{"id":"https://openalex.org/W4406321076","doi":"https://doi.org/10.1007/s10845-024-02559-0","title":"Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system","display_name":"Simulation of semiconductor wafer dicing induced faults on chips and their application as augmentation method for a deep learning based visual inspection system","publication_year":2025,"publication_date":"2025-01-13","ids":{"openalex":"https://openalex.org/W4406321076","doi":"https://doi.org/10.1007/s10845-024-02559-0"},"language":"en","primary_location":{"id":"doi:10.1007/s10845-024-02559-0","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10845-024-02559-0","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10845-024-02559-0.pdf","source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://link.springer.com/content/pdf/10.1007/s10845-024-02559-0.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Michael Friedrich","orcid":"https://orcid.org/0000-0001-6326-4749"},"institutions":[{"id":"https://openalex.org/I2610724","display_name":"Chemnitz University of Technology","ror":"https://ror.org/00a208s56","country_code":"DE","type":"education","lineage":["https://openalex.org/I2610724"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Michael Friedrich","raw_affiliation_strings":["Chemnitz University of Technology, 09107, Chemnitz, Germany"],"raw_orcid":"https://orcid.org/0000-0001-6326-4749","affiliations":[{"raw_affiliation_string":"Chemnitz University of Technology, 09107, Chemnitz, Germany","institution_ids":["https://openalex.org/I2610724"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083970552","display_name":"Tobias Schlosser","orcid":"https://orcid.org/0000-0002-0682-4284"},"institutions":[{"id":"https://openalex.org/I2610724","display_name":"Chemnitz University of Technology","ror":"https://ror.org/00a208s56","country_code":"DE","type":"education","lineage":["https://openalex.org/I2610724"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Tobias Schlosser","raw_affiliation_strings":["Chemnitz University of Technology, 09107, Chemnitz, Germany"],"raw_orcid":"https://orcid.org/0000-0002-0682-4284","affiliations":[{"raw_affiliation_string":"Chemnitz University of Technology, 09107, Chemnitz, Germany","institution_ids":["https://openalex.org/I2610724"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038259339","display_name":"Danny Kowerko","orcid":"https://orcid.org/0000-0002-4538-7814"},"institutions":[{"id":"https://openalex.org/I2610724","display_name":"Chemnitz University of Technology","ror":"https://ror.org/00a208s56","country_code":"DE","type":"education","lineage":["https://openalex.org/I2610724"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Danny Kowerko","raw_affiliation_strings":["Chemnitz University of Technology, 09107, Chemnitz, Germany"],"raw_orcid":"https://orcid.org/0000-0002-4538-7814","affiliations":[{"raw_affiliation_string":"Chemnitz University of Technology, 09107, Chemnitz, Germany","institution_ids":["https://openalex.org/I2610724"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5038259339"],"corresponding_institution_ids":["https://openalex.org/I2610724"],"apc_list":{"value":2990,"currency":"USD","value_usd":2990},"apc_paid":{"value":2990,"currency":"USD","value_usd":2990},"fwci":3.2155,"has_fulltext":true,"cited_by_count":6,"citation_normalized_percentile":{"value":0.9083195,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":91,"max":99},"biblio":{"volume":"37","issue":"2","first_page":"573","last_page":"596"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.9556276798248291},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7532533407211304},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.6028881669044495},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5739151239395142},{"id":"https://openalex.org/keywords/visual-inspection","display_name":"Visual inspection","score":0.5032307505607605},{"id":"https://openalex.org/keywords/classifier","display_name":"Classifier (UML)","score":0.46549496054649353},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.4378573000431061},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.35808032751083374},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2549157738685608},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.12272542715072632}],"concepts":[{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.9556276798248291},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7532533407211304},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.6028881669044495},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5739151239395142},{"id":"https://openalex.org/C168820333","wikidata":"https://www.wikidata.org/wiki/Q448889","display_name":"Visual inspection","level":2,"score":0.5032307505607605},{"id":"https://openalex.org/C95623464","wikidata":"https://www.wikidata.org/wiki/Q1096149","display_name":"Classifier (UML)","level":2,"score":0.46549496054649353},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.4378573000431061},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.35808032751083374},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2549157738685608},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12272542715072632}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10845-024-02559-0","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10845-024-02559-0","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10845-024-02559-0.pdf","source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:econstor.eu:10419/336721","is_oa":true,"landing_page_url":"https://hdl.handle.net/10419/336721","pdf_url":null,"source":{"id":"https://openalex.org/S4306401696","display_name":"Econstor (Econstor)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"doc-type:article"}],"best_oa_location":{"id":"doi:10.1007/s10845-024-02559-0","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10845-024-02559-0","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10845-024-02559-0.pdf","source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.550000011920929,"id":"https://metadata.un.org/sdg/8","display_name":"Decent work and economic growth"}],"awards":[{"id":"https://openalex.org/G8082932182","display_name":null,"funder_award_id":"100670286","funder_id":"https://openalex.org/F13639301","funder_display_name":"Europ\u00e4ischer Sozialfonds"}],"funders":[{"id":"https://openalex.org/F13639301","display_name":"Europ\u00e4ischer Sozialfonds","ror":null},{"id":"https://openalex.org/F4320320300","display_name":"European Commission","ror":"https://ror.org/00k4n6c32"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4406321076.pdf","grobid_xml":"https://content.openalex.org/works/W4406321076.grobid-xml"},"referenced_works_count":59,"referenced_works":["https://openalex.org/W1500514853","https://openalex.org/W1975580029","https://openalex.org/W1996020380","https://openalex.org/W2020286945","https://openalex.org/W2092243497","https://openalex.org/W2126584714","https://openalex.org/W2162240567","https://openalex.org/W2165698076","https://openalex.org/W2183341477","https://openalex.org/W2194775991","https://openalex.org/W2302255633","https://openalex.org/W2343052201","https://openalex.org/W2531409750","https://openalex.org/W2592101084","https://openalex.org/W2594332903","https://openalex.org/W2604262106","https://openalex.org/W2605102758","https://openalex.org/W2605344740","https://openalex.org/W2768955070","https://openalex.org/W2775795276","https://openalex.org/W2783482415","https://openalex.org/W2919932305","https://openalex.org/W2937975340","https://openalex.org/W2938671123","https://openalex.org/W2954996726","https://openalex.org/W2962835968","https://openalex.org/W2962858109","https://openalex.org/W2963108767","https://openalex.org/W2963163009","https://openalex.org/W2963201472","https://openalex.org/W2963446712","https://openalex.org/W2964081807","https://openalex.org/W2964350391","https://openalex.org/W2975317124","https://openalex.org/W2981182119","https://openalex.org/W2998508940","https://openalex.org/W3011969759","https://openalex.org/W3021503072","https://openalex.org/W3024903722","https://openalex.org/W3047291564","https://openalex.org/W3094502228","https://openalex.org/W3098844351","https://openalex.org/W3100116934","https://openalex.org/W3124804470","https://openalex.org/W3133696297","https://openalex.org/W3154478532","https://openalex.org/W3158980972","https://openalex.org/W3216759837","https://openalex.org/W4207016755","https://openalex.org/W4242488246","https://openalex.org/W4250664506","https://openalex.org/W4287250198","https://openalex.org/W4295727797","https://openalex.org/W4297775537","https://openalex.org/W4301489422","https://openalex.org/W4313642993","https://openalex.org/W4391468387","https://openalex.org/W4394668313","https://openalex.org/W6941147165"],"related_works":["https://openalex.org/W327425532","https://openalex.org/W293942573","https://openalex.org/W2168348385","https://openalex.org/W4213132161","https://openalex.org/W2017722595","https://openalex.org/W2970266003","https://openalex.org/W4281685712","https://openalex.org/W2004857665","https://openalex.org/W2897696252","https://openalex.org/W2331745693"],"abstract_inverted_index":{"Abstract":[0],"In":[1],"semiconductor":[2],"wafer":[3,75,82,198,216],"dicing,":[4],"one":[5],"particular":[6],"area":[7],"of":[8,13,48,60,91,94,167,191,209,222,231],"interest":[9],"is":[10,52,182],"the":[11,23,32,57,61,88,124,138,155,159,189,229],"process":[12],"visual":[14,129],"inspection":[15,130],"to":[16,36,56,154,169,187,211],"detect":[17],"manufacturing":[18,24],"defects":[19,39,51],"that":[20],"occur":[21],"throughout":[22],"process.":[25],"Emerging":[26],"defect":[27,113],"patterns":[28],"are":[29,106,142],"typically":[30],"in":[31,40],"micrometer":[33],"range,":[34],"translating":[35],"barely":[37],"visible":[38],"pixel":[41],"size":[42],"on":[43,158,201],"high-resolution":[44],"imagery.":[45,104],"The":[46],"availability":[47],"rarely":[49],"occurring":[50],"generally":[53],"limited":[54],"due":[55],"labor-intensive":[58],"nature":[59],"related,":[62],"highly":[63],"specialized":[64],"annotation":[65],"task.":[66],"Therefore,":[67],"this":[68],"contribution":[69],"proposes":[70],"a":[71,119,175,185,206],"hybrid":[72],"system":[73],"for":[74,87,108,127,195],"and":[76,83,101,115,225],"chip":[77,100],"image":[78,140],"data":[79,141,151,161,194],"synthesis":[80],"utilizing":[81],"dicing":[84,102],"path":[85],"templates":[86],"synthetic":[89],"generation":[90],"large":[92],"quantities":[93],"labeled":[95],"flawless":[96],"and,":[97],"rarely,":[98],"faulty":[99],"street":[103],"These":[105],"utilized":[107],"subsequent":[109],"deep":[110],"learning":[111],"based":[112],"detection":[114],"classification":[116],"by":[117,147],"employing":[118],"residual":[120],"neural":[121],"network":[122],"as":[123,184],"core":[125],"classifier":[126],"our":[128,192,215,232],"system.":[131,234],"Our":[132],"results":[133],"show":[134],"promising":[135],"prospects":[136],"when":[137],"original":[139,160],"supplemented":[143],"with":[144],"synthesized":[145,193],"images":[146],"creating":[148],"so-called":[149],"composite":[150],"sets.":[152],"Compared":[153],"system\u2019s":[156],"baseline":[157],"set,":[162],"an":[163],"F1-score-based":[164],"relative":[165,207,219],"improvement":[166,208,220],"up":[168,210],"3.98":[170],"times":[171],"was":[172],"achieved.":[173],"Furthermore,":[174],"novel":[176],"synthetic-composite":[177],"leave-one-out":[178],"cross-validation":[179],"(SC-LOOCV)":[180,227],"method":[181],"proposed":[183],"means":[186],"analyze":[188],"quality":[190],"each":[196],"specific":[197],"type.":[199],"Based":[200],"these":[202],"experiments,":[203],"we":[204],"scored":[205],"5.99.":[212],"For":[213],"all":[214],"types,":[217],"overall":[218],"factors":[221],"1.99":[223],"(composite)":[224],"2.83":[226],"highlight":[228],"benefits":[230],"realized":[233]},"counts_by_year":[{"year":2026,"cited_by_count":5},{"year":2025,"cited_by_count":1}],"updated_date":"2026-08-18T07:49:30.821534","created_date":"2025-10-10T00:00:00"}