{"id":"https://openalex.org/W2884425876","doi":"https://doi.org/10.1007/s10845-018-1437-4","title":"Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process","display_name":"Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process","publication_year":2018,"publication_date":"2018-07-17","ids":{"openalex":"https://openalex.org/W2884425876","doi":"https://doi.org/10.1007/s10845-018-1437-4","mag":"2884425876"},"language":"en","primary_location":{"id":"doi:10.1007/s10845-018-1437-4","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10845-018-1437-4","pdf_url":null,"source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101820618","display_name":"Ki Bum Lee","orcid":"https://orcid.org/0000-0001-5453-6933"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Ki Bum Lee","raw_affiliation_strings":["Department of Industrial Engineering, Yonsei University, Seoul, Republic of Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering, Yonsei University, Seoul, Republic of Korea","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001540138","display_name":"Chang Ouk Kim","orcid":"https://orcid.org/0000-0002-6936-5409"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Chang Ouk Kim","raw_affiliation_strings":["Department of Industrial Engineering, Yonsei University, Seoul, Republic of Korea"],"raw_orcid":"https://orcid.org/0000-0002-6936-5409","affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering, Yonsei University, Seoul, Republic of Korea","institution_ids":["https://openalex.org/I193775966"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5001540138"],"corresponding_institution_ids":["https://openalex.org/I193775966"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":2.8989,"has_fulltext":false,"cited_by_count":70,"citation_normalized_percentile":{"value":0.91045687,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":100},"biblio":{"volume":"31","issue":"1","first_page":"73","last_page":"86"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.9244502782821655},{"id":"https://openalex.org/keywords/convolutional-neural-network","display_name":"Convolutional neural network","score":0.6738677024841309},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6082932353019714},{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.597955048084259},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5692409873008728},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.5305683612823486},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5288563370704651},{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.5277543663978577},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4801216125488281},{"id":"https://openalex.org/keywords/metrology","display_name":"Metrology","score":0.47945964336395264},{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.4755094647407532},{"id":"https://openalex.org/keywords/edge-device","display_name":"Edge device","score":0.467050701379776},{"id":"https://openalex.org/keywords/deep-learning","display_name":"Deep learning","score":0.4631838798522949},{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.4089335501194},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.37221479415893555},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2992401719093323},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.16432568430900574},{"id":"https://openalex.org/keywords/cloud-computing","display_name":"Cloud computing","score":0.08184385299682617},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.07747140526771545},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.07595327496528625}],"concepts":[{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.9244502782821655},{"id":"https://openalex.org/C81363708","wikidata":"https://www.wikidata.org/wiki/Q17084460","display_name":"Convolutional neural network","level":2,"score":0.6738677024841309},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6082932353019714},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.597955048084259},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5692409873008728},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.5305683612823486},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5288563370704651},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.5277543663978577},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4801216125488281},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.47945964336395264},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.4755094647407532},{"id":"https://openalex.org/C138236772","wikidata":"https://www.wikidata.org/wiki/Q25098575","display_name":"Edge device","level":3,"score":0.467050701379776},{"id":"https://openalex.org/C108583219","wikidata":"https://www.wikidata.org/wiki/Q197536","display_name":"Deep learning","level":2,"score":0.4631838798522949},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.4089335501194},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.37221479415893555},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2992401719093323},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.16432568430900574},{"id":"https://openalex.org/C79974875","wikidata":"https://www.wikidata.org/wiki/Q483639","display_name":"Cloud computing","level":2,"score":0.08184385299682617},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.07747140526771545},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.07595327496528625},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10845-018-1437-4","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10845-018-1437-4","pdf_url":null,"source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},{"id":"pmh:oai:RePEc:spr:joinma:v:31:y:2020:i:1:d:10.1007_s10845-018-1437-4","is_oa":false,"landing_page_url":"http://link.springer.com/10.1007/s10845-018-1437-4","pdf_url":null,"source":{"id":"https://openalex.org/S4306401271","display_name":"RePEc: Research Papers in Economics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I77793887","host_organization_name":"Federal Reserve Bank of St. Louis","host_organization_lineage":["https://openalex.org/I77793887"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G254382616","display_name":null,"funder_award_id":"NRF-2016R1A2B4008337","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"},{"id":"https://openalex.org/G8072482183","display_name":null,"funder_award_id":"2015H1A2A1031081","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"}],"funders":[{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":44,"referenced_works":["https://openalex.org/W3489370","https://openalex.org/W1549818157","https://openalex.org/W1598796236","https://openalex.org/W1849277567","https://openalex.org/W2021816127","https://openalex.org/W2030496875","https://openalex.org/W2052939368","https://openalex.org/W2058299210","https://openalex.org/W2068574400","https://openalex.org/W2070963892","https://openalex.org/W2072124697","https://openalex.org/W2072128103","https://openalex.org/W2092826444","https://openalex.org/W2095278535","https://openalex.org/W2099471712","https://openalex.org/W2111845770","https://openalex.org/W2120967219","https://openalex.org/W2132828732","https://openalex.org/W2135387781","https://openalex.org/W2145094598","https://openalex.org/W2150355110","https://openalex.org/W2163605009","https://openalex.org/W2188183693","https://openalex.org/W2226450201","https://openalex.org/W2438393311","https://openalex.org/W2483664965","https://openalex.org/W2507812949","https://openalex.org/W2526280165","https://openalex.org/W2577914922","https://openalex.org/W2594332903","https://openalex.org/W2605630546","https://openalex.org/W2606754133","https://openalex.org/W2614097522","https://openalex.org/W2620931432","https://openalex.org/W2621925205","https://openalex.org/W2773444615","https://openalex.org/W2781369588","https://openalex.org/W2791654535","https://openalex.org/W2794550100","https://openalex.org/W2794933040","https://openalex.org/W2949092679","https://openalex.org/W2990714382","https://openalex.org/W4231109964","https://openalex.org/W6632811585"],"related_works":["https://openalex.org/W2378882722","https://openalex.org/W2154293465","https://openalex.org/W1983603153","https://openalex.org/W2151505334","https://openalex.org/W2507812949","https://openalex.org/W2115540908","https://openalex.org/W4256167503","https://openalex.org/W3216142041","https://openalex.org/W2368784978","https://openalex.org/W2060880752"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":14},{"year":2024,"cited_by_count":9},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":11},{"year":2021,"cited_by_count":16},{"year":2020,"cited_by_count":6},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":2}],"updated_date":"2026-06-19T15:47:20.252518","created_date":"2025-10-10T00:00:00"}