{"id":"https://openalex.org/W3095543844","doi":"https://doi.org/10.1007/978-3-030-62746-1_127","title":"Design and Research of Electroless Copper Plating in Microelectronics","display_name":"Design and Research of Electroless Copper Plating in Microelectronics","publication_year":2020,"publication_date":"2020-11-04","ids":{"openalex":"https://openalex.org/W3095543844","doi":"https://doi.org/10.1007/978-3-030-62746-1_127","mag":"3095543844"},"language":"en","primary_location":{"id":"doi:10.1007/978-3-030-62746-1_127","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-030-62746-1_127","pdf_url":null,"source":{"id":"https://openalex.org/S2764905038","display_name":"Advances in intelligent systems and computing","issn_l":"2194-5357","issn":["2194-5357","2194-5365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Intelligent Systems and Computing","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112122208","display_name":"Dong Zhen-hua","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Dong Zhenhua","raw_affiliation_strings":["Department of Information Engineering, Laiwu Vocational and Technical College, Laiwu, Jinan, China"],"affiliations":[{"raw_affiliation_string":"Department of Information Engineering, Laiwu Vocational and Technical College, Laiwu, Jinan, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103933603","display_name":"LI Xiao-ming","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Li Xiaoming","raw_affiliation_strings":["Department of Information Engineering, Laiwu Vocational and Technical College, Laiwu, Jinan, China"],"affiliations":[{"raw_affiliation_string":"Department of Information Engineering, Laiwu Vocational and Technical College, Laiwu, Jinan, China","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5112122208"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.7901,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.73232023,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"811","last_page":"815"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9671000242233276,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9671000242233276,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.9251909852027893},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.8295610547065735},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.7768465280532837},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.708236575126648},{"id":"https://openalex.org/keywords/copper-plating","display_name":"Copper plating","score":0.6706478595733643},{"id":"https://openalex.org/keywords/electroless-plating","display_name":"Electroless plating","score":0.6630359888076782},{"id":"https://openalex.org/keywords/plating","display_name":"Plating (geology)","score":0.6349032521247864},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.5935098528862},{"id":"https://openalex.org/keywords/electromagnetic-shielding","display_name":"Electromagnetic shielding","score":0.5510790348052979},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.23598265647888184},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.22632893919944763},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20509293675422668},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20377281308174133},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.06919822096824646}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.9251909852027893},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.8295610547065735},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7768465280532837},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.708236575126648},{"id":"https://openalex.org/C29216876","wikidata":"https://www.wikidata.org/wiki/Q1769505","display_name":"Copper plating","level":4,"score":0.6706478595733643},{"id":"https://openalex.org/C2780727033","wikidata":"https://www.wikidata.org/wiki/Q9484729","display_name":"Electroless plating","level":4,"score":0.6630359888076782},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.6349032521247864},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5935098528862},{"id":"https://openalex.org/C2265751","wikidata":"https://www.wikidata.org/wiki/Q332007","display_name":"Electromagnetic shielding","level":2,"score":0.5510790348052979},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.23598265647888184},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.22632893919944763},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20509293675422668},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20377281308174133},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.06919822096824646},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-3-030-62746-1_127","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-030-62746-1_127","pdf_url":null,"source":{"id":"https://openalex.org/S2764905038","display_name":"Advances in intelligent systems and computing","issn_l":"2194-5357","issn":["2194-5357","2194-5365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Intelligent Systems and Computing","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W631860313","https://openalex.org/W1481881730","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2137054980","https://openalex.org/W2380173654","https://openalex.org/W2018687124","https://openalex.org/W2076205931","https://openalex.org/W2039945307","https://openalex.org/W2515690062","https://openalex.org/W3035982821","https://openalex.org/W627159299","https://openalex.org/W2069151110","https://openalex.org/W4243429347"],"abstract_inverted_index":null,"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}