{"id":"https://openalex.org/W2075676993","doi":"https://doi.org/10.1002/ett.4460010217","title":"Interconnections in application specific VLSI","display_name":"Interconnections in application specific VLSI","publication_year":1990,"publication_date":"1990-03-01","ids":{"openalex":"https://openalex.org/W2075676993","doi":"https://doi.org/10.1002/ett.4460010217","mag":"2075676993"},"language":"en","primary_location":{"id":"doi:10.1002/ett.4460010217","is_oa":false,"landing_page_url":"https://doi.org/10.1002/ett.4460010217","pdf_url":null,"source":{"id":"https://openalex.org/S4393917101","display_name":"European Transactions on Telecommunications","issn_l":"1124-318X","issn":["1124-318X","1541-8251"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"European Transactions on Telecommunications","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072142768","display_name":"Dipankar Pramanik","orcid":"https://orcid.org/0000-0002-8241-5159"},"institutions":[{"id":"https://openalex.org/I4210109870","display_name":"Vi Technology (United States)","ror":"https://ror.org/016mnbp44","country_code":"US","type":"company","lineage":["https://openalex.org/I4210109870"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Dipankar Pramanik","raw_affiliation_strings":["VLSI Technology Incorporated 1109 McKay Drive - San Jose, CA 95131","VLSI Technology, Inc. 1109 McKay Drive, San Jose, CA 95131"],"affiliations":[{"raw_affiliation_string":"VLSI Technology Incorporated 1109 McKay Drive - San Jose, CA 95131","institution_ids":["https://openalex.org/I4210109870"]},{"raw_affiliation_string":"VLSI Technology, Inc. 1109 McKay Drive, San Jose, CA 95131","institution_ids":["https://openalex.org/I4210109870"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108217707","display_name":"Gianpaolo Spadini","orcid":null},"institutions":[{"id":"https://openalex.org/I4210109870","display_name":"Vi Technology (United States)","ror":"https://ror.org/016mnbp44","country_code":"US","type":"company","lineage":["https://openalex.org/I4210109870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gianpaolo Spadini","raw_affiliation_strings":["VLSI Technology Incorporated 1109 McKay Drive - San Jose, CA 95131","VLSI Technology, Inc. 1109 McKay Drive, San Jose, CA 95131"],"affiliations":[{"raw_affiliation_string":"VLSI Technology Incorporated 1109 McKay Drive - San Jose, CA 95131","institution_ids":["https://openalex.org/I4210109870"]},{"raw_affiliation_string":"VLSI Technology, Inc. 1109 McKay Drive, San Jose, CA 95131","institution_ids":["https://openalex.org/I4210109870"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5072142768"],"corresponding_institution_ids":["https://openalex.org/I4210109870"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.18411026,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"1","issue":"2","first_page":"179","last_page":"184"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.8074467182159424},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.7366315126419067},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6040825843811035},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5798944234848022},{"id":"https://openalex.org/keywords/automation","display_name":"Automation","score":0.5270571708679199},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5020370483398438},{"id":"https://openalex.org/keywords/simple","display_name":"Simple (philosophy)","score":0.49615249037742615},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4727792739868164},{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.4311378598213196},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.42168742418289185},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.38299793004989624},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3275552988052368},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2906947135925293},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08820828795433044},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.0654248595237732}],"concepts":[{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.8074467182159424},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.7366315126419067},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6040825843811035},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5798944234848022},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.5270571708679199},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5020370483398438},{"id":"https://openalex.org/C2780586882","wikidata":"https://www.wikidata.org/wiki/Q7520643","display_name":"Simple (philosophy)","level":2,"score":0.49615249037742615},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4727792739868164},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.4311378598213196},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.42168742418289185},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.38299793004989624},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3275552988052368},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2906947135925293},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08820828795433044},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0654248595237732},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1002/ett.4460010217","is_oa":false,"landing_page_url":"https://doi.org/10.1002/ett.4460010217","pdf_url":null,"source":{"id":"https://openalex.org/S4393917101","display_name":"European Transactions on Telecommunications","issn_l":"1124-318X","issn":["1124-318X","1541-8251"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"European Transactions on Telecommunications","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1645539095","https://openalex.org/W1952470480","https://openalex.org/W1968489755","https://openalex.org/W1990215011","https://openalex.org/W1992530870","https://openalex.org/W2002651922","https://openalex.org/W2012354956","https://openalex.org/W2016795801","https://openalex.org/W2026094740","https://openalex.org/W2059627517","https://openalex.org/W2126955335","https://openalex.org/W2130401900","https://openalex.org/W2132598416","https://openalex.org/W2142108623","https://openalex.org/W2203215888","https://openalex.org/W3149291698"],"related_works":["https://openalex.org/W2081032080","https://openalex.org/W2134733504","https://openalex.org/W2144460576","https://openalex.org/W2183559057","https://openalex.org/W8358306","https://openalex.org/W2742852324","https://openalex.org/W2132107645","https://openalex.org/W2216584887","https://openalex.org/W309165247","https://openalex.org/W1483017465"],"abstract_inverted_index":{"Abstract":[0],"Process":[1],"technologies":[2,86,105],"developed":[3],"for":[4,46,54,120],"the":[5,35,39,73,80,89,103,114],"fabrication":[6],"of":[7,34,41,61,82,102],"Application":[8],"Specific":[9],"Integrated":[10],"Circuits":[11],"must":[12],"satisfy":[13],"some":[14,33],"unusual":[15],"demands":[16,57],"imposed":[17],"by":[18,22,117],"design":[19,62],"automation":[20,50],"and":[21,64,84,113],"fast":[23,76],"turn":[24],"around":[25],"manufacturing.":[26],"In":[27],"this":[28],"paper":[29],"we":[30],"will":[31,91,110,126],"discuss":[32],"problems":[36],"that":[37,88],"constrain":[38],"selection":[40],"a":[42,58],"suitable":[43],"interconnection":[44],"technology":[45],"ASIC's":[47],"VLSI.":[48],"Design":[49],"(a":[51],"tool":[52],"necessary":[53],"ASIC":[55,124],"designs)":[56],"simple":[59,83],"set":[60],"rules":[63],"very":[65],"large":[66],"current":[67],"carrying":[68],"capability":[69],"metal":[70],"Lines.":[71],"On":[72],"other":[74],"hand":[75],"turnaround":[77],"manufacturing":[78],"requires":[79],"use":[81],"proven":[85],"so":[87],"product":[90],"be":[92,111,127],"easily":[93],"manufacturable,":[94],"possibly":[95],"in":[96],"more":[97],"than":[98],"one":[99,115],"foundry.":[100],"Some":[101],"available":[104],"to":[106],"implement":[107],"mutilevel":[108],"interconnections":[109],"reviewed":[112],"chosen":[116],"VLSI":[118],"Technology":[119],"their":[121],"1":[122],"\u03bcm":[123],"process":[125],"briefly":[128],"described.":[129]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}