{"id":"https://openalex.org/W7138081762","doi":"https://doi.org/10.1007/s00366-026-02290-9","title":"Sim-to-real diffusion models for microstructure prediction in metal additive manufacturing","display_name":"Sim-to-real diffusion models for microstructure prediction in metal additive manufacturing","publication_year":2026,"publication_date":"2026-03-17","ids":{"openalex":"https://openalex.org/W7138081762","doi":"https://doi.org/10.1007/s00366-026-02290-9"},"language":"en","primary_location":{"id":"doi:10.1007/s00366-026-02290-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s00366-026-02290-9","pdf_url":null,"source":{"id":"https://openalex.org/S89333158","display_name":"Engineering With Computers","issn_l":"0177-0667","issn":["0177-0667","1435-5663"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering with Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.1007/s00366-026-02290-9","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5104202644","display_name":"Ziyuan Xie","orcid":null},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Ziyuan Xie","raw_affiliation_strings":["Department of Civil and Environmental Engineering, The Hong Kong University of Science and Technology, Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Civil and Environmental Engineering, The Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5129641751","display_name":"Zichuan Fu","orcid":null},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]},{"id":"https://openalex.org/I90610280","display_name":"South China University of Technology","ror":"https://ror.org/0530pts50","country_code":"CN","type":"education","lineage":["https://openalex.org/I90610280"]}],"countries":["CN","HK"],"is_corresponding":false,"raw_author_name":"Zichuan Fu","raw_affiliation_strings":["Smart Manufacturing Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, 511453, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Smart Manufacturing Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, 511453, China","institution_ids":["https://openalex.org/I90610280","https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jingchi Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]},{"id":"https://openalex.org/I90610280","display_name":"South China University of Technology","ror":"https://ror.org/0530pts50","country_code":"CN","type":"education","lineage":["https://openalex.org/I90610280"]}],"countries":["CN","HK"],"is_corresponding":false,"raw_author_name":"Jingchi Zhang","raw_affiliation_strings":["Smart Manufacturing Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, 511453, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Smart Manufacturing Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, 511453, China","institution_ids":["https://openalex.org/I90610280","https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069604707","display_name":"Kaihao Zhang","orcid":"https://orcid.org/0000-0003-4804-3715"},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]},{"id":"https://openalex.org/I90610280","display_name":"South China University of Technology","ror":"https://ror.org/0530pts50","country_code":"CN","type":"education","lineage":["https://openalex.org/I90610280"]}],"countries":["CN","HK"],"is_corresponding":false,"raw_author_name":"Kaihao Zhang","raw_affiliation_strings":["Smart Manufacturing Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, 511453, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Smart Manufacturing Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, 511453, China","institution_ids":["https://openalex.org/I90610280","https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5129704908","display_name":"Tianchen Zeng","orcid":null},"institutions":[{"id":"https://openalex.org/I37461747","display_name":"Wuhan University","ror":"https://ror.org/033vjfk17","country_code":"CN","type":"education","lineage":["https://openalex.org/I37461747"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianchen Zeng","raw_affiliation_strings":["School of Computer Science, Wuhan University, Wuhan, 430072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Computer Science, Wuhan University, Wuhan, 430072, China","institution_ids":["https://openalex.org/I37461747"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5129715983","display_name":"Yu Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I37461747","display_name":"Wuhan University","ror":"https://ror.org/033vjfk17","country_code":"CN","type":"education","lineage":["https://openalex.org/I37461747"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yu Wu","raw_affiliation_strings":["School of Computer Science, Wuhan University, Wuhan, 430072, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Computer Science, Wuhan University, Wuhan, 430072, China","institution_ids":["https://openalex.org/I37461747"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089768184","display_name":"Shuheng Liao","orcid":"https://orcid.org/0000-0001-7064-0722"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"HK","type":"education","lineage":["https://openalex.org/I177725633"]},{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["HK","US"],"is_corresponding":false,"raw_author_name":"Shuheng Liao","raw_affiliation_strings":["Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA","Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA","institution_ids":["https://openalex.org/I63966007"]},{"raw_affiliation_string":"Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057749373","display_name":"Xiaodong Li","orcid":"https://orcid.org/0000-0003-2348-926X"},"institutions":[{"id":"https://openalex.org/I3019120426","display_name":"China Iron and Steel Research Institute Group","ror":"https://ror.org/02e42hc22","country_code":"CN","type":"facility","lineage":["https://openalex.org/I3019120426"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiang Li","raw_affiliation_strings":["China Iron and Steel Research Institute Group, Beijing, 100081, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"China Iron and Steel Research Institute Group, Beijing, 100081, China","institution_ids":["https://openalex.org/I3019120426"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5069417521","display_name":"Tianju Xue","orcid":"https://orcid.org/0000-0002-2710-9802"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":true,"raw_author_name":"Tianju Xue","raw_affiliation_strings":["Department of Civil and Environmental Engineering, The Hong Kong University of Science and Technology, Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Civil and Environmental Engineering, The Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5069417521"],"corresponding_institution_ids":["https://openalex.org/I200769079"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":{"value":2390,"currency":"EUR","value_usd":2990},"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.53825668,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"42","issue":"2","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.27300000190734863,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.27300000190734863,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11948","display_name":"Machine Learning in Materials Science","score":0.210099995136261,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11087","display_name":"Solidification and crystal growth phenomena","score":0.1915999948978424,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.6674000024795532},{"id":"https://openalex.org/keywords/leverage","display_name":"Leverage (statistics)","score":0.5350000262260437},{"id":"https://openalex.org/keywords/diffusion","display_name":"Diffusion","score":0.4749000072479248},{"id":"https://openalex.org/keywords/extrapolation","display_name":"Extrapolation","score":0.46709999442100525},{"id":"https://openalex.org/keywords/probabilistic-logic","display_name":"Probabilistic logic","score":0.45969998836517334},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.41510000824928284},{"id":"https://openalex.org/keywords/generalization","display_name":"Generalization","score":0.36660000681877136}],"concepts":[{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.6674000024795532},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5501999855041504},{"id":"https://openalex.org/C153083717","wikidata":"https://www.wikidata.org/wiki/Q6535263","display_name":"Leverage (statistics)","level":2,"score":0.5350000262260437},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.4749000072479248},{"id":"https://openalex.org/C132459708","wikidata":"https://www.wikidata.org/wiki/Q744069","display_name":"Extrapolation","level":2,"score":0.46709999442100525},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4602999985218048},{"id":"https://openalex.org/C49937458","wikidata":"https://www.wikidata.org/wiki/Q2599292","display_name":"Probabilistic logic","level":2,"score":0.45969998836517334},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.41510000824928284},{"id":"https://openalex.org/C177148314","wikidata":"https://www.wikidata.org/wiki/Q170084","display_name":"Generalization","level":2,"score":0.36660000681877136},{"id":"https://openalex.org/C68710425","wikidata":"https://www.wikidata.org/wiki/Q5275442","display_name":"Diffusion process","level":3,"score":0.36340001225471497},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.30059999227523804},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.29750001430511475},{"id":"https://openalex.org/C67186912","wikidata":"https://www.wikidata.org/wiki/Q367664","display_name":"Data modeling","level":2,"score":0.29499998688697815},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.28940001130104065},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.28839999437332153},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.2808000147342682},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.27790001034736633},{"id":"https://openalex.org/C114289077","wikidata":"https://www.wikidata.org/wiki/Q3284399","display_name":"Statistical model","level":2,"score":0.27000001072883606},{"id":"https://openalex.org/C459310","wikidata":"https://www.wikidata.org/wiki/Q117801","display_name":"Computational science","level":1,"score":0.25949999690055847},{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.25850000977516174},{"id":"https://openalex.org/C207114421","wikidata":"https://www.wikidata.org/wiki/Q133900","display_name":"Diffraction","level":2,"score":0.25209999084472656}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s00366-026-02290-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s00366-026-02290-9","pdf_url":null,"source":{"id":"https://openalex.org/S89333158","display_name":"Engineering With Computers","issn_l":"0177-0667","issn":["0177-0667","1435-5663"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering with Computers","raw_type":"journal-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-170582","is_oa":false,"landing_page_url":"http://repository.hkust.edu.hk/ir/Record/1783.1-170582","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Article"}],"best_oa_location":{"id":"doi:10.1007/s00366-026-02290-9","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s00366-026-02290-9","pdf_url":null,"source":{"id":"https://openalex.org/S89333158","display_name":"Engineering With Computers","issn_l":"0177-0667","issn":["0177-0667","1435-5663"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering with Computers","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320323537","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":49,"referenced_works":["https://openalex.org/W1901129140","https://openalex.org/W1968948623","https://openalex.org/W2007907673","https://openalex.org/W2024654735","https://openalex.org/W2033220524","https://openalex.org/W2050236324","https://openalex.org/W2076350013","https://openalex.org/W2089018327","https://openalex.org/W2102605133","https://openalex.org/W2108598243","https://openalex.org/W2113216490","https://openalex.org/W2118922968","https://openalex.org/W2128728535","https://openalex.org/W2183341477","https://openalex.org/W2217491568","https://openalex.org/W2253429366","https://openalex.org/W2503161491","https://openalex.org/W2532053579","https://openalex.org/W2606292481","https://openalex.org/W2758567842","https://openalex.org/W2767050701","https://openalex.org/W2783380558","https://openalex.org/W2799973040","https://openalex.org/W2809417563","https://openalex.org/W2889333773","https://openalex.org/W2900608483","https://openalex.org/W2935964236","https://openalex.org/W2981593109","https://openalex.org/W2998489916","https://openalex.org/W3004394594","https://openalex.org/W3087973910","https://openalex.org/W3088310808","https://openalex.org/W3158154976","https://openalex.org/W3171062964","https://openalex.org/W3186352373","https://openalex.org/W3199809049","https://openalex.org/W4205304553","https://openalex.org/W4210651434","https://openalex.org/W4296689026","https://openalex.org/W4315782922","https://openalex.org/W4318978575","https://openalex.org/W4387195417","https://openalex.org/W4387360324","https://openalex.org/W4390078271","https://openalex.org/W4392282713","https://openalex.org/W4400731779","https://openalex.org/W4402917205","https://openalex.org/W4407626411","https://openalex.org/W4413145466"],"related_works":[],"abstract_inverted_index":{"Abstract":[0],"Metal":[1],"additive":[2],"manufacturing":[3,97,212],"is":[4,147],"an":[5],"efficient":[6],"technique":[7],"for":[8,32,66,127],"producing":[9],"metallic":[10],"components":[11],"with":[12,81,167,189],"high":[13],"flexibility.":[14],"Understanding":[15],"the":[16,51,105,168,172,175,202],"mechanical":[17],"properties":[18],"of":[19,25,73,93,107,140,157,170,174],"printed":[20],"parts":[21],"requires":[22],"detailed":[23],"analysis":[24],"their":[26,221],"microstructures.":[27,144],"While":[28],"experiments":[29],"are":[30,37],"reliable":[31],"capturing":[33],"as-printed":[34],"microstructures,":[35],"they":[36],"often":[38],"costly":[39],"and":[40,111,197],"time-consuming.":[41],"Alternatively,":[42],"numerical":[43],"simulations":[44],"have":[45],"become":[46],"valuable":[47],"tools":[48],"to":[49,88,123],"reduce":[50],"reliance":[52],"on":[53,117,136],"trial-and-error":[54],"experimentation,":[55],"powered":[56],"by":[57,181,217],"recent":[58],"advances":[59],"in":[60],"high-performance":[61],"computing":[62],"such":[63],"as":[64],"GPUs":[65],"acceleration.":[67],"However,":[68],"a":[69,90,113,134,137,153],"key":[70],"question":[71],"remains":[72],"effectively":[74],"combining":[75],"high-fidelity,":[76],"yet":[77,84],"expensive,":[78],"experiment":[79],"data":[80,87],"relatively":[82,154],"lower-fidelity,":[83],"massive,":[85],"simulation":[86,218],"achieve":[89],"coherent":[91],"prediction":[92,208],"microstructures":[94,126,179],"under":[95,209],"various":[96],"process":[98,213],"conditions.":[99],"In":[100,200],"this":[101],"study,":[102],"we":[103,132],"leverage":[104],"power":[106],"deep":[108],"generative":[109],"models":[110,185,205],"propose":[112],"sim-to-real":[114,183,203],"framework":[115],"based":[116],"denoising":[118],"diffusion":[119,184,204],"probabilistic":[120],"model":[121,146],"(DDPM)":[122],"generate":[124],"realistic":[125],"additively":[128],"manufactured":[129],"products.":[130],"Specifically,":[131],"pre-train":[133],"DDPM":[135],"large":[138],"dataset":[139],"phase-field":[141],"(PF)":[142],"simulated":[143],"This":[145],"then":[148],"fine-tuned":[149],"or":[150],"distilled":[151],"using":[152,193],"small":[155],"set":[156],"microstructure":[158],"images":[159],"obtained":[160],"from":[161],"electron":[162],"backscatter":[163],"diffraction":[164],"(EBSD)":[165],"experiments,":[166],"goal":[169],"enhancing":[171],"authenticity":[173],"generated":[176,180],"images.":[177],"The":[178],"our":[182],"show":[186,206],"strong":[187],"agreement":[188],"experimental":[190,211],"results,":[191],"evaluated":[192],"both":[194],"machine":[195],"learning":[196],"physics-based":[198],"metrics.":[199],"particular,":[201],"accurate":[207],"unseen":[210],"conditions":[214],"(but":[215],"covered":[216],"data),":[219],"demonstrating":[220],"excellent":[222],"generalization":[223],"ability.":[224]},"counts_by_year":[],"updated_date":"2026-05-03T08:25:01.440150","created_date":"2026-03-18T00:00:00"}