{"id":"https://openalex.org/W37381062","doi":"https://doi.org/10.1007/0-387-31277-3_16","title":"Tolerance Budgeting in a Novel Coarse-Fine Strategy for Micro-Assembly","display_name":"Tolerance Budgeting in a Novel Coarse-Fine Strategy for Micro-Assembly","publication_year":2006,"publication_date":"2006-08-16","ids":{"openalex":"https://openalex.org/W37381062","doi":"https://doi.org/10.1007/0-387-31277-3_16","mag":"37381062"},"language":"en","primary_location":{"id":"doi:10.1007/0-387-31277-3_16","is_oa":true,"landing_page_url":"https://doi.org/10.1007/0-387-31277-3_16","pdf_url":"https://link.springer.com/content/pdf/10.1007/0-387-31277-3_16.pdf","source":{"id":"https://openalex.org/S4306463519","display_name":"Kluwer Academic Publishers eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP International Federation for Information Processing","raw_type":"book-chapter"},"type":"book-chapter","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://link.springer.com/content/pdf/10.1007/0-387-31277-3_16.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5077711942","display_name":"Vincent Henneken","orcid":null},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Vincent Henneken","raw_affiliation_strings":["Precision Manufacturing and Assembly, 3mE, TU Delft, Mekelweg 2, 2628 CD, Delft, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Precision Manufacturing and Assembly, 3mE, TU Delft, Mekelweg 2, 2628 CD, Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049247562","display_name":"Marcel Tichem","orcid":"https://orcid.org/0000-0001-6441-5748"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Marcel Tichem","raw_affiliation_strings":["Precision Manufacturing and Assembly, 3mE, TU Delft, Mekelweg 2, 2628 CD, Delft, The Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Precision Manufacturing and Assembly, 3mE, TU Delft, Mekelweg 2, 2628 CD, Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.6821,"has_fulltext":true,"cited_by_count":5,"citation_normalized_percentile":{"value":0.93244782,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"155","last_page":"166"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4813288450241089},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.4534180760383606},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.4266192317008972},{"id":"https://openalex.org/keywords/laser-diode","display_name":"Laser diode","score":0.4235351085662842},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3545153737068176},{"id":"https://openalex.org/keywords/diode","display_name":"Diode","score":0.3408936858177185},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.22354140877723694},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.21273601055145264},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.10373803973197937}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4813288450241089},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.4534180760383606},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.4266192317008972},{"id":"https://openalex.org/C2777048131","wikidata":"https://www.wikidata.org/wiki/Q321098","display_name":"Laser diode","level":3,"score":0.4235351085662842},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3545153737068176},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.3408936858177185},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22354140877723694},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.21273601055145264},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10373803973197937},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/0-387-31277-3_16","is_oa":true,"landing_page_url":"https://doi.org/10.1007/0-387-31277-3_16","pdf_url":"https://link.springer.com/content/pdf/10.1007/0-387-31277-3_16.pdf","source":{"id":"https://openalex.org/S4306463519","display_name":"Kluwer Academic Publishers eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP International Federation for Information Processing","raw_type":"book-chapter"}],"best_oa_location":{"id":"doi:10.1007/0-387-31277-3_16","is_oa":true,"landing_page_url":"https://doi.org/10.1007/0-387-31277-3_16","pdf_url":"https://link.springer.com/content/pdf/10.1007/0-387-31277-3_16.pdf","source":{"id":"https://openalex.org/S4306463519","display_name":"Kluwer Academic Publishers eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IFIP International Federation for Information Processing","raw_type":"book-chapter"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4300000071525574}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321012","display_name":"Technische Universiteit Delft","ror":"https://ror.org/02e2c7k09"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W37381062.pdf","grobid_xml":"https://content.openalex.org/works/W37381062.grobid-xml"},"referenced_works_count":14,"referenced_works":["https://openalex.org/W1696669116","https://openalex.org/W1983646104","https://openalex.org/W2035691222","https://openalex.org/W2093157097","https://openalex.org/W2111792769","https://openalex.org/W2117259771","https://openalex.org/W2119406609","https://openalex.org/W2126016532","https://openalex.org/W2141082776","https://openalex.org/W2153794467","https://openalex.org/W2155663755","https://openalex.org/W3040727028","https://openalex.org/W3189435791","https://openalex.org/W6682117781"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2272290532","https://openalex.org/W2898370298","https://openalex.org/W2744391499","https://openalex.org/W3120461830","https://openalex.org/W4230250635","https://openalex.org/W3041790586","https://openalex.org/W2018879842","https://openalex.org/W3144504424","https://openalex.org/W2120483398"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"the":[3,7,33,40,50],"tolerance":[4,36],"budgeting":[5],"for":[6,16,49],"coarse":[8,41],"assembly":[9,20,42],"step":[10,21],"in":[11,65],"a":[12,53,59,62],"novel":[13],"coarse-fine":[14],"strategy":[15],"micro-assembly.":[17],"The":[18],"final":[19],"is":[22],"to":[23,39,58],"be":[24],"performed":[25],"using":[26],"MEMS-based":[27],"functionality":[28],"that":[29],"remains":[30],"part":[31],"of":[32,52],"product.":[34],"Total":[35],"build-up":[37],"due":[38],"and":[43],"dimensional":[44],"inaccuracies":[45],"has":[46],"been":[47],"determined":[48],"alignment":[51],"single":[54],"mode":[55],"optical":[56,66],"fibre":[57],"laser":[60],"diode,":[61],"challenging":[63],"problem":[64],"telecommunication.":[67]},"counts_by_year":[{"year":2014,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}