{"id":"https://openalex.org/W2006674053","doi":"https://doi.org/10.1007/s10836-011-5242-7","title":"Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits","display_name":"Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits","publication_year":2011,"publication_date":"2011-09-08","ids":{"openalex":"https://openalex.org/W2006674053","doi":"https://doi.org/10.1007/s10836-011-5242-7","mag":"2006674053"},"language":"en","primary_location":{"id":"doi:10.1007/s10836-011-5242-7","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10836-011-5242-7","pdf_url":null,"source":{"id":"https://openalex.org/S200807567","display_name":"Journal of Electronic Testing","issn_l":"0923-8174","issn":["0923-8174","1573-0727"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Testing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009778825","display_name":"Benjamin Backes","orcid":null},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Benjamin Backes","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","institution_ids":["https://openalex.org/I392282"]},{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082899090","display_name":"Colin McDonough","orcid":"https://orcid.org/0000-0002-6202-015X"},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Colin McDonough","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","institution_ids":["https://openalex.org/I392282"]},{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110156987","display_name":"Larry Smith","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Larry Smith","raw_affiliation_strings":["SEMATECH, Albany, NY, 12203, USA","SEMATECH, Albany, USA 12203#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SEMATECH, Albany, NY, 12203, USA","institution_ids":[]},{"raw_affiliation_string":"SEMATECH, Albany, USA 12203#TAB#","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5116337743","display_name":"Wei Wang","orcid":"https://orcid.org/0000-0002-2411-7399"},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei Wang","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","institution_ids":["https://openalex.org/I392282"]},{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5079497121","display_name":"Robert Geer","orcid":null},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Robert E. Geer","raw_affiliation_strings":["College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, NY, 12203, USA","institution_ids":["https://openalex.org/I392282"]},{"raw_affiliation_string":"College of Nanoscale Science and Engineering, University at Albany, Albany, USA 12203#TAB#","institution_ids":["https://openalex.org/I392282"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5079497121"],"corresponding_institution_ids":["https://openalex.org/I392282"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":1.0812,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.79302581,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"28","issue":"1","first_page":"53","last_page":"62"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8473596572875977},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.5911203622817993},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5803743600845337},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5618504285812378},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5339705944061279},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5066738724708557},{"id":"https://openalex.org/keywords/isotropy","display_name":"Isotropy","score":0.48268771171569824},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4794172942638397},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.4695461690425873},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.4609639346599579},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.44734570384025574},{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.42772161960601807},{"id":"https://openalex.org/keywords/stress-relaxation","display_name":"Stress relaxation","score":0.41545620560646057},{"id":"https://openalex.org/keywords/modulus","display_name":"Modulus","score":0.41488751769065857},{"id":"https://openalex.org/keywords/plasticity","display_name":"Plasticity","score":0.41484397649765015},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.32287514209747314},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.23533350229263306},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.20048567652702332},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.06948703527450562},{"id":"https://openalex.org/keywords/creep","display_name":"Creep","score":0.06466016173362732}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8473596572875977},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.5911203622817993},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5803743600845337},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5618504285812378},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5339705944061279},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5066738724708557},{"id":"https://openalex.org/C184050105","wikidata":"https://www.wikidata.org/wiki/Q273163","display_name":"Isotropy","level":2,"score":0.48268771171569824},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4794172942638397},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.4695461690425873},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.4609639346599579},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.44734570384025574},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.42772161960601807},{"id":"https://openalex.org/C202974441","wikidata":"https://www.wikidata.org/wiki/Q2576844","display_name":"Stress relaxation","level":3,"score":0.41545620560646057},{"id":"https://openalex.org/C193867417","wikidata":"https://www.wikidata.org/wiki/Q6889814","display_name":"Modulus","level":2,"score":0.41488751769065857},{"id":"https://openalex.org/C79186407","wikidata":"https://www.wikidata.org/wiki/Q472074","display_name":"Plasticity","level":2,"score":0.41484397649765015},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.32287514209747314},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.23533350229263306},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.20048567652702332},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.06948703527450562},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.06466016173362732},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s10836-011-5242-7","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s10836-011-5242-7","pdf_url":null,"source":{"id":"https://openalex.org/S200807567","display_name":"Journal of Electronic Testing","issn_l":"0923-8174","issn":["0923-8174","1573-0727"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Testing","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.44999998807907104,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1610004553","https://openalex.org/W1820006211","https://openalex.org/W2039791890","https://openalex.org/W2040231784","https://openalex.org/W2105849620","https://openalex.org/W2111050606","https://openalex.org/W2115295828","https://openalex.org/W2118017426","https://openalex.org/W2125103619","https://openalex.org/W2126157369","https://openalex.org/W2155144055","https://openalex.org/W2161828806","https://openalex.org/W2172281986","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2016937053","https://openalex.org/W2372312044","https://openalex.org/W2098828199","https://openalex.org/W2045245345","https://openalex.org/W4225160247","https://openalex.org/W2018651675","https://openalex.org/W3092159757","https://openalex.org/W2011027483","https://openalex.org/W2073261424","https://openalex.org/W2066041486"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2026-06-16T07:32:37.131356","created_date":"2025-10-10T00:00:00"}