{"id":"https://openalex.org/W2133805116","doi":"https://doi.org/10.1007/s11432-008-0054-9","title":"A glance of technology efforts for design-for-manufacturing in nano-scale CMOS processes","display_name":"A glance of technology efforts for design-for-manufacturing in nano-scale CMOS processes","publication_year":2008,"publication_date":"2008-05-20","ids":{"openalex":"https://openalex.org/W2133805116","doi":"https://doi.org/10.1007/s11432-008-0054-9","mag":"2133805116"},"language":"en","primary_location":{"id":"doi:10.1007/s11432-008-0054-9","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11432-008-0054-9","pdf_url":null,"source":{"id":"https://openalex.org/S4210224633","display_name":"Science in China Series F Information Sciences","issn_l":"1009-2757","issn":["1009-2757","1862-2836"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Science in China Series F: Information Sciences","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5017416584","display_name":"Yuhua Cheng","orcid":"https://orcid.org/0000-0002-5580-2006"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"YuHua Cheng","raw_affiliation_strings":["Shanghai Research Institute of Microelectronics (SHRIME), Peking University, Shanghai, 201203, China","Peking University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai Research Institute of Microelectronics (SHRIME), Peking University, Shanghai, 201203, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Peking University","institution_ids":["https://openalex.org/I20231570"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5017416584"],"corresponding_institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"],"apc_list":null,"apc_paid":null,"fwci":0.6394,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.76626893,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"51","issue":"6","first_page":"807","last_page":"818"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9905999898910522,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.9731333255767822},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.639811635017395},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5769223570823669},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.5340173840522766},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.5002307891845703},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.48270487785339355},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37285858392715454},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.35229647159576416},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.19432222843170166},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.1385461390018463},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.10614576935768127}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.9731333255767822},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.639811635017395},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5769223570823669},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.5340173840522766},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.5002307891845703},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.48270487785339355},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37285858392715454},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.35229647159576416},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.19432222843170166},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.1385461390018463},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.10614576935768127},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s11432-008-0054-9","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s11432-008-0054-9","pdf_url":null,"source":{"id":"https://openalex.org/S4210224633","display_name":"Science in China Series F Information Sciences","issn_l":"1009-2757","issn":["1009-2757","1862-2836"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Science in China Series F: Information Sciences","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5299999713897705,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1680554825","https://openalex.org/W1846952431","https://openalex.org/W1966930218","https://openalex.org/W2121129272","https://openalex.org/W2128986352","https://openalex.org/W2167716165","https://openalex.org/W2412229656","https://openalex.org/W2556449042","https://openalex.org/W3144851256","https://openalex.org/W4234083032","https://openalex.org/W4298064752"],"related_works":["https://openalex.org/W1573321145","https://openalex.org/W4246351405","https://openalex.org/W2099437566","https://openalex.org/W1974863168","https://openalex.org/W3166333355","https://openalex.org/W2121129272","https://openalex.org/W2048044560","https://openalex.org/W2088294739","https://openalex.org/W2092537898","https://openalex.org/W1988896275"],"abstract_inverted_index":null,"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":2}],"updated_date":"2026-08-26T07:47:46.906454","created_date":"2025-10-10T00:00:00"}