{"id":"https://openalex.org/W4366607615","doi":"https://doi.org/10.1002/aisy.202370013","title":"Solvent Responsive Self\u2010Folding of 3D Photosensitive Graphene Architectures","display_name":"Solvent Responsive Self\u2010Folding of 3D Photosensitive Graphene Architectures","publication_year":2023,"publication_date":"2023-04-01","ids":{"openalex":"https://openalex.org/W4366607615","doi":"https://doi.org/10.1002/aisy.202370013"},"language":"en","primary_location":{"id":"doi:10.1002/aisy.202370013","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.202370013","pdf_url":null,"source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1002/aisy.202370013","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109301963","display_name":"Huang Qi","orcid":null},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Qi Huang","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013871669","display_name":"Tao Deng","orcid":"https://orcid.org/0009-0008-2081-2475"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Tao Deng","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Microelectronics and Nanoelectronics Tsinghua University  Beijing 100084 China","Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","Department of Microelectronics and Nanoelectronics Tsinghua University Beijing 100084 China"],"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Microelectronics and Nanoelectronics Tsinghua University  Beijing 100084 China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Microelectronics and Nanoelectronics Tsinghua University Beijing 100084 China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080071255","display_name":"Weinan Xu","orcid":"https://orcid.org/0000-0002-5352-3302"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Weinan Xu","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087065394","display_name":"ChangKyu Yoon","orcid":"https://orcid.org/0000-0003-3716-4853"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"ChangKyu Yoon","raw_affiliation_strings":["Department of Materials Science and Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Materials Science and Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Materials Science and Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011814994","display_name":"Zhao Qin","orcid":"https://orcid.org/0000-0001-5696-8553"},"institutions":[{"id":"https://openalex.org/I70983195","display_name":"Syracuse University","ror":"https://ror.org/025r5qe02","country_code":"US","type":"education","lineage":["https://openalex.org/I70983195"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhao Qin","raw_affiliation_strings":["Department of Civil & Environmental Engineering Syracuse University  Syracuse NY 13244 USA","Department of Civil & Environmental Engineering Syracuse University Syracuse NY 13244 USA"],"affiliations":[{"raw_affiliation_string":"Department of Civil & Environmental Engineering Syracuse University  Syracuse NY 13244 USA","institution_ids":["https://openalex.org/I70983195"]},{"raw_affiliation_string":"Department of Civil & Environmental Engineering Syracuse University Syracuse NY 13244 USA","institution_ids":["https://openalex.org/I70983195"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068400688","display_name":"Yida Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yida Lin","raw_affiliation_strings":["Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006346410","display_name":"Teng\u2010Fei Li","orcid":"https://orcid.org/0000-0003-0583-8673"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tengfei Li","raw_affiliation_strings":["Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040612080","display_name":"Yuqian Yang","orcid":"https://orcid.org/0000-0002-2510-9788"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuqian Yang","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061923055","display_name":"Michael Shen","orcid":"https://orcid.org/0000-0002-4068-9717"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Shen","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064910080","display_name":"Susanna M. Thon","orcid":"https://orcid.org/0000-0002-1003-2650"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Susanna M. Thon","raw_affiliation_strings":["Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071834866","display_name":"Jacob B. Khurgin","orcid":"https://orcid.org/0000-0003-0725-8736"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jacob B. Khurgin","raw_affiliation_strings":["Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5039204242","display_name":"David H. Gracias","orcid":"https://orcid.org/0000-0003-2735-4725"},"institutions":[{"id":"https://openalex.org/I145311948","display_name":"Johns Hopkins University","ror":"https://ror.org/00za53h95","country_code":"US","type":"education","lineage":["https://openalex.org/I145311948"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"David H. Gracias","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Chemistry Johns Hopkins University  Baltimore MD 21218 USA","Department of Materials Science and Engineering Johns Hopkins University  Baltimore MD 21218 USA","Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","Department of Chemistry Johns Hopkins University Baltimore MD 21218 USA","Department of Materials Science and Engineering Johns Hopkins University Baltimore MD 21218 USA"],"affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Chemistry Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Materials Science and Engineering Johns Hopkins University  Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Chemistry Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]},{"raw_affiliation_string":"Department of Materials Science and Engineering Johns Hopkins University Baltimore MD 21218 USA","institution_ids":["https://openalex.org/I145311948"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":12,"corresponding_author_ids":["https://openalex.org/A5039204242"],"corresponding_institution_ids":["https://openalex.org/I145311948"],"apc_list":{"value":2750,"currency":"USD","value_usd":2750},"apc_paid":{"value":2750,"currency":"USD","value_usd":2750},"fwci":0.5208,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.58791557,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":99},"biblio":{"volume":"5","issue":"4","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.9409000277519226,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.9409000277519226,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/graphene","display_name":"Graphene","score":0.8201074600219727},{"id":"https://openalex.org/keywords/control-reconfiguration","display_name":"Control reconfiguration","score":0.795366108417511},{"id":"https://openalex.org/keywords/folding","display_name":"Folding (DSP implementation)","score":0.699198842048645},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.5783584117889404},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5776812434196472},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.5497574806213379},{"id":"https://openalex.org/keywords/photodetector","display_name":"Photodetector","score":0.48648640513420105},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.32179585099220276},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.25092336535453796},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.12431532144546509},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12062987685203552},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.07948988676071167}],"concepts":[{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.8201074600219727},{"id":"https://openalex.org/C119701452","wikidata":"https://www.wikidata.org/wiki/Q5165881","display_name":"Control reconfiguration","level":2,"score":0.795366108417511},{"id":"https://openalex.org/C2776545253","wikidata":"https://www.wikidata.org/wiki/Q5464292","display_name":"Folding (DSP implementation)","level":2,"score":0.699198842048645},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.5783584117889404},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5776812434196472},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.5497574806213379},{"id":"https://openalex.org/C23125352","wikidata":"https://www.wikidata.org/wiki/Q210765","display_name":"Photodetector","level":2,"score":0.48648640513420105},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.32179585099220276},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.25092336535453796},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.12431532144546509},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12062987685203552},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.07948988676071167},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1002/aisy.202370013","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.202370013","pdf_url":null,"source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1002/aisy.202370013","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.202370013","pdf_url":null,"source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2137163290","https://openalex.org/W2134948224","https://openalex.org/W3111609763","https://openalex.org/W2570068767","https://openalex.org/W2769077900","https://openalex.org/W2896640114","https://openalex.org/W2145386651","https://openalex.org/W2414885887","https://openalex.org/W2030629592"],"abstract_inverted_index":{"3D":[0,34],"Photoresponsive":[1],"Microstructures":[2],"In":[3],"article":[4],"number":[5],"2000195,":[6],"Qi":[7],"Huang,":[8],"Tao":[9],"Deng,":[10],"Weinan":[11],"Xu,":[12],"ChangKyu":[13],"Yoon,":[14],"Zhao":[15],"Qin,":[16],"David":[17],"Gracias,":[18],"and":[19,24,29,46,68],"co-workers":[20],"describe":[21],"the":[22,42,51,57],"design":[23],"highly":[25],"parallel":[26],"integration,":[27],"assembly,":[28],"reversible":[30],"reconfiguration":[31],"of":[32,44,53,59,63],"transparent":[33],"flexible":[35],"graphene":[36],"photodetector":[37],"microstructures.":[38],"The":[39],"approach":[40],"enables":[41],"creation":[43],"curved":[45],"folded":[47],"devices":[48],"that":[49],"combine":[50],"flexibility":[52],"cross-linked":[54],"polymers":[55],"with":[56],"functionality":[58],"2D":[60],"atomistic":[61],"materials":[62],"importance":[64],"to":[65],"wearables,":[66],"robotics,":[67],"biosensors.":[69]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2}],"updated_date":"2026-03-27T14:29:43.386196","created_date":"2025-10-10T00:00:00"}