{"id":"https://openalex.org/W4392741921","doi":"https://doi.org/10.1007/s10845-024-02324-3","title":"A novel joint segmentation approach for wafer surface defect classification based on blended network structure","display_name":"A novel joint segmentation approach for wafer surface defect classification based on blended network structure","publication_year":2024,"publication_date":"2024-03-13","ids":{"openalex":"https://openalex.org/W4392741921","doi":"https://doi.org/10.1007/s10845-024-02324-3"},"language":"en","primary_location":{"id":"doi:10.1007/s10845-024-02324-3","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10845-024-02324-3","pdf_url":null,"source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101292875","display_name":"Zhouzhouzhou Mei","orcid":"https://orcid.org/0009-0003-7209-1722"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Zhouzhouzhou Mei","raw_affiliation_strings":["School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China"],"affiliations":[{"raw_affiliation_string":"School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101285227","display_name":"Yuening Luo","orcid":null},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuening Luo","raw_affiliation_strings":["School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China"],"affiliations":[{"raw_affiliation_string":"School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112913216","display_name":"Yibo Qiao","orcid":"https://orcid.org/0009-0006-6179-829X"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yibo Qiao","raw_affiliation_strings":["School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China"],"affiliations":[{"raw_affiliation_string":"School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080027678","display_name":"Yining Chen","orcid":"https://orcid.org/0000-0001-9302-6696"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yining Chen","raw_affiliation_strings":["School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China"],"affiliations":[{"raw_affiliation_string":"School of Micro-Nano Electronics, Zhejiang University, No.733, Jianshe 3rd Road, Xiaoshan District, Hangzhou, 311200, Zhejiang, China","institution_ids":["https://openalex.org/I76130692"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5101292875"],"corresponding_institution_ids":["https://openalex.org/I76130692"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":2.5293,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.89333459,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":98},"biblio":{"volume":"36","issue":"3","first_page":"1907","last_page":"1921"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/segmentation","display_name":"Segmentation","score":0.6599607467651367},{"id":"https://openalex.org/keywords/joint","display_name":"Joint (building)","score":0.6593500971794128},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6024268865585327},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5207440853118896},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.50520259141922},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3946499228477478},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.37531042098999023},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.30728453397750854},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2556910514831543},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.1963639259338379}],"concepts":[{"id":"https://openalex.org/C89600930","wikidata":"https://www.wikidata.org/wiki/Q1423946","display_name":"Segmentation","level":2,"score":0.6599607467651367},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.6593500971794128},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6024268865585327},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5207440853118896},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.50520259141922},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3946499228477478},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.37531042098999023},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.30728453397750854},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2556910514831543},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1963639259338379}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10845-024-02324-3","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10845-024-02324-3","pdf_url":null,"source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:RePEc:spr:joinma:v:36:y:2025:i:3:d:10.1007_s10845-024-02324-3","is_oa":false,"landing_page_url":"http://link.springer.com/10.1007/s10845-024-02324-3","pdf_url":null,"source":{"id":"https://openalex.org/S4306401271","display_name":"RePEc: Research Papers in Economics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I77793887","host_organization_name":"Federal Reserve Bank of St. Louis","host_organization_lineage":["https://openalex.org/I77793887"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1849277567","https://openalex.org/W1901129140","https://openalex.org/W1965696824","https://openalex.org/W2120196566","https://openalex.org/W2169393322","https://openalex.org/W2790607928","https://openalex.org/W2891469484","https://openalex.org/W2920311927","https://openalex.org/W2966069238","https://openalex.org/W2982535616","https://openalex.org/W3092166587","https://openalex.org/W3116557177","https://openalex.org/W3138516171","https://openalex.org/W3156335941","https://openalex.org/W3170544306","https://openalex.org/W3173262613","https://openalex.org/W3204166336","https://openalex.org/W4205842849","https://openalex.org/W4210726989","https://openalex.org/W4212774754","https://openalex.org/W4240863205","https://openalex.org/W4285219337","https://openalex.org/W4285798956","https://openalex.org/W4323546132","https://openalex.org/W4360605395","https://openalex.org/W4377819788","https://openalex.org/W6795140394"],"related_works":["https://openalex.org/W1998662473","https://openalex.org/W2075391483","https://openalex.org/W2742348144","https://openalex.org/W2038820605","https://openalex.org/W1985417357","https://openalex.org/W2955207210","https://openalex.org/W2115053376","https://openalex.org/W2367528910","https://openalex.org/W1991489478","https://openalex.org/W2121416564"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}