{"id":"https://openalex.org/W2043527044","doi":"https://doi.org/10.1007/s10836-011-5259-y","title":"Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance","display_name":"Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance","publication_year":2011,"publication_date":"2011-11-04","ids":{"openalex":"https://openalex.org/W2043527044","doi":"https://doi.org/10.1007/s10836-011-5259-y","mag":"2043527044"},"language":"en","primary_location":{"id":"doi:10.1007/s10836-011-5259-y","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10836-011-5259-y","pdf_url":null,"source":{"id":"https://openalex.org/S200807567","display_name":"Journal of Electronic Testing","issn_l":"0923-8174","issn":["0923-8174","1573-0727"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Testing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5021627904","display_name":"Valeriy Sukharev","orcid":"https://orcid.org/0000-0002-5647-0584"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["HU","US"],"is_corresponding":true,"raw_author_name":"Valeriy Sukharev","raw_affiliation_strings":["Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","Mentor Graphics Corporation, Fremont, USA 94538#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, USA 94538#TAB#","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036199179","display_name":"Armen Kteyan","orcid":"https://orcid.org/0000-0002-8743-0155"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["HU","US"],"is_corresponding":false,"raw_author_name":"Armen Kteyan","raw_affiliation_strings":["Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","Mentor Graphics Corporation, Fremont, USA 94538#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, USA 94538#TAB#","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089574594","display_name":"Jun-Ho Choy","orcid":"https://orcid.org/0000-0002-8977-5720"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["HU","US"],"is_corresponding":false,"raw_author_name":"Jun-Ho Choy","raw_affiliation_strings":["Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","Mentor Graphics Corporation, Fremont, USA 94538#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, USA 94538#TAB#","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000720628","display_name":"Henrik Hovsepyan","orcid":null},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["HU","US"],"is_corresponding":false,"raw_author_name":"Henrik Hovsepyan","raw_affiliation_strings":["Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","Mentor Graphics Corporation, Fremont, USA 94538#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, USA 94538#TAB#","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013605756","display_name":"Ara Markosian","orcid":null},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["HU","US"],"is_corresponding":false,"raw_author_name":"Ara Markosian","raw_affiliation_strings":["Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","Mentor Graphics Corporation, Fremont, USA 94538#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, 46871 Bayside Parkway, Fremont, CA, 94538, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, USA 94538#TAB#","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088162634","display_name":"Ehrenfried Zschech","orcid":"https://orcid.org/0000-0002-5220-3083"},"institutions":[{"id":"https://openalex.org/I4923324","display_name":"Fraunhofer-Gesellschaft","ror":"https://ror.org/05hkkdn48","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Ehrenfried Zschech","raw_affiliation_strings":["Fraunhofer Institute for Non-Destructive Testing, Maria-Reiche-Strasse 2, 01109, Dresden, Germany","Fraunhofer Institute for Non-Destructive Testing, Dresden, Germany 01109#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Non-Destructive Testing, Maria-Reiche-Strasse 2, 01109, Dresden, Germany","institution_ids":[]},{"raw_affiliation_string":"Fraunhofer Institute for Non-Destructive Testing, Dresden, Germany 01109#TAB#","institution_ids":["https://openalex.org/I4923324"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110082162","display_name":"R. Huebner","orcid":null},"institutions":[{"id":"https://openalex.org/I4923324","display_name":"Fraunhofer-Gesellschaft","ror":"https://ror.org/05hkkdn48","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Rene Huebner","raw_affiliation_strings":["Fraunhofer Institute for Non-Destructive Testing, Maria-Reiche-Strasse 2, 01109, Dresden, Germany","Fraunhofer Institute for Non-Destructive Testing, Dresden, Germany 01109#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Non-Destructive Testing, Maria-Reiche-Strasse 2, 01109, Dresden, Germany","institution_ids":[]},{"raw_affiliation_string":"Fraunhofer Institute for Non-Destructive Testing, Dresden, Germany 01109#TAB#","institution_ids":["https://openalex.org/I4923324"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5021627904"],"corresponding_institution_ids":["https://openalex.org/I105695857","https://openalex.org/I4210156212"],"apc_list":{"value":2990,"currency":"USD","value_usd":2990},"apc_paid":null,"fwci":0.7367,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.70418052,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"28","issue":"1","first_page":"63","last_page":"72"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.6839643716812134},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6496825814247131},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6429280638694763},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6182730197906494},{"id":"https://openalex.org/keywords/calibration","display_name":"Calibration","score":0.6044210195541382},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.5952752232551575},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5769042372703552},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5396122932434082},{"id":"https://openalex.org/keywords/nanoscopic-scale","display_name":"Nanoscopic scale","score":0.506676971912384},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4869276285171509},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4699936807155609},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4103367030620575},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.25404858589172363},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2487221658229828},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.22735372185707092}],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.6839643716812134},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6496825814247131},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6429280638694763},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6182730197906494},{"id":"https://openalex.org/C165838908","wikidata":"https://www.wikidata.org/wiki/Q736777","display_name":"Calibration","level":2,"score":0.6044210195541382},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5952752232551575},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5769042372703552},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5396122932434082},{"id":"https://openalex.org/C45206210","wikidata":"https://www.wikidata.org/wiki/Q2415817","display_name":"Nanoscopic scale","level":2,"score":0.506676971912384},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4869276285171509},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4699936807155609},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4103367030620575},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25404858589172363},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2487221658229828},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22735372185707092},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10836-011-5259-y","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10836-011-5259-y","pdf_url":null,"source":{"id":"https://openalex.org/S200807567","display_name":"Journal of Electronic Testing","issn_l":"0923-8174","issn":["0923-8174","1573-0727"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Testing","raw_type":"journal-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/228041","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/228041","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"journal article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W177718900","https://openalex.org/W1987176210","https://openalex.org/W1989105510","https://openalex.org/W2013222236","https://openalex.org/W2087349198","https://openalex.org/W2107868198","https://openalex.org/W2122603724","https://openalex.org/W2154869256","https://openalex.org/W2591181672","https://openalex.org/W3142078155","https://openalex.org/W3145183695","https://openalex.org/W4237276723"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W3093450488","https://openalex.org/W2027159884","https://openalex.org/W2016589506","https://openalex.org/W3163301441","https://openalex.org/W1522190160","https://openalex.org/W2534942874","https://openalex.org/W2289302158"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":1}],"updated_date":"2026-07-23T08:03:31.855105","created_date":"2025-10-10T00:00:00"}