{"id":"https://openalex.org/W2752516004","doi":"https://doi.org/10.1007/s10836-017-5681-x","title":"Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects","display_name":"Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects","publication_year":2017,"publication_date":"2017-09-02","ids":{"openalex":"https://openalex.org/W2752516004","doi":"https://doi.org/10.1007/s10836-017-5681-x","mag":"2752516004"},"language":"en","primary_location":{"id":"doi:10.1007/s10836-017-5681-x","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10836-017-5681-x","pdf_url":null,"source":{"id":"https://openalex.org/S200807567","display_name":"Journal of Electronic Testing","issn_l":"0923-8174","issn":["0923-8174","1573-0727"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Testing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100446549","display_name":"Bei Zhang","orcid":"https://orcid.org/0000-0003-4166-8739"},"institutions":[{"id":"https://openalex.org/I4210153776","display_name":"Apple (United States)","ror":"https://ror.org/059hsda18","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153776"]},{"id":"https://openalex.org/I82497590","display_name":"Auburn University","ror":"https://ror.org/02v80fc35","country_code":"US","type":"education","lineage":["https://openalex.org/I82497590"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Bei Zhang","raw_affiliation_strings":["Apple Inc., Cupertino, CA, 95014, USA","Department of Electrical, Computer Engineering Auburn University, Auburn, AL, 36849, USA","Department of Electrical, Computer Engineering Auburn University, Auburn, USA","Apple Inc., Cupertino, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Apple Inc., Cupertino, CA, 95014, USA","institution_ids":["https://openalex.org/I4210153776"]},{"raw_affiliation_string":"Department of Electrical, Computer Engineering Auburn University, Auburn, AL, 36849, USA","institution_ids":["https://openalex.org/I82497590"]},{"raw_affiliation_string":"Department of Electrical, Computer Engineering Auburn University, Auburn, USA","institution_ids":["https://openalex.org/I82497590"]},{"raw_affiliation_string":"Apple Inc., Cupertino, USA","institution_ids":["https://openalex.org/I4210153776"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5084081268","display_name":"Vishwani D. Agrawal","orcid":"https://orcid.org/0000-0002-7121-5979"},"institutions":[{"id":"https://openalex.org/I82497590","display_name":"Auburn University","ror":"https://ror.org/02v80fc35","country_code":"US","type":"education","lineage":["https://openalex.org/I82497590"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vishwani D. Agrawal","raw_affiliation_strings":["Department of Electrical, Computer Engineering Auburn University, Auburn, AL, 36849, USA","Department of Electrical, Computer Engineering Auburn University, Auburn, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical, Computer Engineering Auburn University, Auburn, AL, 36849, USA","institution_ids":["https://openalex.org/I82497590"]},{"raw_affiliation_string":"Department of Electrical, Computer Engineering Auburn University, Auburn, USA","institution_ids":["https://openalex.org/I82497590"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5100446549"],"corresponding_institution_ids":["https://openalex.org/I4210153776","https://openalex.org/I82497590"],"apc_list":{"value":2990,"currency":"USD","value_usd":2990},"apc_paid":null,"fwci":0.3361,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.613345,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"33","issue":"5","first_page":"573","last_page":"589"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stage","display_name":"Stage (stratigraphy)","score":0.6520408391952515},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5131402611732483},{"id":"https://openalex.org/keywords/bond","display_name":"Bond","score":0.4462354779243469},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.422211229801178},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.3880988359451294},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33211278915405273},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19476667046546936},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.14194941520690918},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.10457485914230347}],"concepts":[{"id":"https://openalex.org/C146357865","wikidata":"https://www.wikidata.org/wiki/Q1123245","display_name":"Stage (stratigraphy)","level":2,"score":0.6520408391952515},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5131402611732483},{"id":"https://openalex.org/C69738904","wikidata":"https://www.wikidata.org/wiki/Q11693","display_name":"Bond","level":2,"score":0.4462354779243469},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.422211229801178},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3880988359451294},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33211278915405273},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19476667046546936},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.14194941520690918},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.10457485914230347},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s10836-017-5681-x","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10836-017-5681-x","pdf_url":null,"source":{"id":"https://openalex.org/S200807567","display_name":"Journal of Electronic Testing","issn_l":"0923-8174","issn":["0923-8174","1573-0727"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Testing","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G7369377914","display_name":null,"funder_award_id":"CCF-1116213","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":34,"referenced_works":["https://openalex.org/W1522190160","https://openalex.org/W1851926202","https://openalex.org/W1965451131","https://openalex.org/W1986486942","https://openalex.org/W1988354418","https://openalex.org/W2002645608","https://openalex.org/W2017359391","https://openalex.org/W2018843712","https://openalex.org/W2022392302","https://openalex.org/W2046045084","https://openalex.org/W2047879375","https://openalex.org/W2052347136","https://openalex.org/W2053532362","https://openalex.org/W2055841712","https://openalex.org/W2056176281","https://openalex.org/W2061598749","https://openalex.org/W2062899780","https://openalex.org/W2068545846","https://openalex.org/W2071208935","https://openalex.org/W2082046960","https://openalex.org/W2083758827","https://openalex.org/W2087916367","https://openalex.org/W2090396476","https://openalex.org/W2124414146","https://openalex.org/W2124647227","https://openalex.org/W2124955733","https://openalex.org/W2146630859","https://openalex.org/W2150113875","https://openalex.org/W2159759061","https://openalex.org/W2168584827","https://openalex.org/W2505380261","https://openalex.org/W2595178983","https://openalex.org/W4231431893","https://openalex.org/W4243369421"],"related_works":["https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W2898370298","https://openalex.org/W2137437058","https://openalex.org/W4390401159","https://openalex.org/W2744391499","https://openalex.org/W3120461830","https://openalex.org/W4230250635","https://openalex.org/W3041790586","https://openalex.org/W2018879842"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-07-25T09:21:30.201066","created_date":"2025-10-10T00:00:00"}