{"id":"https://openalex.org/W4239954986","doi":"https://doi.org/10.1007/s10845-008-0235-9","title":"A particle swarm optimization approach for components placement inspection on printed circuit boards","display_name":"A particle swarm optimization approach for components placement inspection on printed circuit boards","publication_year":2008,"publication_date":"2008-12-22","ids":{"openalex":"https://openalex.org/W4239954986","doi":"https://doi.org/10.1007/s10845-008-0235-9"},"language":"en","primary_location":{"id":"doi:10.1007/s10845-008-0235-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10845-008-0235-9","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10845-008-0235-9.pdf","source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://link.springer.com/content/pdf/10.1007/s10845-008-0235-9.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033890936","display_name":"C.H. Wu","orcid":"https://orcid.org/0000-0003-1259-4048"},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":true,"raw_author_name":"Chun-Ho Wu","raw_affiliation_strings":["Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100740242","display_name":"Dazhi Wang","orcid":"https://orcid.org/0000-0002-5821-7259"},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Da-Zhi Wang","raw_affiliation_strings":["Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058789440","display_name":"W.H. Ip","orcid":"https://orcid.org/0000-0001-6609-0713"},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Andrew Ip","raw_affiliation_strings":["Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019290200","display_name":"Dingwei Wang","orcid":"https://orcid.org/0000-0001-9869-6525"},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Ding-Wei Wang","raw_affiliation_strings":["Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ching-Yuen Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Ching-Yuen Chan","raw_affiliation_strings":["Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100674676","display_name":"Hongfeng Wang","orcid":"https://orcid.org/0000-0002-8954-0876"},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Hong-Feng Wang","raw_affiliation_strings":["Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering (ISE), The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5033890936"],"corresponding_institution_ids":["https://openalex.org/I14243506"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":0.8195,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.83020868,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"20","issue":"5","first_page":"551","last_page":"551"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9253000020980835,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9239000082015991,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.8857996463775635},{"id":"https://openalex.org/keywords/particle-swarm-optimization","display_name":"Particle swarm optimization","score":0.7368100881576538},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3700626492500305},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.36709123849868774},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3279534578323364},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22042390704154968},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.13553592562675476}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.8857996463775635},{"id":"https://openalex.org/C85617194","wikidata":"https://www.wikidata.org/wiki/Q2072794","display_name":"Particle swarm optimization","level":2,"score":0.7368100881576538},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3700626492500305},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.36709123849868774},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3279534578323364},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22042390704154968},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.13553592562675476}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s10845-008-0235-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10845-008-0235-9","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10845-008-0235-9.pdf","source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1007/s10845-008-0235-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10845-008-0235-9","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10845-008-0235-9.pdf","source":{"id":"https://openalex.org/S161464388","display_name":"Journal of Intelligent Manufacturing","issn_l":"0956-5515","issn":["0956-5515","1572-8145"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Intelligent Manufacturing","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322598","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4239954986.pdf","grobid_xml":"https://content.openalex.org/works/W4239954986.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2599361292","https://openalex.org/W4252608911","https://openalex.org/W2184913151","https://openalex.org/W2389426768","https://openalex.org/W2098273855","https://openalex.org/W3147987719","https://openalex.org/W2698654916","https://openalex.org/W3163908127","https://openalex.org/W2013997577"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}