{"id":"https://openalex.org/W4400265040","doi":"https://doi.org/10.1007/s00371-024-03462-8","title":"PackMolds: computational design of packaging molds for thermoforming","display_name":"PackMolds: computational design of packaging molds for thermoforming","publication_year":2024,"publication_date":"2024-07-01","ids":{"openalex":"https://openalex.org/W4400265040","doi":"https://doi.org/10.1007/s00371-024-03462-8"},"language":"en","primary_location":{"id":"doi:10.1007/s00371-024-03462-8","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00371-024-03462-8","pdf_url":null,"source":{"id":"https://openalex.org/S73060445","display_name":"The Visual Computer","issn_l":"0178-2789","issn":["0178-2789","1432-2315"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The Visual Computer","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5082090254","display_name":"Naoki Kita","orcid":"https://orcid.org/0000-0001-9606-5666"},"institutions":[{"id":"https://openalex.org/I137975476","display_name":"Shinshu University","ror":"https://ror.org/0244rem06","country_code":"JP","type":"education","lineage":["https://openalex.org/I137975476"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Naoki Kita","raw_affiliation_strings":["Shinshu University, Nagano, Japan"],"affiliations":[{"raw_affiliation_string":"Shinshu University, Nagano, Japan","institution_ids":["https://openalex.org/I137975476"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5082090254"],"corresponding_institution_ids":["https://openalex.org/I137975476"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":0.5138,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.63541209,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":96},"biblio":{"volume":"40","issue":"7","first_page":"4689","last_page":"4700"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11349","display_name":"Music Technology and Sound Studies","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11349","display_name":"Music Technology and Sound Studies","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.992900013923645,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoforming","display_name":"Thermoforming","score":0.98387211561203},{"id":"https://openalex.org/keywords/mold","display_name":"Mold","score":0.42450425028800964},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.38180309534072876},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3689870536327362},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.35218197107315063},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.34869688749313354},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3309362232685089},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2441059947013855}],"concepts":[{"id":"https://openalex.org/C26593445","wikidata":"https://www.wikidata.org/wiki/Q1759746","display_name":"Thermoforming","level":2,"score":0.98387211561203},{"id":"https://openalex.org/C2780566776","wikidata":"https://www.wikidata.org/wiki/Q159341","display_name":"Mold","level":2,"score":0.42450425028800964},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38180309534072876},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3689870536327362},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.35218197107315063},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.34869688749313354},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3309362232685089},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2441059947013855}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s00371-024-03462-8","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00371-024-03462-8","pdf_url":null,"source":{"id":"https://openalex.org/S73060445","display_name":"The Visual Computer","issn_l":"0178-2789","issn":["0178-2789","1432-2315"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The Visual Computer","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1482277599","https://openalex.org/W1580065766","https://openalex.org/W2046346382","https://openalex.org/W2143607173","https://openalex.org/W2151098237","https://openalex.org/W2156247583","https://openalex.org/W2501142486","https://openalex.org/W2512253991","https://openalex.org/W2553907263","https://openalex.org/W2810285611","https://openalex.org/W2810692436","https://openalex.org/W2921781100","https://openalex.org/W2961941541","https://openalex.org/W2973672622","https://openalex.org/W3109881732","https://openalex.org/W4200084430","https://openalex.org/W4233690291","https://openalex.org/W4283018751","https://openalex.org/W4292636054","https://openalex.org/W6602913128"],"related_works":["https://openalex.org/W4386303310","https://openalex.org/W2268363747","https://openalex.org/W4241276717","https://openalex.org/W2917753773","https://openalex.org/W2095785467","https://openalex.org/W2352357228","https://openalex.org/W2335864574","https://openalex.org/W2365854243","https://openalex.org/W4248287343","https://openalex.org/W289284675"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}