{"id":"https://openalex.org/W2912569830","doi":"https://doi.org/10.1007/978-981-13-5950-7_22","title":"Fabrication of Molybdenum MEMs Structures Using Dry and Wet Etching","display_name":"Fabrication of Molybdenum MEMs Structures Using Dry and Wet Etching","publication_year":2019,"publication_date":"2019-01-01","ids":{"openalex":"https://openalex.org/W2912569830","doi":"https://doi.org/10.1007/978-981-13-5950-7_22","mag":"2912569830"},"language":"en","primary_location":{"id":"doi:10.1007/978-981-13-5950-7_22","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-981-13-5950-7_22","pdf_url":null,"source":{"id":"https://openalex.org/S2764900261","display_name":"Communications in computer and information science","issn_l":"1865-0929","issn":["1865-0929","1865-0937"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Communications in Computer and Information Science","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073449381","display_name":"Sandeep Singh Chauhan","orcid":"https://orcid.org/0000-0003-4629-1117"},"institutions":[{"id":"https://openalex.org/I154851008","display_name":"Indian Institute of Technology Roorkee","ror":"https://ror.org/00582g326","country_code":"IN","type":"education","lineage":["https://openalex.org/I154851008"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Sandeep Singh Chauhan","raw_affiliation_strings":["Microelectronics Laboratory, Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, 247667, India"],"affiliations":[{"raw_affiliation_string":"Microelectronics Laboratory, Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, 247667, India","institution_ids":["https://openalex.org/I154851008"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087971045","display_name":"J Niharika","orcid":null},"institutions":[{"id":"https://openalex.org/I154851008","display_name":"Indian Institute of Technology Roorkee","ror":"https://ror.org/00582g326","country_code":"IN","type":"education","lineage":["https://openalex.org/I154851008"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Niharika J","raw_affiliation_strings":["Microelectronics Laboratory, Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, 247667, India"],"affiliations":[{"raw_affiliation_string":"Microelectronics Laboratory, Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, 247667, India","institution_ids":["https://openalex.org/I154851008"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082117002","display_name":"M. M. Joglekar","orcid":"https://orcid.org/0000-0003-0525-3923"},"institutions":[{"id":"https://openalex.org/I154851008","display_name":"Indian Institute of Technology Roorkee","ror":"https://ror.org/00582g326","country_code":"IN","type":"education","lineage":["https://openalex.org/I154851008"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"M. M. Joglekar","raw_affiliation_strings":["Department of Mechanical and Industrial Engineering, Indian Institute of Technology, Roorkee, 247667, India"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Industrial Engineering, Indian Institute of Technology, Roorkee, 247667, India","institution_ids":["https://openalex.org/I154851008"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059645325","display_name":"S. K. Manhas","orcid":"https://orcid.org/0000-0003-3360-9683"},"institutions":[{"id":"https://openalex.org/I154851008","display_name":"Indian Institute of Technology Roorkee","ror":"https://ror.org/00582g326","country_code":"IN","type":"education","lineage":["https://openalex.org/I154851008"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"S. K. Manhas","raw_affiliation_strings":["Microelectronics Laboratory, Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, 247667, India"],"affiliations":[{"raw_affiliation_string":"Microelectronics Laboratory, Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, 247667, India","institution_ids":["https://openalex.org/I154851008"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5073449381"],"corresponding_institution_ids":["https://openalex.org/I154851008"],"apc_list":null,"apc_paid":null,"fwci":1.4886,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.77381301,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"254","last_page":"263"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8184401988983154},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.7915796637535095},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7913236618041992},{"id":"https://openalex.org/keywords/stiction","display_name":"Stiction","score":0.7791239619255066},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.6983521580696106},{"id":"https://openalex.org/keywords/dry-etching","display_name":"Dry etching","score":0.5844740867614746},{"id":"https://openalex.org/keywords/sputtering","display_name":"Sputtering","score":0.5690270066261292},{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.5643599033355713},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5609550476074219},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5427317023277283},{"id":"https://openalex.org/keywords/scanning-electron-microscope","display_name":"Scanning electron microscope","score":0.5224639177322388},{"id":"https://openalex.org/keywords/molybdenum","display_name":"Molybdenum","score":0.520098090171814},{"id":"https://openalex.org/keywords/sputter-deposition","display_name":"Sputter deposition","score":0.5162606239318848},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.4895249605178833},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4820609986782074},{"id":"https://openalex.org/keywords/bulk-micromachining","display_name":"Bulk micromachining","score":0.43086937069892883},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3764646351337433},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.24775147438049316},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.23370260000228882}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8184401988983154},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7915796637535095},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7913236618041992},{"id":"https://openalex.org/C110339231","wikidata":"https://www.wikidata.org/wiki/Q2143425","display_name":"Stiction","level":3,"score":0.7791239619255066},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6983521580696106},{"id":"https://openalex.org/C1291036","wikidata":"https://www.wikidata.org/wiki/Q1191918","display_name":"Dry etching","level":4,"score":0.5844740867614746},{"id":"https://openalex.org/C22423302","wikidata":"https://www.wikidata.org/wiki/Q898444","display_name":"Sputtering","level":3,"score":0.5690270066261292},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.5643599033355713},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5609550476074219},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5427317023277283},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.5224639177322388},{"id":"https://openalex.org/C549387045","wikidata":"https://www.wikidata.org/wiki/Q1053","display_name":"Molybdenum","level":2,"score":0.520098090171814},{"id":"https://openalex.org/C61427134","wikidata":"https://www.wikidata.org/wiki/Q847609","display_name":"Sputter deposition","level":4,"score":0.5162606239318848},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.4895249605178833},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4820609986782074},{"id":"https://openalex.org/C41075158","wikidata":"https://www.wikidata.org/wiki/Q4996485","display_name":"Bulk micromachining","level":5,"score":0.43086937069892883},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3764646351337433},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.24775147438049316},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.23370260000228882},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-981-13-5950-7_22","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-981-13-5950-7_22","pdf_url":null,"source":{"id":"https://openalex.org/S2764900261","display_name":"Communications in computer and information science","issn_l":"1865-0929","issn":["1865-0929","1865-0937"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Communications in Computer and Information Science","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4000000059604645,"display_name":"Clean water and sanitation","id":"https://metadata.un.org/sdg/6"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1984716652","https://openalex.org/W1985798745","https://openalex.org/W2010271080","https://openalex.org/W2019472690","https://openalex.org/W2033267336","https://openalex.org/W2041817469","https://openalex.org/W2056030209","https://openalex.org/W2061689349","https://openalex.org/W2083698558","https://openalex.org/W2091449542","https://openalex.org/W2104800863","https://openalex.org/W2128640706","https://openalex.org/W2139788711","https://openalex.org/W2142781509","https://openalex.org/W2144242406","https://openalex.org/W2153261772","https://openalex.org/W2202179313","https://openalex.org/W2461204469","https://openalex.org/W2507680443","https://openalex.org/W2539290057","https://openalex.org/W2798485198","https://openalex.org/W6601727015"],"related_works":["https://openalex.org/W2045897954","https://openalex.org/W2296264082","https://openalex.org/W1501419981","https://openalex.org/W3215636742","https://openalex.org/W2096478611","https://openalex.org/W2159636143","https://openalex.org/W2000270739","https://openalex.org/W199926285","https://openalex.org/W2022641457","https://openalex.org/W2059967747"],"abstract_inverted_index":null,"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}