{"id":"https://openalex.org/W2168137244","doi":"https://doi.org/10.1007/978-3-642-27552-4_127","title":"The Study and Development of Modern Wave Soldering Materials for 3C Products","display_name":"The Study and Development of Modern Wave Soldering Materials for 3C Products","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2168137244","doi":"https://doi.org/10.1007/978-3-642-27552-4_127","mag":"2168137244"},"language":"en","primary_location":{"id":"doi:10.1007/978-3-642-27552-4_127","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-642-27552-4_127","pdf_url":null,"source":{"id":"https://openalex.org/S4210208846","display_name":"Advances in intelligent and soft computing","issn_l":"1867-5662","issn":["1867-5662","1867-5670"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Intelligent and Soft Computing","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111797090","display_name":"Changhua Du","orcid":null},"institutions":[{"id":"https://openalex.org/I50632499","display_name":"Chongqing University of Technology","ror":"https://ror.org/04vgbd477","country_code":"CN","type":"education","lineage":["https://openalex.org/I50632499"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Changhua Du","raw_affiliation_strings":["College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054"],"affiliations":[{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]},{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103028505","display_name":"Chuntian Li","orcid":"https://orcid.org/0000-0002-7464-1324"},"institutions":[{"id":"https://openalex.org/I50632499","display_name":"Chongqing University of Technology","ror":"https://ror.org/04vgbd477","country_code":"CN","type":"education","lineage":["https://openalex.org/I50632499"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chuntian Li","raw_affiliation_strings":["College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054"],"affiliations":[{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]},{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100453416","display_name":"Tao Wang","orcid":"https://orcid.org/0000-0001-7852-0901"},"institutions":[{"id":"https://openalex.org/I50632499","display_name":"Chongqing University of Technology","ror":"https://ror.org/04vgbd477","country_code":"CN","type":"education","lineage":["https://openalex.org/I50632499"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tao Wang","raw_affiliation_strings":["College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054"],"affiliations":[{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]},{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055929714","display_name":"Wenchao Huang","orcid":"https://orcid.org/0000-0003-4992-1727"},"institutions":[{"id":"https://openalex.org/I50632499","display_name":"Chongqing University of Technology","ror":"https://ror.org/04vgbd477","country_code":"CN","type":"education","lineage":["https://openalex.org/I50632499"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenchao Huang","raw_affiliation_strings":["College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054"],"affiliations":[{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba\u2019nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]},{"raw_affiliation_string":"College of Material Science and Engineering, Chongqing University of Technology, No.69 HongGuang Road, Ba'nan District, Chongqing, P.R. China, 400054","institution_ids":["https://openalex.org/I50632499"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5111797090"],"corresponding_institution_ids":["https://openalex.org/I50632499"],"apc_list":null,"apc_paid":null,"fwci":0.9877,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.80203423,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"971","last_page":"978"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.9876000285148621,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.4730616807937622},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.44956159591674805},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.30824923515319824}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.4730616807937622},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.44956159591674805},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.30824923515319824}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-3-642-27552-4_127","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-642-27552-4_127","pdf_url":null,"source":{"id":"https://openalex.org/S4210208846","display_name":"Advances in intelligent and soft computing","issn_l":"1867-5662","issn":["1867-5662","1867-5670"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Intelligent and Soft Computing","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.6200000047683716,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1987915971","https://openalex.org/W2093936861","https://openalex.org/W2377565670","https://openalex.org/W2537587727","https://openalex.org/W4206622721"],"related_works":["https://openalex.org/W4237939403","https://openalex.org/W4322766080","https://openalex.org/W2109935178","https://openalex.org/W4253328832","https://openalex.org/W2070338356","https://openalex.org/W4283821095","https://openalex.org/W4231413117","https://openalex.org/W2895146594","https://openalex.org/W2022507789","https://openalex.org/W2071030926"],"abstract_inverted_index":null,"counts_by_year":[{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}