{"id":"https://openalex.org/W1486302018","doi":"https://doi.org/10.1007/0-387-29749-9","title":"Thermal and Power Management of Integrated Circuits","display_name":"Thermal and Power Management of Integrated Circuits","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W1486302018","doi":"https://doi.org/10.1007/0-387-29749-9","mag":"1486302018"},"language":"en","primary_location":{"id":"doi:10.1007/0-387-29749-9","is_oa":true,"landing_page_url":"http://doi.org/10.1007/0-387-29749-9","pdf_url":"https://link.springer.com/content/pdf/bfm:978-0-387-29749-1/1?pdf=chapter%20toc","source":{"id":"https://openalex.org/S4306463519","display_name":"Kluwer Academic Publishers eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Series on Integrated Circuits and Systems","raw_type":"book"},"type":"book","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://link.springer.com/content/pdf/bfm:978-0-387-29749-1/1?pdf=chapter%20toc","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5004618546","display_name":"A. Vassighi","orcid":null},"institutions":[{"id":"https://openalex.org/I151746483","display_name":"University of Waterloo","ror":"https://ror.org/01aff2v68","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Vassighi, Arman","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Waterloo, West Waterloo, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Waterloo, West Waterloo, Canada","institution_ids":["https://openalex.org/I151746483"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5086259491","display_name":"Manoj Sachdev","orcid":"https://orcid.org/0000-0002-8256-9828"},"institutions":[{"id":"https://openalex.org/I151746483","display_name":"University of Waterloo","ror":"https://ror.org/01aff2v68","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Sachdev, Manoj","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Waterloo, West Waterloo, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Waterloo, West Waterloo, Canada","institution_ids":["https://openalex.org/I151746483"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.6567,"has_fulltext":false,"cited_by_count":90,"citation_normalized_percentile":{"value":0.92983457,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.6860252618789673},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.6170807480812073},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5966938734054565},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.558782696723938},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.45771992206573486},{"id":"https://openalex.org/keywords/power-management","display_name":"Power management","score":0.4505201578140259},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3847058117389679},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35399460792541504},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3495446443557739},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.34716418385505676},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3466341495513916},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.15493857860565186},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08515667915344238}],"concepts":[{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.6860252618789673},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.6170807480812073},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5966938734054565},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.558782696723938},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.45771992206573486},{"id":"https://openalex.org/C2778774385","wikidata":"https://www.wikidata.org/wiki/Q4437810","display_name":"Power management","level":3,"score":0.4505201578140259},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3847058117389679},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35399460792541504},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3495446443557739},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.34716418385505676},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3466341495513916},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.15493857860565186},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08515667915344238},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1007/0-387-29749-9","is_oa":true,"landing_page_url":"http://doi.org/10.1007/0-387-29749-9","pdf_url":"https://link.springer.com/content/pdf/bfm:978-0-387-29749-1/1?pdf=chapter%20toc","source":{"id":"https://openalex.org/S4306463519","display_name":"Kluwer Academic Publishers eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Series on Integrated Circuits and Systems","raw_type":"book"},{"id":"pmh:oai:aleph.bib-bvb.de:BVB01-016334605","is_oa":false,"landing_page_url":"https://doi.org/10.1007/0-387-29749-9","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"software, multimedia"},{"id":"pmh:oai:dial.uclouvain.be:ebook:2777","is_oa":false,"landing_page_url":"http://hdl.handle.net/2078/ebook:2777","pdf_url":null,"source":{"id":"https://openalex.org/S4306401974","display_name":"DIAL (Catholic University of Leuven)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I99464096","host_organization_name":"KU Leuven","host_organization_lineage":["https://openalex.org/I99464096"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""}],"best_oa_location":{"id":"doi:10.1007/0-387-29749-9","is_oa":true,"landing_page_url":"http://doi.org/10.1007/0-387-29749-9","pdf_url":"https://link.springer.com/content/pdf/bfm:978-0-387-29749-1/1?pdf=chapter%20toc","source":{"id":"https://openalex.org/S4306463519","display_name":"Kluwer Academic Publishers eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Series on Integrated Circuits and Systems","raw_type":"book"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8100000023841858}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322676","display_name":"University of Waterloo","ror":"https://ror.org/01aff2v68"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W1486302018.pdf","grobid_xml":"https://content.openalex.org/works/W1486302018.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2371237473","https://openalex.org/W1986859584","https://openalex.org/W4385859326","https://openalex.org/W2888620174","https://openalex.org/W3215142653","https://openalex.org/W2086636458","https://openalex.org/W4390188998","https://openalex.org/W1487051936","https://openalex.org/W194748710","https://openalex.org/W2532007349"],"abstract_inverted_index":{"In":[0],"Thermal":[1],"and":[2,9,20],"Power":[3],"Management":[4],"of":[5],"Integrated":[6],"Circuits,":[7],"power":[8],"thermal":[10],"management":[11],"issues":[12],"in":[13],"integrated":[14],"circuits":[15],"during":[16],"normal":[17],"operating":[18,22],"conditions":[19,23],"stress":[21],"are":[24],"addressed.":[25],"The":[26]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":9},{"year":2020,"cited_by_count":12},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":6},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":6},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":6}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}