{"id":"https://openalex.org/W2899415025","doi":"https://doi.org/10.1007/978-981-13-1595-4_20","title":"Numerical Investigation of Flexural Properties of Curved Layer FDM Parts","display_name":"Numerical Investigation of Flexural Properties of Curved Layer FDM Parts","publication_year":2018,"publication_date":"2018-10-30","ids":{"openalex":"https://openalex.org/W2899415025","doi":"https://doi.org/10.1007/978-981-13-1595-4_20","mag":"2899415025"},"language":"en","primary_location":{"id":"doi:10.1007/978-981-13-1595-4_20","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-981-13-1595-4_20","pdf_url":null,"source":{"id":"https://openalex.org/S2764905038","display_name":"Advances in intelligent systems and computing","issn_l":"2194-5357","issn":["2194-5357","2194-5365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Intelligent Systems and Computing","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020701569","display_name":"Xiongbin Peng","orcid":"https://orcid.org/0000-0002-8120-4990"},"institutions":[{"id":"https://openalex.org/I32574673","display_name":"Shantou University","ror":"https://ror.org/01a099706","country_code":"CN","type":"education","lineage":["https://openalex.org/I32574673"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiongbin Peng","raw_affiliation_strings":["Intelligent Manufacturing Key Laboratory of Ministry of Education, Shantou University, Shantou, China"],"affiliations":[{"raw_affiliation_string":"Intelligent Manufacturing Key Laboratory of Ministry of Education, Shantou University, Shantou, China","institution_ids":["https://openalex.org/I32574673"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050329736","display_name":"Biranchi Panda","orcid":"https://orcid.org/0000-0002-3563-7744"},"institutions":[{"id":"https://openalex.org/I16292982","display_name":"National Institute of Technology Rourkela","ror":"https://ror.org/011gmn932","country_code":"IN","type":"education","lineage":["https://openalex.org/I16292982"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Biranchi Panda","raw_affiliation_strings":["Department of Industrial Design, National Institute of Technology, Rourkela, Rourkela, India"],"affiliations":[{"raw_affiliation_string":"Department of Industrial Design, National Institute of Technology, Rourkela, Rourkela, India","institution_ids":["https://openalex.org/I16292982"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068512066","display_name":"Akhil Garg","orcid":"https://orcid.org/0000-0001-5731-4105"},"institutions":[{"id":"https://openalex.org/I32574673","display_name":"Shantou University","ror":"https://ror.org/01a099706","country_code":"CN","type":"education","lineage":["https://openalex.org/I32574673"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Akhil Garg","raw_affiliation_strings":["Intelligent Manufacturing Key Laboratory of Ministry of Education, Shantou University, Shantou, China"],"affiliations":[{"raw_affiliation_string":"Intelligent Manufacturing Key Laboratory of Ministry of Education, Shantou University, Shantou, China","institution_ids":["https://openalex.org/I32574673"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111406155","display_name":"Hua Guan","orcid":null},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"H. Guan","raw_affiliation_strings":["Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Kowloon, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032360208","display_name":"M. M. Savalani","orcid":null},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"M. M. Savalani","raw_affiliation_strings":["Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Kowloon, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Kowloon, Hong Kong","institution_ids":["https://openalex.org/I14243506"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5020701569"],"corresponding_institution_ids":["https://openalex.org/I32574673"],"apc_list":null,"apc_paid":null,"fwci":1.1143,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.79039924,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"255","last_page":"263"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12190","display_name":"Innovations in Concrete and Construction Materials","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2215","display_name":"Building and Construction"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flexural-strength","display_name":"Flexural strength","score":0.812369704246521},{"id":"https://openalex.org/keywords/fused-deposition-modeling","display_name":"Fused deposition modeling","score":0.6388931274414062},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5162551403045654},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4997279644012451},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4971964657306671},{"id":"https://openalex.org/keywords/deposition","display_name":"Deposition (geology)","score":0.44493287801742554},{"id":"https://openalex.org/keywords/popularity","display_name":"Popularity","score":0.4393608868122101},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.4153934717178345},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.41116005182266235},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.3749755620956421},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.34709760546684265},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.28567954897880554},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1818525791168213},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.1578005850315094}],"concepts":[{"id":"https://openalex.org/C178405089","wikidata":"https://www.wikidata.org/wiki/Q857201","display_name":"Flexural strength","level":2,"score":0.812369704246521},{"id":"https://openalex.org/C2780329122","wikidata":"https://www.wikidata.org/wiki/Q18349149","display_name":"Fused deposition modeling","level":3,"score":0.6388931274414062},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5162551403045654},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4997279644012451},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4971964657306671},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.44493287801742554},{"id":"https://openalex.org/C2780586970","wikidata":"https://www.wikidata.org/wiki/Q1357284","display_name":"Popularity","level":2,"score":0.4393608868122101},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.4153934717178345},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.41116005182266235},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3749755620956421},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.34709760546684265},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.28567954897880554},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1818525791168213},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.1578005850315094},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C77805123","wikidata":"https://www.wikidata.org/wiki/Q161272","display_name":"Social psychology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-981-13-1595-4_20","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-981-13-1595-4_20","pdf_url":null,"source":{"id":"https://openalex.org/S2764905038","display_name":"Advances in intelligent systems and computing","issn_l":"2194-5357","issn":["2194-5357","2194-5365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Intelligent Systems and Computing","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1138471781","https://openalex.org/W1517016597","https://openalex.org/W1586219442","https://openalex.org/W1607921397","https://openalex.org/W1969737594","https://openalex.org/W1972733809","https://openalex.org/W1978164521","https://openalex.org/W1979169277","https://openalex.org/W1988562504","https://openalex.org/W2029905448","https://openalex.org/W2036114494","https://openalex.org/W2037402836","https://openalex.org/W2075756453","https://openalex.org/W2082135472","https://openalex.org/W2095576930","https://openalex.org/W2289841698","https://openalex.org/W2402430133","https://openalex.org/W2587763305","https://openalex.org/W2741421471","https://openalex.org/W2753170214","https://openalex.org/W4249678223"],"related_works":["https://openalex.org/W2025687592","https://openalex.org/W3008690834","https://openalex.org/W2944045227","https://openalex.org/W2771163941","https://openalex.org/W2057164293","https://openalex.org/W2000966266","https://openalex.org/W3031704482","https://openalex.org/W2366934632","https://openalex.org/W3081727900","https://openalex.org/W3159881949"],"abstract_inverted_index":null,"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}