{"id":"https://openalex.org/W2009012896","doi":"https://doi.org/10.1002/ett.4460010314","title":"Information management in VLSI technology","display_name":"Information management in VLSI technology","publication_year":1990,"publication_date":"1990-05-01","ids":{"openalex":"https://openalex.org/W2009012896","doi":"https://doi.org/10.1002/ett.4460010314","mag":"2009012896"},"language":"en","primary_location":{"id":"doi:10.1002/ett.4460010314","is_oa":false,"landing_page_url":"https://doi.org/10.1002/ett.4460010314","pdf_url":null,"source":{"id":"https://openalex.org/S4393917101","display_name":"European Transactions on Telecommunications","issn_l":"1124-318X","issn":["1124-318X","1541-8251"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"European Transactions on Telecommunications","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112266232","display_name":"John M. Robertson","orcid":null},"institutions":[{"id":"https://openalex.org/I98677209","display_name":"University of Edinburgh","ror":"https://ror.org/01nrxwf90","country_code":"GB","type":"education","lineage":["https://openalex.org/I98677209"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"John M. Robertson","raw_affiliation_strings":["Edinburgh Microfabrication Facility University of Edinburgh, Kings Buildings, Edinburgh, U.K"],"affiliations":[{"raw_affiliation_string":"Edinburgh Microfabrication Facility University of Edinburgh, Kings Buildings, Edinburgh, U.K","institution_ids":["https://openalex.org/I98677209"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5009202970","display_name":"R.J. Holwill","orcid":null},"institutions":[{"id":"https://openalex.org/I98677209","display_name":"University of Edinburgh","ror":"https://ror.org/01nrxwf90","country_code":"GB","type":"education","lineage":["https://openalex.org/I98677209"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Robert J. Holwill","raw_affiliation_strings":["Edinburgh Microfabrication Facility University of Edinburgh, Kings Buildings, Edinburgh, U.K"],"affiliations":[{"raw_affiliation_string":"Edinburgh Microfabrication Facility University of Edinburgh, Kings Buildings, Edinburgh, U.K","institution_ids":["https://openalex.org/I98677209"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5112266232"],"corresponding_institution_ids":["https://openalex.org/I98677209"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13097134,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"1","issue":"3","first_page":"319","last_page":"325"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9550999999046326,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9550999999046326,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9409000277519226,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.9399999976158142,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.7503530383110046},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.6098466515541077},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5495204329490662},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5453944802284241},{"id":"https://openalex.org/keywords/new-product-development","display_name":"New product development","score":0.4468289613723755},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.4448772966861725},{"id":"https://openalex.org/keywords/data-science","display_name":"Data science","score":0.3895401954650879},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.389507532119751},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.38921433687210083},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3407876491546631},{"id":"https://openalex.org/keywords/process-management","display_name":"Process management","score":0.3274286389350891},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.20578739047050476},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1547083556652069},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.10666242241859436},{"id":"https://openalex.org/keywords/marketing","display_name":"Marketing","score":0.09888350963592529},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.09396544098854065}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.7503530383110046},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.6098466515541077},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5495204329490662},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5453944802284241},{"id":"https://openalex.org/C19351080","wikidata":"https://www.wikidata.org/wiki/Q1395034","display_name":"New product development","level":2,"score":0.4468289613723755},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.4448772966861725},{"id":"https://openalex.org/C2522767166","wikidata":"https://www.wikidata.org/wiki/Q2374463","display_name":"Data science","level":1,"score":0.3895401954650879},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.389507532119751},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.38921433687210083},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3407876491546631},{"id":"https://openalex.org/C195094911","wikidata":"https://www.wikidata.org/wiki/Q14167904","display_name":"Process management","level":1,"score":0.3274286389350891},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.20578739047050476},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1547083556652069},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.10666242241859436},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.09888350963592529},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.09396544098854065},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1002/ett.4460010314","is_oa":false,"landing_page_url":"https://doi.org/10.1002/ett.4460010314","pdf_url":null,"source":{"id":"https://openalex.org/S4393917101","display_name":"European Transactions on Telecommunications","issn_l":"1124-318X","issn":["1124-318X","1541-8251"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"European Transactions on Telecommunications","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.44999998807907104}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1981400123","https://openalex.org/W3016525403","https://openalex.org/W1971021667","https://openalex.org/W1520169471","https://openalex.org/W3206835165","https://openalex.org/W2527728814","https://openalex.org/W1986765550","https://openalex.org/W2380711420","https://openalex.org/W1535188787","https://openalex.org/W2381163470"],"abstract_inverted_index":{"Abstract":[0],"Any":[1],"review":[2],"of":[3,6,22,38,64],"the":[4,30,41,65],"development":[5],"microelectronics":[7],"technology":[8],"tends":[9],"to":[10,35],"emphasise":[11],"improvements":[12],"in":[13,46],"packing":[14],"density.":[15],"However,":[16],"there":[17],"are":[18,60,69],"also":[19,70],"a":[20],"number":[21],"other":[23],"important":[24],"parallel":[25],"developments.":[26],"This":[27],"paper":[28],"considers":[29],"factors":[31],"which":[32,47],"have":[33],"contributed":[34],"an":[36],"explosion":[37],"data":[39,49],"concerning":[40],"device":[42],"fabrication":[43],"process.":[44],"Ways":[45],"that":[48],"may":[50],"be":[51],"structured":[52],"and":[53,62],"handled":[54],"as":[55],"technical":[56],"or":[57],"product":[58],"information":[59],"reviewed":[61],"some":[63],"implications":[66],"for":[67],"success":[68],"out\u2010lined.":[71]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}