{"id":"https://openalex.org/W1596624359","doi":"https://doi.org/10.1007/11941354_67","title":"Investigation of Surface Integrity in the Case of Chemical Mechanical Polishing Silicon Wafer by Molecular Dynamics Simulation Method","display_name":"Investigation of Surface Integrity in the Case of Chemical Mechanical Polishing Silicon Wafer by Molecular Dynamics Simulation Method","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W1596624359","doi":"https://doi.org/10.1007/11941354_67","mag":"1596624359"},"language":"en","primary_location":{"id":"doi:10.1007/11941354_67","is_oa":false,"landing_page_url":"https://doi.org/10.1007/11941354_67","pdf_url":null,"source":{"id":"https://openalex.org/S106296714","display_name":"Lecture notes in computer science","issn_l":"0302-9743","issn":["0302-9743","1611-3349"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lecture Notes in Computer Science","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101937584","display_name":"Xuesong Han","orcid":"https://orcid.org/0000-0002-0501-4888"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xuesong Han","raw_affiliation_strings":["State Key Laboratory of Tribology, Tsinghua University, 100084, P.R. China"],"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Tribology, Tsinghua University, 100084, P.R. China","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5101937584"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":{"value":5000,"currency":"EUR","value_usd":5392},"apc_paid":null,"fwci":1.1499,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.82208722,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"651","last_page":"659"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10478","display_name":"Diamond and Carbon-based Materials Research","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.8337657451629639},{"id":"https://openalex.org/keywords/flatness","display_name":"Flatness (cosmology)","score":0.7993471622467041},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7820578813552856},{"id":"https://openalex.org/keywords/slurry","display_name":"Slurry","score":0.6911247372627258},{"id":"https://openalex.org/keywords/molecular-dynamics","display_name":"Molecular dynamics","score":0.5939793586730957},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5933071374893188},{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.5872846841812134},{"id":"https://openalex.org/keywords/nanometre","display_name":"Nanometre","score":0.4570704698562622},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4543929696083069},{"id":"https://openalex.org/keywords/dislocation","display_name":"Dislocation","score":0.4499828815460205},{"id":"https://openalex.org/keywords/surface","display_name":"Surface (topology)","score":0.43790215253829956},{"id":"https://openalex.org/keywords/surface-integrity","display_name":"Surface integrity","score":0.42732715606689453},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4169612526893616},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4123108386993408},{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.41146165132522583},{"id":"https://openalex.org/keywords/semiconductor","display_name":"Semiconductor","score":0.41059887409210205},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.40577179193496704},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.3791426420211792},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.34189724922180176},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.29971152544021606},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2516195476055145},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12760353088378906},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1084146499633789}],"concepts":[{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.8337657451629639},{"id":"https://openalex.org/C2778530986","wikidata":"https://www.wikidata.org/wiki/Q5457948","display_name":"Flatness (cosmology)","level":3,"score":0.7993471622467041},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7820578813552856},{"id":"https://openalex.org/C94293008","wikidata":"https://www.wikidata.org/wiki/Q23925154","display_name":"Slurry","level":2,"score":0.6911247372627258},{"id":"https://openalex.org/C59593255","wikidata":"https://www.wikidata.org/wiki/Q901663","display_name":"Molecular dynamics","level":2,"score":0.5939793586730957},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5933071374893188},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.5872846841812134},{"id":"https://openalex.org/C77066764","wikidata":"https://www.wikidata.org/wiki/Q178674","display_name":"Nanometre","level":2,"score":0.4570704698562622},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4543929696083069},{"id":"https://openalex.org/C159122135","wikidata":"https://www.wikidata.org/wiki/Q737571","display_name":"Dislocation","level":2,"score":0.4499828815460205},{"id":"https://openalex.org/C2776799497","wikidata":"https://www.wikidata.org/wiki/Q484298","display_name":"Surface (topology)","level":2,"score":0.43790215253829956},{"id":"https://openalex.org/C2776363543","wikidata":"https://www.wikidata.org/wiki/Q7645982","display_name":"Surface integrity","level":3,"score":0.42732715606689453},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4169612526893616},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4123108386993408},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.41146165132522583},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.41059887409210205},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.40577179193496704},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3791426420211792},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.34189724922180176},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.29971152544021606},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2516195476055145},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12760353088378906},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1084146499633789},{"id":"https://openalex.org/C26405456","wikidata":"https://www.wikidata.org/wiki/Q338","display_name":"Cosmology","level":2,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/11941354_67","is_oa":false,"landing_page_url":"https://doi.org/10.1007/11941354_67","pdf_url":null,"source":{"id":"https://openalex.org/S106296714","display_name":"Lecture notes in computer science","issn_l":"0302-9743","issn":["0302-9743","1611-3349"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lecture Notes in Computer Science","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6800000071525574,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W2003301106","https://openalex.org/W2004068723","https://openalex.org/W2023093285","https://openalex.org/W2025197976","https://openalex.org/W2027775390","https://openalex.org/W2072691699","https://openalex.org/W2084570621","https://openalex.org/W2105451852","https://openalex.org/W2415374455"],"related_works":["https://openalex.org/W2350003910","https://openalex.org/W2489206082","https://openalex.org/W2130148791","https://openalex.org/W2378882722","https://openalex.org/W2154293465","https://openalex.org/W1983603153","https://openalex.org/W4299738564","https://openalex.org/W2477444322","https://openalex.org/W3216142041","https://openalex.org/W2368784978"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}