{"id":"https://openalex.org/W4321437858","doi":"https://doi.org/10.1007/s10845-023-02082-8","title":"Machine learning enabled optimization of showerhead design for semiconductor deposition process","display_name":"Machine learning enabled optimization of showerhead design for semiconductor deposition process","publication_year":2023,"publication_date":"2023-02-15","ids":{"openalex":"https://openalex.org/W4321437858","doi":"https://doi.org/10.1007/s10845-023-02082-8"},"language":"en","primary_location":{"id":"doi:10.1007/s10845-023-02082-8","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10845-023-02082-8","pdf_url":null,"source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089104945","display_name":"Zeqing Jin","orcid":"https://orcid.org/0000-0003-1106-5478"},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Zeqing Jin","raw_affiliation_strings":["Department of Mechanical Engineering, University of California, Berkeley, CA, 94720-1740, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of California, Berkeley, CA, 94720-1740, USA","institution_ids":["https://openalex.org/I95457486"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034142692","display_name":"Dahyun Daniel Lim","orcid":"https://orcid.org/0000-0002-0581-8253"},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dahyun Daniel Lim","raw_affiliation_strings":["Department of Mechanical Engineering, University of California, Berkeley, CA, 94720-1740, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of California, Berkeley, CA, 94720-1740, USA","institution_ids":["https://openalex.org/I95457486"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028817139","display_name":"Xueying Zhao","orcid":"https://orcid.org/0000-0003-0857-2823"},"institutions":[{"id":"https://openalex.org/I4210139090","display_name":"Lam Research (United States)","ror":"https://ror.org/04gecbm52","country_code":"US","type":"company","lineage":["https://openalex.org/I4210139090"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xueying Zhao","raw_affiliation_strings":["Lam Research Corporation, 4650 Cushing Pkwy, Fremont, CA, 94538, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lam Research Corporation, 4650 Cushing Pkwy, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210139090"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016781128","display_name":"Meenakshi Mamunuru","orcid":null},"institutions":[{"id":"https://openalex.org/I4210139090","display_name":"Lam Research (United States)","ror":"https://ror.org/04gecbm52","country_code":"US","type":"company","lineage":["https://openalex.org/I4210139090"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Meenakshi Mamunuru","raw_affiliation_strings":["Lam Research Corporation, 4650 Cushing Pkwy, Fremont, CA, 94538, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lam Research Corporation, 4650 Cushing Pkwy, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210139090"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024891875","display_name":"Sassan Roham","orcid":null},"institutions":[{"id":"https://openalex.org/I4210139090","display_name":"Lam Research (United States)","ror":"https://ror.org/04gecbm52","country_code":"US","type":"company","lineage":["https://openalex.org/I4210139090"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sassan Roham","raw_affiliation_strings":["Lam Research Corporation, 4650 Cushing Pkwy, Fremont, CA, 94538, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Lam Research Corporation, 4650 Cushing Pkwy, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210139090"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5025067820","display_name":"Grace X. Gu","orcid":"https://orcid.org/0000-0001-7118-3228"},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Grace X. Gu","raw_affiliation_strings":["Department of Mechanical Engineering, University of California, Berkeley, CA, 94720-1740, USA"],"raw_orcid":"https://orcid.org/0000-0001-7118-3228","affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of California, Berkeley, CA, 94720-1740, USA","institution_ids":["https://openalex.org/I95457486"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5089104945"],"corresponding_institution_ids":["https://openalex.org/I95457486"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":3.2834,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.9320356,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":99},"biblio":{"volume":"35","issue":"2","first_page":"925","last_page":"935"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10848","display_name":"Advanced Multi-Objective Optimization Algorithms","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/1703","display_name":"Computational Theory and Mathematics"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10848","display_name":"Advanced Multi-Objective Optimization Algorithms","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/1703","display_name":"Computational Theory and Mathematics"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.982699990272522,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9661999940872192,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.7335363030433655},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.7031389474868774},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.6283762454986572},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6220459342002869},{"id":"https://openalex.org/keywords/bayesian-optimization","display_name":"Bayesian optimization","score":0.5350751876831055},{"id":"https://openalex.org/keywords/semiconductor","display_name":"Semiconductor","score":0.48016634583473206},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.47204670310020447},{"id":"https://openalex.org/keywords/deposition","display_name":"Deposition (geology)","score":0.4263349175453186},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3894503712654114},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3354361057281494},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.30908888578414917},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.22726309299468994},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.22580251097679138},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.16602745652198792}],"concepts":[{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.7335363030433655},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7031389474868774},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.6283762454986572},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6220459342002869},{"id":"https://openalex.org/C2778049539","wikidata":"https://www.wikidata.org/wiki/Q17002908","display_name":"Bayesian optimization","level":2,"score":0.5350751876831055},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.48016634583473206},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.47204670310020447},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.4263349175453186},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3894503712654114},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3354361057281494},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.30908888578414917},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.22726309299468994},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22580251097679138},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.16602745652198792},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10845-023-02082-8","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10845-023-02082-8","pdf_url":null,"source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:RePEc:spr:joinma:v:35:y:2024:i:2:d:10.1007_s10845-023-02082-8","is_oa":false,"landing_page_url":"http://link.springer.com/10.1007/s10845-023-02082-8","pdf_url":null,"source":{"id":"https://openalex.org/S4306401271","display_name":"RePEc: Research Papers in Economics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I77793887","host_organization_name":"Federal Reserve Bank of St. Louis","host_organization_lineage":["https://openalex.org/I77793887"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3342429894","display_name":null,"funder_award_id":"DMREF-2119276","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G367708065","display_name":null,"funder_award_id":"ACI-1548562","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320309441","display_name":"Lam Research","ror":"https://ror.org/04gecbm52"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1571870753","https://openalex.org/W1983377407","https://openalex.org/W2008393947","https://openalex.org/W2128344089","https://openalex.org/W2131241448","https://openalex.org/W2138928158","https://openalex.org/W2257979135","https://openalex.org/W2738347715","https://openalex.org/W2787746867","https://openalex.org/W2800705832","https://openalex.org/W2972796812","https://openalex.org/W3015947126","https://openalex.org/W3040318838","https://openalex.org/W3095388982","https://openalex.org/W3102816564","https://openalex.org/W3135330773","https://openalex.org/W3177828909","https://openalex.org/W3183360516","https://openalex.org/W4210540254","https://openalex.org/W4212966686","https://openalex.org/W4226308878","https://openalex.org/W6675354045"],"related_works":["https://openalex.org/W2378211422","https://openalex.org/W2745001401","https://openalex.org/W4321353415","https://openalex.org/W2130974462","https://openalex.org/W972276598","https://openalex.org/W4246352526","https://openalex.org/W2028665553","https://openalex.org/W2992897358","https://openalex.org/W2631724279","https://openalex.org/W3201368349"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":4}],"updated_date":"2026-05-06T08:25:59.206177","created_date":"2025-10-10T00:00:00"}