"Yuyin Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuyin Lin","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5123220683","display_name":"Mengyu Hong","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mengyu Hong","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088961683","display_name":"Huihui Yu","orcid":"https://orcid.org/0009-0009-7417-9385"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huihui Yu","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Xiankun Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiankun Zhang","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Zheng Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Zheng Zhang","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5123221744","display_name":"Yue Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]},{"id":"https://openalex.org/I4210123492","display_name":"Advanced Technology & Materials (China)","ror":"https://ror.org/02s3fnw45","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210123492"]},{"id":"https://openalex.org/I92403157","display_name":"University of Science and Technology Beijing","ror":"https://ror.org/02egmk993","country_code":"CN","type":"education","lineage":["https://openalex.org/I92403157"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yue Zhang","raw_affiliation_strings":["Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I4210123492"]},{"raw_affiliation_string":"Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing, 100083, China","institution_ids":["https://openalex.org/I92403157","https://openalex.org/I37796252"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":10,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I37796252","https://openalex.org/I4210123492","https://openalex.org/I92403157"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":8.4129,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.95872587,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":98},"biblio":{"volume":"69","issue":"3","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10275","display_name":"2D Materials and Applications","score":0.9886000156402588,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10275","display_name":"2D Materials and Applications","score":0.9886000156402588,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.0032999999821186066,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.00139999995008111,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tungsten-diselenide","display_name":"Tungsten diselenide","score":0.8046000003814697},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.6711000204086304},{"id":"https://openalex.org/keywords/pmos-logic","display_name":"PMOS logic","score":0.5924999713897705},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"Contact resistance","score":0.5896999835968018},{"id":"https://openalex.org/keywords/tungsten","display_name":"Tungsten","score":0.5738000273704529},{"id":"https://openalex.org/keywords/thermal-stability","display_name":"Thermal stability","score":0.49880000948905945},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.47440001368522644},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.450300008058548},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.40779998898506165},{"id":"https://openalex.org/keywords/oxide","display_name":"Oxide","score":0.3930000066757202}],"concepts":[{"id":"https://openalex.org/C2776245471","wikidata":"https://www.wikidata.org/wiki/Q2592220","display_name":"Tungsten diselenide","level":4,"score":0.8046000003814697},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.758400022983551},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.6711000204086304},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.6176999807357788},{"id":"https://openalex.org/C27050352","wikidata":"https://www.wikidata.org/wiki/Q173605","display_name":"PMOS logic","level":4,"score":0.5924999713897705},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.5896999835968018},{"id":"https://openalex.org/C542268612","wikidata":"https://www.wikidata.org/wiki/Q743","display_name":"Tungsten","level":2,"score":0.5738000273704529},{"id":"https://openalex.org/C59061564","wikidata":"https://www.wikidata.org/wiki/Q7783071","display_name":"Thermal stability","level":2,"score":0.49880000948905945},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.47440001368522644},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.450300008058548},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.40779998898506165},{"id":"https://openalex.org/C2779851234","wikidata":"https://www.wikidata.org/wiki/Q50690","display_name":"Oxide","level":2,"score":0.3930000066757202},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.383899986743927},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.3598000109195709},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3506999909877777},{"id":"https://openalex.org/C57863236","wikidata":"https://www.wikidata.org/wiki/Q1130571","display_name":"Doping","level":2,"score":0.32249999046325684},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.3203999996185303},{"id":"https://openalex.org/C66882249","wikidata":"https://www.wikidata.org/wiki/Q169336","display_name":"Homogeneous","level":2,"score":0.3156000077724457},{"id":"https://openalex.org/C16115445","wikidata":"https://www.wikidata.org/wiki/Q2391942","display_name":"Schottky barrier","level":3,"score":0.30649998784065247},{"id":"https://openalex.org/C110738630","wikidata":"https://www.wikidata.org/wiki/Q1135540","display_name":"Epitaxy","level":3,"score":0.30059999227523804},{"id":"https://openalex.org/C98446981","wikidata":"https://www.wikidata.org/wiki/Q288224","display_name":"Depletion region","level":3,"score":0.2831000089645386},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.28220000863075256},{"id":"https://openalex.org/C197162436","wikidata":"https://www.wikidata.org/wiki/Q83908","display_name":"NMOS logic","level":4,"score":0.28130000829696655},{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.2791999876499176},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.2784999907016754},{"id":"https://openalex.org/C33574316","wikidata":"https://www.wikidata.org/wiki/Q917260","display_name":"Passivation","level":3,"score":0.2775000035762787},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.27059999108314514},{"id":"https://openalex.org/C145598152","wikidata":"https://www.wikidata.org/wiki/Q176097","display_name":"Field-effect transistor","level":4,"score":0.26829999685287476},{"id":"https://openalex.org/C141400236","wikidata":"https://www.wikidata.org/wiki/Q1479544","display_name":"Nanoelectronics","level":2,"score":0.2671000063419342},{"id":"https://openalex.org/C145018004","wikidata":"https://www.wikidata.org/wiki/Q4985944","display_name":"Buffer (optical fiber)","level":2,"score":0.26440000534057617}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s11432-025-4698-1","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11432-025-4698-1","pdf_url":null,"source":{"id":"https://openalex.org/S4210218743","display_name":"Science China Information Sciences","issn_l":"1674-733X","issn":["1674-733X","1869-1919"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Science China Information Sciences","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":55,"referenced_works":["https://openalex.org/W1789081234","https://openalex.org/W2020417695","https://openalex.org/W2073321070","https://openalex.org/W2076563870","https://openalex.org/W2121915786","https://openalex.org/W2313963416","https://openalex.org/W2342569913","https://openalex.org/W2413709876","https://openalex.org/W2465195419","https://openalex.org/W2520600594","https://openalex.org/W2521590594","https://openalex.org/W2561639904","https://openalex.org/W2756316035","https://openalex.org/W2804762466","https://openalex.org/W2889740355","https://openalex.org/W2904546489","https://openalex.org/W2911597211","https://openalex.org/W2945022590","https://openalex.org/W2959141055","https://openalex.org/W2982320900","https://openalex.org/W3017192294","https://openalex.org/W3116702636","https://openalex.org/W3125487664","https://openalex.org/W3133142145","https://openalex.org/W3133792218","https://openalex.org/W3165644247","https://openalex.org/W3169860613","https://openalex.org/W3177193570","https://openalex.org/W3186291340","https://openalex.org/W3194403408","https://openalex.org/W3203973672","https://openalex.org/W4205672201","https://openalex.org/W4213256857","https://openalex.org/W4220652032","https://openalex.org/W4224252739","https://openalex.org/W4280541480","https://openalex.org/W4289261172","https://openalex.org/W4291366415","https://openalex.org/W4306392742","https://openalex.org/W4306822635","https://openalex.org/W4309915808","https://openalex.org/W4317475928","https://openalex.org/W4318499426","https://openalex.org/W4321598727","https://openalex.org/W4367601281","https://openalex.org/W4385629036","https://openalex.org/W4387582171","https://openalex.org/W4388192028","https://openalex.org/W4397034455","https://openalex.org/W4399262964","https://openalex.org/W4399322628","https://openalex.org/W4399349189","https://openalex.org/W4400921554","https://openalex.org/W4401888416","https://openalex.org/W4405199861"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":2}],"updated_date":"2026-06-25T08:15:23.626066","created_date":"2026-01-17T00:00:00"}