{"id":"https://openalex.org/W2078526475","doi":"https://doi.org/10.1007/s00366-007-0086-6","title":"ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems","display_name":"ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems","publication_year":2008,"publication_date":"2008-01-07","ids":{"openalex":"https://openalex.org/W2078526475","doi":"https://doi.org/10.1007/s00366-007-0086-6","mag":"2078526475"},"language":"en","primary_location":{"id":"doi:10.1007/s00366-007-0086-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00366-007-0086-6","pdf_url":null,"source":{"id":"https://openalex.org/S89333158","display_name":"Engineering With Computers","issn_l":"0177-0667","issn":["0177-0667","1435-5663"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering with Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102152310","display_name":"Sai Zeng","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sai Zeng","raw_affiliation_strings":["IBM T.J. Watson Research Center, 19 Skyline Dr, Hawthorne, NY, 10532, USA","IBM T. J. Watson Research Center, 19 Skyline Dr, 10532, Hawthorne, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Center, 19 Skyline Dr, Hawthorne, NY, 10532, USA","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"IBM T. J. Watson Research Center, 19 Skyline Dr, 10532, Hawthorne, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079349713","display_name":"Russell S. Peak","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Russell S. Peak","raw_affiliation_strings":["Product & Systems Lifecycle Management Center, Georgia Institute of Technology, 813 Ferst Drive MARC 373, Atlanta, GA, 30332, USA","Georgia Institute of Technology, Product & Systems Lifecycle Management Center, 813 Ferst Drive MARC 373, 30332, Atlanta, GA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Product & Systems Lifecycle Management Center, Georgia Institute of Technology, 813 Ferst Drive MARC 373, Atlanta, GA, 30332, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Georgia Institute of Technology, Product & Systems Lifecycle Management Center, 813 Ferst Drive MARC 373, 30332, Atlanta, GA, USA#TAB#","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040677434","display_name":"Angran Xiao","orcid":"https://orcid.org/0000-0003-3536-6240"},"institutions":[{"id":"https://openalex.org/I161165907","display_name":"Southeast Missouri State University","ror":"https://ror.org/010n41y16","country_code":"US","type":"education","lineage":["https://openalex.org/I161165907"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Angran Xiao","raw_affiliation_strings":["Department of Industrial and Engineering Technology, Southeast Missouri State University, Cape Girardeau, MO, 63701, USA","Southeast Missouri State University, Department of Industrial and Engineering Technology, 813 Ferst Drive MARC 373, 63701, Cape Girardeau, MO, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Engineering Technology, Southeast Missouri State University, Cape Girardeau, MO, 63701, USA","institution_ids":["https://openalex.org/I161165907"]},{"raw_affiliation_string":"Southeast Missouri State University, Department of Industrial and Engineering Technology, 813 Ferst Drive MARC 373, 63701, Cape Girardeau, MO, USA#TAB#","institution_ids":["https://openalex.org/I161165907"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5013434958","display_name":"Suresh K. Sitaraman","orcid":"https://orcid.org/0000-0003-3398-183X"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Suresh Sitaraman","raw_affiliation_strings":["Computer-Aided Simulation of Packaging Reliability Laboratory, George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA","Georgia Institute of Technology, Computer-Aided Simulation of Packaging Reliability Laboratory, George W. Woodruff School of Mechanical Engineering, 813 Ferst Drive MARC 373, 30332, Atlanta, GA, U ...#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer-Aided Simulation of Packaging Reliability Laboratory, George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Georgia Institute of Technology, Computer-Aided Simulation of Packaging Reliability Laboratory, George W. Woodruff School of Mechanical Engineering, 813 Ferst Drive MARC 373, 30332, Atlanta, GA, U ...#TAB#","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5079349713"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":{"value":2390,"currency":"EUR","value_usd":2990},"apc_paid":null,"fwci":3.3465,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.91636176,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"24","issue":"4","first_page":"359","last_page":"381"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.970300018787384,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9696000218391418,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.6786938905715942},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6520562171936035},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.5522775053977966},{"id":"https://openalex.org/keywords/reusability","display_name":"Reusability","score":0.5291457772254944},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.47478172183036804},{"id":"https://openalex.org/keywords/grid","display_name":"Grid","score":0.4704909324645996},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.45203840732574463},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.45015212893486023},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4439290463924408},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.4378141164779663},{"id":"https://openalex.org/keywords/topology-optimization","display_name":"Topology optimization","score":0.4280993938446045},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.3285260796546936},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.2978898882865906},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2349950671195984},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.15809738636016846}],"concepts":[{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6786938905715942},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6520562171936035},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.5522775053977966},{"id":"https://openalex.org/C137981799","wikidata":"https://www.wikidata.org/wiki/Q1369184","display_name":"Reusability","level":3,"score":0.5291457772254944},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.47478172183036804},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.4704909324645996},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.45203840732574463},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.45015212893486023},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4439290463924408},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.4378141164779663},{"id":"https://openalex.org/C189216461","wikidata":"https://www.wikidata.org/wiki/Q2443456","display_name":"Topology optimization","level":3,"score":0.4280993938446045},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.3285260796546936},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.2978898882865906},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2349950671195984},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.15809738636016846},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/s00366-007-0086-6","is_oa":false,"landing_page_url":"https://doi.org/10.1007/s00366-007-0086-6","pdf_url":null,"source":{"id":"https://openalex.org/S89333158","display_name":"Engineering With Computers","issn_l":"0177-0667","issn":["0177-0667","1435-5663"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Engineering with Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":51,"referenced_works":["https://openalex.org/W193938798","https://openalex.org/W204440870","https://openalex.org/W418442035","https://openalex.org/W583749824","https://openalex.org/W1482953092","https://openalex.org/W1490482062","https://openalex.org/W1550014636","https://openalex.org/W1595179882","https://openalex.org/W1972656198","https://openalex.org/W1972870013","https://openalex.org/W1974057069","https://openalex.org/W1979545934","https://openalex.org/W2000000890","https://openalex.org/W2001102988","https://openalex.org/W2001628820","https://openalex.org/W2020932430","https://openalex.org/W2022648431","https://openalex.org/W2025250075","https://openalex.org/W2037077804","https://openalex.org/W2041685491","https://openalex.org/W2042791719","https://openalex.org/W2045639139","https://openalex.org/W2050083790","https://openalex.org/W2050235300","https://openalex.org/W2054597525","https://openalex.org/W2057654731","https://openalex.org/W2059029870","https://openalex.org/W2059340972","https://openalex.org/W2059621335","https://openalex.org/W2060375989","https://openalex.org/W2060489052","https://openalex.org/W2060613165","https://openalex.org/W2065194132","https://openalex.org/W2075234656","https://openalex.org/W2080956671","https://openalex.org/W2111248008","https://openalex.org/W2114969937","https://openalex.org/W2116828361","https://openalex.org/W2129950646","https://openalex.org/W2161933592","https://openalex.org/W2164945737","https://openalex.org/W2168235826","https://openalex.org/W2305888372","https://openalex.org/W2336918561","https://openalex.org/W2337791039","https://openalex.org/W2401506274","https://openalex.org/W2498832965","https://openalex.org/W2514900216","https://openalex.org/W2908551313","https://openalex.org/W3139409178","https://openalex.org/W4250228136"],"related_works":["https://openalex.org/W2215606090","https://openalex.org/W2394142092","https://openalex.org/W2131591406","https://openalex.org/W1594229218","https://openalex.org/W2380963126","https://openalex.org/W2160425906","https://openalex.org/W2385207382","https://openalex.org/W1544908136","https://openalex.org/W2046000243","https://openalex.org/W2359413960"],"abstract_inverted_index":null,"counts_by_year":[{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-06-16T07:32:37.131356","created_date":"2025-10-10T00:00:00"}