{"id":"https://openalex.org/W1751098810","doi":"https://doi.org/10.1007/3-540-45545-0_131","title":"Scalable Large Scale Process Modeling and Simulations in Liquid Composite Molding","display_name":"Scalable Large Scale Process Modeling and Simulations in Liquid Composite Molding","publication_year":2001,"publication_date":"2001-01-01","ids":{"openalex":"https://openalex.org/W1751098810","doi":"https://doi.org/10.1007/3-540-45545-0_131","mag":"1751098810"},"language":"en","primary_location":{"id":"doi:10.1007/3-540-45545-0_131","is_oa":true,"landing_page_url":"https://doi.org/10.1007/3-540-45545-0_131","pdf_url":"https://link.springer.com/content/pdf/10.1007%2F3-540-45545-0_131.pdf","source":{"id":"https://openalex.org/S106296714","display_name":"Lecture notes in computer science","issn_l":"0302-9743","issn":["0302-9743","1611-3349"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lecture Notes in Computer Science","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://link.springer.com/content/pdf/10.1007%2F3-540-45545-0_131.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5001018465","display_name":"Ram Mohan","orcid":"https://orcid.org/0000-0002-5820-7288"},"institutions":[{"id":"https://openalex.org/I166416128","display_name":"DEVCOM Army Research Laboratory","ror":"https://ror.org/011hc8f90","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796","https://openalex.org/I166416128","https://openalex.org/I2802705668","https://openalex.org/I4210154437"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ram Mohan","raw_affiliation_strings":["High Performance Computing Division, U. S. Army Research Laboratory, Aberdeen Proving Ground, MD, 21005"],"affiliations":[{"raw_affiliation_string":"High Performance Computing Division, U. S. Army Research Laboratory, Aberdeen Proving Ground, MD, 21005","institution_ids":["https://openalex.org/I166416128"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053719539","display_name":"Dale R. Shires","orcid":null},"institutions":[{"id":"https://openalex.org/I166416128","display_name":"DEVCOM Army Research Laboratory","ror":"https://ror.org/011hc8f90","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796","https://openalex.org/I166416128","https://openalex.org/I2802705668","https://openalex.org/I4210154437"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dale Shires","raw_affiliation_strings":["High Performance Computing Division, U. S. Army Research Laboratory, Aberdeen Proving Ground, MD, 21005"],"affiliations":[{"raw_affiliation_string":"High Performance Computing Division, U. S. Army Research Laboratory, Aberdeen Proving Ground, MD, 21005","institution_ids":["https://openalex.org/I166416128"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033266896","display_name":"Andrew G. Mark","orcid":"https://orcid.org/0000-0002-6575-3092"},"institutions":[{"id":"https://openalex.org/I166416128","display_name":"DEVCOM Army Research Laboratory","ror":"https://ror.org/011hc8f90","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796","https://openalex.org/I166416128","https://openalex.org/I2802705668","https://openalex.org/I4210154437"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew Mark","raw_affiliation_strings":["High Performance Computing Division, U. S. Army Research Laboratory, Aberdeen Proving Ground, MD, 21005"],"affiliations":[{"raw_affiliation_string":"High Performance Computing Division, U. S. Army Research Laboratory, Aberdeen Proving Ground, MD, 21005","institution_ids":["https://openalex.org/I166416128"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5001018465"],"corresponding_institution_ids":["https://openalex.org/I166416128"],"apc_list":{"value":5000,"currency":"EUR","value_usd":5392},"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.15859031,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1199","last_page":"1208"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9962999820709229,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.758263111114502},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.7315368056297302},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5936446785926819},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.5468000769615173},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.49770382046699524},{"id":"https://openalex.org/keywords/process-modeling","display_name":"Process modeling","score":0.4893914759159088},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.46363943815231323},{"id":"https://openalex.org/keywords/molding","display_name":"Molding (decorative)","score":0.4337792992591858},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.4313638210296631},{"id":"https://openalex.org/keywords/computational-science","display_name":"Computational science","score":0.3593040108680725},{"id":"https://openalex.org/keywords/work-in-process","display_name":"Work in process","score":0.29413753747940063},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.255046546459198},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.0976024866104126}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.758263111114502},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.7315368056297302},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5936446785926819},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.5468000769615173},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.49770382046699524},{"id":"https://openalex.org/C76956256","wikidata":"https://www.wikidata.org/wiki/Q27610560","display_name":"Process modeling","level":3,"score":0.4893914759159088},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.46363943815231323},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.4337792992591858},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.4313638210296631},{"id":"https://openalex.org/C459310","wikidata":"https://www.wikidata.org/wiki/Q117801","display_name":"Computational science","level":1,"score":0.3593040108680725},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.29413753747940063},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.255046546459198},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0976024866104126},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/3-540-45545-0_131","is_oa":true,"landing_page_url":"https://doi.org/10.1007/3-540-45545-0_131","pdf_url":"https://link.springer.com/content/pdf/10.1007%2F3-540-45545-0_131.pdf","source":{"id":"https://openalex.org/S106296714","display_name":"Lecture notes in computer science","issn_l":"0302-9743","issn":["0302-9743","1611-3349"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lecture Notes in Computer Science","raw_type":"book-chapter"}],"best_oa_location":{"id":"doi:10.1007/3-540-45545-0_131","is_oa":true,"landing_page_url":"https://doi.org/10.1007/3-540-45545-0_131","pdf_url":"https://link.springer.com/content/pdf/10.1007%2F3-540-45545-0_131.pdf","source":{"id":"https://openalex.org/S106296714","display_name":"Lecture notes in computer science","issn_l":"0302-9743","issn":["0302-9743","1611-3349"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lecture Notes in Computer Science","raw_type":"book-chapter"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.41999998688697815}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306078","display_name":"U.S. Department of Defense","ror":"https://ror.org/0447fe631"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W1751098810.pdf","grobid_xml":"https://content.openalex.org/works/W1751098810.grobid-xml"},"referenced_works_count":13,"referenced_works":["https://openalex.org/W73287535","https://openalex.org/W1977361859","https://openalex.org/W1987981153","https://openalex.org/W2022370341","https://openalex.org/W2050171648","https://openalex.org/W2070541425","https://openalex.org/W2095420020","https://openalex.org/W2124527958","https://openalex.org/W2150637273","https://openalex.org/W2764568110","https://openalex.org/W3104001151","https://openalex.org/W4241119897","https://openalex.org/W4300703670"],"related_works":["https://openalex.org/W2389214306","https://openalex.org/W4235240664","https://openalex.org/W2965083567","https://openalex.org/W1838576100","https://openalex.org/W2095886385","https://openalex.org/W2889616422","https://openalex.org/W2089704382","https://openalex.org/W1983399550","https://openalex.org/W97075385","https://openalex.org/W2357523926"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}