{"id":"https://openalex.org/W2177976513","doi":"https://doi.org/10.1007/978-3-642-28163-1_6","title":"Precisely Assembled Multi Deflection Arrays \u2013 Key Components for Multi Shaped Beam Lithography","display_name":"Precisely Assembled Multi Deflection Arrays \u2013 Key Components for Multi Shaped Beam Lithography","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2177976513","doi":"https://doi.org/10.1007/978-3-642-28163-1_6","mag":"2177976513"},"language":"en","primary_location":{"id":"doi:10.1007/978-3-642-28163-1_6","is_oa":true,"landing_page_url":"https://doi.org/10.1007/978-3-642-28163-1_6","pdf_url":"https://link.springer.com/content/pdf/10.1007%2F978-3-642-28163-1_6.pdf","source":{"id":"https://openalex.org/S4210175514","display_name":"IFIP International Federation for Information Processing/IFIP","issn_l":"1571-5736","issn":["1571-5736","1861-2288"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP Advances in Information and Communication Technology","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://link.springer.com/content/pdf/10.1007%2F978-3-642-28163-1_6.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5010576143","display_name":"Matthias Mohaupt","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115660","display_name":"Fraunhofer Institute for Applied Optics and Precision Engineering","ror":"https://ror.org/02afjh072","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210115660","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Matthias Mohaupt","raw_affiliation_strings":["Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","institution_ids":["https://openalex.org/I4210115660"]},{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]","institution_ids":["https://openalex.org/I4210115660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001136499","display_name":"Erik Beckert","orcid":"https://orcid.org/0000-0001-8418-6655"},"institutions":[{"id":"https://openalex.org/I4210115660","display_name":"Fraunhofer Institute for Applied Optics and Precision Engineering","ror":"https://ror.org/02afjh072","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210115660","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Erik Beckert","raw_affiliation_strings":["Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","institution_ids":["https://openalex.org/I4210115660"]},{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]","institution_ids":["https://openalex.org/I4210115660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024960552","display_name":"Thomas Burkhardt","orcid":"https://orcid.org/0000-0002-8410-088X"},"institutions":[{"id":"https://openalex.org/I4210115660","display_name":"Fraunhofer Institute for Applied Optics and Precision Engineering","ror":"https://ror.org/02afjh072","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210115660","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Thomas Burkhardt","raw_affiliation_strings":["Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","institution_ids":["https://openalex.org/I4210115660"]},{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]","institution_ids":["https://openalex.org/I4210115660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087647090","display_name":"Marcel Hornaff","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115660","display_name":"Fraunhofer Institute for Applied Optics and Precision Engineering","ror":"https://ror.org/02afjh072","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210115660","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Marcel Hornaff","raw_affiliation_strings":["Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","institution_ids":["https://openalex.org/I4210115660"]},{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]","institution_ids":["https://openalex.org/I4210115660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110482759","display_name":"Christoph Damm","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115660","display_name":"Fraunhofer Institute for Applied Optics and Precision Engineering","ror":"https://ror.org/02afjh072","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210115660","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Christoph Damm","raw_affiliation_strings":["Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","institution_ids":["https://openalex.org/I4210115660"]},{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]","institution_ids":["https://openalex.org/I4210115660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047340328","display_name":"Ramona Eberhardt","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115660","display_name":"Fraunhofer Institute for Applied Optics and Precision Engineering","ror":"https://ror.org/02afjh072","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210115660","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Ramona Eberhardt","raw_affiliation_strings":["Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Jena, Germany","institution_ids":["https://openalex.org/I4210115660"]},{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]","institution_ids":["https://openalex.org/I4210115660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045742638","display_name":"Andreas T\u00fcnnermann","orcid":"https://orcid.org/0000-0003-4018-7626"},"institutions":[{"id":"https://openalex.org/I4210115660","display_name":"Fraunhofer Institute for Applied Optics and Precision Engineering","ror":"https://ror.org/02afjh072","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210115660","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andreas T\u00fcnnermann","raw_affiliation_strings":["Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Applied Optics and Precision Engineering [Jena]","institution_ids":["https://openalex.org/I4210115660"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027624628","display_name":"Hans-Joachim D\u00f6ring","orcid":null},"institutions":[{"id":"https://openalex.org/I4210126143","display_name":"Vistec Electron Beam (Germany)","ror":"https://ror.org/02yxqev59","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210126143"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hans-Joachim D\u00f6ring","raw_affiliation_strings":["Vistec Electron Beam GmbH"],"affiliations":[{"raw_affiliation_string":"Vistec Electron Beam GmbH","institution_ids":["https://openalex.org/I4210126143"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113042659","display_name":"Klaus Reimer","orcid":null},"institutions":[{"id":"https://openalex.org/I4210113487","display_name":"Fraunhofer Institute for Silicon Technology","ror":"https://ror.org/024p6aq98","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210113487","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Klaus Reimer","raw_affiliation_strings":["Fraunhofer Institute for Silicon Technology ISIT, Itzehoe, Germany","Fraunhofer Institute for Silicon Technology"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Silicon Technology ISIT, Itzehoe, Germany","institution_ids":["https://openalex.org/I4210113487"]},{"raw_affiliation_string":"Fraunhofer Institute for Silicon Technology","institution_ids":["https://openalex.org/I4210113487"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5010576143"],"corresponding_institution_ids":["https://openalex.org/I4210115660"],"apc_list":null,"apc_paid":null,"fwci":1.9735,"has_fulltext":true,"cited_by_count":3,"citation_normalized_percentile":{"value":0.89323402,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"42","last_page":"50"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bumping","display_name":"Bumping","score":0.967892050743103},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7321258187294006},{"id":"https://openalex.org/keywords/deflection","display_name":"Deflection (physics)","score":0.6575551629066467},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6355666518211365},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.6099580526351929},{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.6067606210708618},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5597580075263977},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.5063282251358032},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.4979221820831299},{"id":"https://openalex.org/keywords/stencil-lithography","display_name":"Stencil lithography","score":0.4898321330547333},{"id":"https://openalex.org/keywords/maskless-lithography","display_name":"Maskless lithography","score":0.47631868720054626},{"id":"https://openalex.org/keywords/cathode-ray","display_name":"Cathode ray","score":0.4643312990665436},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.39591604471206665},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.35998132824897766},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3113694190979004},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.3045054078102112},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2953815460205078},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.2767418622970581},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26032334566116333},{"id":"https://openalex.org/keywords/electron","display_name":"Electron","score":0.13642996549606323},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.13197794556617737},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09848818182945251},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.06315141916275024}],"concepts":[{"id":"https://openalex.org/C2776512755","wikidata":"https://www.wikidata.org/wiki/Q632543","display_name":"Bumping","level":2,"score":0.967892050743103},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7321258187294006},{"id":"https://openalex.org/C2781355719","wikidata":"https://www.wikidata.org/wiki/Q2080698","display_name":"Deflection (physics)","level":2,"score":0.6575551629066467},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6355666518211365},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6099580526351929},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.6067606210708618},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5597580075263977},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.5063282251358032},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.4979221820831299},{"id":"https://openalex.org/C70520399","wikidata":"https://www.wikidata.org/wiki/Q7607503","display_name":"Stencil lithography","level":5,"score":0.4898321330547333},{"id":"https://openalex.org/C137905882","wikidata":"https://www.wikidata.org/wiki/Q6783445","display_name":"Maskless lithography","level":5,"score":0.47631868720054626},{"id":"https://openalex.org/C95312477","wikidata":"https://www.wikidata.org/wiki/Q207340","display_name":"Cathode ray","level":3,"score":0.4643312990665436},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.39591604471206665},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.35998132824897766},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3113694190979004},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.3045054078102112},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2953815460205078},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2767418622970581},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26032334566116333},{"id":"https://openalex.org/C147120987","wikidata":"https://www.wikidata.org/wiki/Q2225","display_name":"Electron","level":2,"score":0.13642996549606323},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.13197794556617737},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09848818182945251},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.06315141916275024},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1007/978-3-642-28163-1_6","is_oa":true,"landing_page_url":"https://doi.org/10.1007/978-3-642-28163-1_6","pdf_url":"https://link.springer.com/content/pdf/10.1007%2F978-3-642-28163-1_6.pdf","source":{"id":"https://openalex.org/S4210175514","display_name":"IFIP International Federation for Information Processing/IFIP","issn_l":"1571-5736","issn":["1571-5736","1861-2288"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP Advances in Information and Communication Technology","raw_type":"book-chapter"},{"id":"pmh:oai:HAL:hal-01363878v1","is_oa":true,"landing_page_url":"https://inria.hal.science/hal-01363878","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. pp.42-50, ⟨10.1007/978-3-642-28163-1_6⟩","raw_type":"Conference papers"},{"id":"pmh:oai:publica.fraunhofer.de:publica/375585","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/375585","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":{"id":"doi:10.1007/978-3-642-28163-1_6","is_oa":true,"landing_page_url":"https://doi.org/10.1007/978-3-642-28163-1_6","pdf_url":"https://link.springer.com/content/pdf/10.1007%2F978-3-642-28163-1_6.pdf","source":{"id":"https://openalex.org/S4210175514","display_name":"IFIP International Federation for Information Processing/IFIP","issn_l":"1571-5736","issn":["1571-5736","1861-2288"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP Advances in Information and Communication Technology","raw_type":"book-chapter"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2177976513.pdf","grobid_xml":"https://content.openalex.org/works/W2177976513.grobid-xml"},"referenced_works_count":3,"referenced_works":["https://openalex.org/W2042748824","https://openalex.org/W2068213387","https://openalex.org/W2079182489"],"related_works":["https://openalex.org/W2135099569","https://openalex.org/W806091262","https://openalex.org/W4390650236","https://openalex.org/W1811326091","https://openalex.org/W2027333059","https://openalex.org/W2391683698","https://openalex.org/W1977317792","https://openalex.org/W3023489656","https://openalex.org/W4238142582","https://openalex.org/W2607007960"],"abstract_inverted_index":null,"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-03-20T23:20:44.827607","created_date":"2025-10-10T00:00:00"}