{"id":"https://openalex.org/W2974313353","doi":"https://doi.org/10.1007/s00366-019-00859-1","title":"Recognition and classification of protrusion features on thin-wall parts for mold flow analysis","display_name":"Recognition and classification of protrusion features on thin-wall parts for mold flow analysis","publication_year":2019,"publication_date":"2019-09-20","ids":{"openalex":"https://openalex.org/W2974313353","doi":"https://doi.org/10.1007/s00366-019-00859-1","mag":"2974313353"},"language":"en","primary_location":{"id":"doi:10.1007/s00366-019-00859-1","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00366-019-00859-1","pdf_url":null,"source":{"id":"https://openalex.org/S89333158","display_name":"Engineering With Computers","issn_l":"0177-0667","issn":["0177-0667","1435-5663"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering with Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011484451","display_name":"Jiing\u2010Yih Lai","orcid":"https://orcid.org/0000-0002-0495-0826"},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Jiing-Yih Lai","raw_affiliation_strings":["National Central University, Taoy\u00fcan, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-0495-0826","affiliations":[{"raw_affiliation_string":"National Central University, Taoy\u00fcan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073328387","display_name":"Pei-Pu Song","orcid":"https://orcid.org/0000-0001-5937-5841"},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pei-Pu Song","raw_affiliation_strings":["National Central University, Taoy\u00fcan, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Central University, Taoy\u00fcan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068279975","display_name":"An-Sheng Hsiao","orcid":null},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"An-Sheng Hsiao","raw_affiliation_strings":["National Central University, Taoy\u00fcan, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Central University, Taoy\u00fcan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011387983","display_name":"Yao-Chen Tsai","orcid":"https://orcid.org/0000-0002-3408-8835"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yao-Chen Tsai","raw_affiliation_strings":["CoreTech System (Moldex3D) Co., Ltd., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CoreTech System (Moldex3D) Co., Ltd., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109476386","display_name":"Chia-Hsiang Hsu","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Chia-Hsiang Hsu","raw_affiliation_strings":["CoreTech System (Moldex3D) Co., Ltd., Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CoreTech System (Moldex3D) Co., Ltd., Hsinchu, Taiwan","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5011484451"],"corresponding_institution_ids":["https://openalex.org/I22265921"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":0.4265,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.70721267,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":"37","issue":"2","first_page":"833","last_page":"854"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.6805469989776611},{"id":"https://openalex.org/keywords/polygon","display_name":"Polygon (computer graphics)","score":0.6315547823905945},{"id":"https://openalex.org/keywords/molding","display_name":"Molding (decorative)","score":0.5910387635231018},{"id":"https://openalex.org/keywords/mold","display_name":"Mold","score":0.5303364992141724},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.4803391695022583},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45879432559013367},{"id":"https://openalex.org/keywords/flow","display_name":"Flow (mathematics)","score":0.45437711477279663},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.45400571823120117},{"id":"https://openalex.org/keywords/medial-axis","display_name":"Medial axis","score":0.45389223098754883},{"id":"https://openalex.org/keywords/feature-recognition","display_name":"Feature recognition","score":0.43522557616233826},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.42471837997436523},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.39440709352493286},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27176758646965027},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2194461226463318},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.21672624349594116},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.2004607617855072},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.18312311172485352},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.10171166062355042}],"concepts":[{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.6805469989776611},{"id":"https://openalex.org/C190694206","wikidata":"https://www.wikidata.org/wiki/Q3276654","display_name":"Polygon (computer graphics)","level":3,"score":0.6315547823905945},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.5910387635231018},{"id":"https://openalex.org/C2780566776","wikidata":"https://www.wikidata.org/wiki/Q159341","display_name":"Mold","level":2,"score":0.5303364992141724},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.4803391695022583},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45879432559013367},{"id":"https://openalex.org/C38349280","wikidata":"https://www.wikidata.org/wiki/Q1434290","display_name":"Flow (mathematics)","level":2,"score":0.45437711477279663},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.45400571823120117},{"id":"https://openalex.org/C185877587","wikidata":"https://www.wikidata.org/wiki/Q1757407","display_name":"Medial axis","level":2,"score":0.45389223098754883},{"id":"https://openalex.org/C180863505","wikidata":"https://www.wikidata.org/wiki/Q5439687","display_name":"Feature recognition","level":3,"score":0.43522557616233826},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.42471837997436523},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.39440709352493286},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27176758646965027},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2194461226463318},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.21672624349594116},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.2004607617855072},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.18312311172485352},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10171166062355042},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C126042441","wikidata":"https://www.wikidata.org/wiki/Q1324888","display_name":"Frame (networking)","level":2,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s00366-019-00859-1","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00366-019-00859-1","pdf_url":null,"source":{"id":"https://openalex.org/S89333158","display_name":"Engineering With Computers","issn_l":"0177-0667","issn":["0177-0667","1435-5663"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering with Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/11","score":0.550000011920929,"display_name":"Sustainable cities and communities"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1995870875","https://openalex.org/W1997452915","https://openalex.org/W1999344178","https://openalex.org/W2019465675","https://openalex.org/W2031033796","https://openalex.org/W2046224823","https://openalex.org/W2047191811","https://openalex.org/W2093260076","https://openalex.org/W2156467938","https://openalex.org/W2396820445","https://openalex.org/W2554804529","https://openalex.org/W2556105690","https://openalex.org/W2778210191","https://openalex.org/W2905941526","https://openalex.org/W2970383918"],"related_works":["https://openalex.org/W2369675323","https://openalex.org/W2393029342","https://openalex.org/W2042919292","https://openalex.org/W2088241881","https://openalex.org/W114295518","https://openalex.org/W2355810168","https://openalex.org/W2977305523","https://openalex.org/W3012702573","https://openalex.org/W1966009892","https://openalex.org/W2167764342"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}