{"id":"https://openalex.org/W4386966744","doi":"https://doi.org/10.1002/aisy.202300364","title":"PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes","display_name":"PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes","publication_year":2023,"publication_date":"2023-09-21","ids":{"openalex":"https://openalex.org/W4386966744","doi":"https://doi.org/10.1002/aisy.202300364"},"language":"en","primary_location":{"id":"doi:10.1002/aisy.202300364","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.202300364","pdf_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/aisy.202300364","source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/aisy.202300364","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5017814882","display_name":"Sik\u2010Ho Tsang","orcid":"https://orcid.org/0000-0002-8578-0696"},"institutions":[{"id":"https://openalex.org/I2800906782","display_name":"Hong Kong Science and Technology Parks Corporation","ror":"https://ror.org/05q8mqd91","country_code":"HK","type":"nonprofit","lineage":["https://openalex.org/I2800906782"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Sik-Ho Tsang","raw_affiliation_strings":["Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China"],"affiliations":[{"raw_affiliation_string":"Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","institution_ids":["https://openalex.org/I2800906782"]},{"raw_affiliation_string":"Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China","institution_ids":["https://openalex.org/I2800906782"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102558861","display_name":"Zhaoqing Suo","orcid":null},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]},{"id":"https://openalex.org/I2800906782","display_name":"Hong Kong Science and Technology Parks Corporation","ror":"https://ror.org/05q8mqd91","country_code":"HK","type":"nonprofit","lineage":["https://openalex.org/I2800906782"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Zhaoqing Suo","raw_affiliation_strings":["Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University  Hung Hom Hong Kong China","Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, China","Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University  Hung Hom Hong Kong China","institution_ids":["https://openalex.org/I14243506"]},{"raw_affiliation_string":"Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","institution_ids":["https://openalex.org/I2800906782"]},{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, China","institution_ids":["https://openalex.org/I14243506"]},{"raw_affiliation_string":"Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China","institution_ids":["https://openalex.org/I2800906782"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113049018","display_name":"Tom Tak-Lam Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I2800906782","display_name":"Hong Kong Science and Technology Parks Corporation","ror":"https://ror.org/05q8mqd91","country_code":"HK","type":"nonprofit","lineage":["https://openalex.org/I2800906782"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Tom Tak-Lam Chan","raw_affiliation_strings":["Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China"],"affiliations":[{"raw_affiliation_string":"Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","institution_ids":["https://openalex.org/I2800906782"]},{"raw_affiliation_string":"Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China","institution_ids":["https://openalex.org/I2800906782"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076655079","display_name":"Huu-Thanh Nguyen","orcid":"https://orcid.org/0000-0001-8493-2240"},"institutions":[{"id":"https://openalex.org/I2800906782","display_name":"Hong Kong Science and Technology Parks Corporation","ror":"https://ror.org/05q8mqd91","country_code":"HK","type":"nonprofit","lineage":["https://openalex.org/I2800906782"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Huu-Thanh Nguyen","raw_affiliation_strings":["Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China"],"affiliations":[{"raw_affiliation_string":"Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","institution_ids":["https://openalex.org/I2800906782"]},{"raw_affiliation_string":"Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China","institution_ids":["https://openalex.org/I2800906782"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045479823","display_name":"Daniel Pak-Kong Lun","orcid":"https://orcid.org/0000-0003-3891-1363"},"institutions":[{"id":"https://openalex.org/I14243506","display_name":"Hong Kong Polytechnic University","ror":"https://ror.org/0030zas98","country_code":"HK","type":"education","lineage":["https://openalex.org/I14243506"]},{"id":"https://openalex.org/I2800906782","display_name":"Hong Kong Science and Technology Parks Corporation","ror":"https://ror.org/05q8mqd91","country_code":"HK","type":"nonprofit","lineage":["https://openalex.org/I2800906782"]}],"countries":["HK"],"is_corresponding":true,"raw_author_name":"Daniel Pak-Kong Lun","raw_affiliation_strings":["Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University  Hung Hom Hong Kong China","Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China","Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, China"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University  Hung Hom Hong Kong China","institution_ids":["https://openalex.org/I14243506"]},{"raw_affiliation_string":"Unit 1212-1213 Hong Kong Science Park  12/F, Building 19W, Pak Shek Kok, NT Hong Kong China","institution_ids":["https://openalex.org/I2800906782"]},{"raw_affiliation_string":"Unit 1212-1213, Hong Kong Science Park, 12/F, Building 19W, Pak Shek Kok, NT, Hong Kong, China","institution_ids":["https://openalex.org/I2800906782"]},{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, China","institution_ids":["https://openalex.org/I14243506"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5045479823"],"corresponding_institution_ids":["https://openalex.org/I14243506","https://openalex.org/I2800906782"],"apc_list":{"value":2750,"currency":"USD","value_usd":2750},"apc_paid":{"value":2750,"currency":"USD","value_usd":2750},"fwci":2.6401,"has_fulltext":true,"cited_by_count":13,"citation_normalized_percentile":{"value":0.90425532,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"5","issue":"12","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.722752571105957},{"id":"https://openalex.org/keywords/deep-learning","display_name":"Deep learning","score":0.7020100355148315},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.6794655919075012},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.6709610223770142},{"id":"https://openalex.org/keywords/segmentation","display_name":"Segmentation","score":0.6033663749694824},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5734374523162842},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5703156590461731},{"id":"https://openalex.org/keywords/automated-optical-inspection","display_name":"Automated optical inspection","score":0.5130802392959595},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.4566565752029419},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.45205846428871155},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.4235663115978241},{"id":"https://openalex.org/keywords/task","display_name":"Task (project management)","score":0.4107239842414856},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.34708571434020996},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.34316718578338623},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17072132229804993}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.722752571105957},{"id":"https://openalex.org/C108583219","wikidata":"https://www.wikidata.org/wiki/Q197536","display_name":"Deep learning","level":2,"score":0.7020100355148315},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6794655919075012},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.6709610223770142},{"id":"https://openalex.org/C89600930","wikidata":"https://www.wikidata.org/wiki/Q1423946","display_name":"Segmentation","level":2,"score":0.6033663749694824},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5734374523162842},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5703156590461731},{"id":"https://openalex.org/C164830781","wikidata":"https://www.wikidata.org/wiki/Q787330","display_name":"Automated optical inspection","level":2,"score":0.5130802392959595},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.4566565752029419},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.45205846428871155},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.4235663115978241},{"id":"https://openalex.org/C2780451532","wikidata":"https://www.wikidata.org/wiki/Q759676","display_name":"Task (project management)","level":2,"score":0.4107239842414856},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.34708571434020996},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.34316718578338623},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17072132229804993},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1002/aisy.202300364","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.202300364","pdf_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/aisy.202300364","source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},{"id":"pmh:oai:ira.lib.polyu.edu.hk:10397/109321","is_oa":true,"landing_page_url":"http://hdl.handle.net/10397/109321","pdf_url":"http://ira.lib.polyu.edu.hk/bitstream/10397/109321/1/Tsang_PCB_Soldering_Defect.pdf","source":{"id":"https://openalex.org/S4306400205","display_name":"PolyU Institutional Research Archive (Hong Kong Polytechnic University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I14243506","host_organization_name":"Hong Kong Polytechnic University","host_organization_lineage":["https://openalex.org/I14243506"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Journal/Magazine Article"},{"id":"pmh:oai:doaj.org/article:ec980cde730b435f808567ccf9a67f56","is_oa":true,"landing_page_url":"https://doaj.org/article/ec980cde730b435f808567ccf9a67f56","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Advanced Intelligent Systems, Vol 5, Iss 12, Pp n/a-n/a (2023)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1002/aisy.202300364","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.202300364","pdf_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/aisy.202300364","source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4386966744.pdf"},"referenced_works_count":24,"referenced_works":["https://openalex.org/W2048328592","https://openalex.org/W2125150158","https://openalex.org/W2156658085","https://openalex.org/W2803361407","https://openalex.org/W2886256586","https://openalex.org/W2919115771","https://openalex.org/W2956416874","https://openalex.org/W2997116767","https://openalex.org/W3000147203","https://openalex.org/W3010640005","https://openalex.org/W3010817235","https://openalex.org/W3028888497","https://openalex.org/W3080816748","https://openalex.org/W3107625569","https://openalex.org/W3152730830","https://openalex.org/W3202287565","https://openalex.org/W3203234901","https://openalex.org/W4205553873","https://openalex.org/W4210605464","https://openalex.org/W4285170881","https://openalex.org/W4306149435","https://openalex.org/W4317513057","https://openalex.org/W4383341662","https://openalex.org/W4386966744"],"related_works":["https://openalex.org/W1634269331","https://openalex.org/W101095401","https://openalex.org/W2041333522","https://openalex.org/W1997199353","https://openalex.org/W2151533009","https://openalex.org/W2353288894","https://openalex.org/W4362650061","https://openalex.org/W3105937001","https://openalex.org/W2969283495","https://openalex.org/W2107946198"],"abstract_inverted_index":{"To":[0,48,95,132],"increase":[1],"the":[2,5,37,40,70,111,121,134,148,154,160,172,176],"reliability":[3],"of":[4,39,72,183],"printed":[6],"circuit":[7],"board":[8],"(PCB)":[9],"manufacturing":[10],"process,":[11],"automated":[12],"optical":[13],"inspection":[14],"is":[15,59,76,103,126,143],"often":[16,34,77],"employed":[17],"for":[18,186],"soldering":[19,55,137],"defect":[20,56,138],"detection.":[21],"However,":[22],"traditional":[23],"approaches":[24,179],"built":[25],"on":[26,147],"handcrafted":[27],"features,":[28],"predefined":[29],"rules,":[30],"or":[31],"thresholds":[32],"are":[33],"susceptible":[35],"to":[36,92],"variation":[38],"acquired":[41],"images\u2019":[42],"quality":[43],"and":[44,113,164],"give":[45],"unstable":[46],"performances.":[47],"solve":[49],"this":[50,62,97],"problem,":[51],"a":[52,81,99,136],"deep":[53,67,86],"learning\u2010based":[54],"detection":[57],"method":[58],"developed":[60],"in":[61],"article.":[63],"Like":[64],"many":[65],"real\u2010life":[66],"learning":[68,87,101],"applications,":[69],"number":[71],"available":[73],"training":[74],"samples":[75],"limited.":[78],"This":[79],"creates":[80],"challenging":[82],"low\u2010data":[83,117],"scenario,":[84],"as":[85],"typically":[88],"requires":[89],"massive":[90],"data":[91],"perform":[93],"well.":[94],"address":[96],"issue,":[98],"multitask":[100],"model":[102],"proposed,":[104],"namely,":[105,141],"PCBMTL,":[106],"that":[107,171],"can":[108],"simultaneously":[109],"learn":[110],"classification":[112,124],"segmentation":[114,122],"tasks":[115],"under":[116],"regimes.":[118],"By":[119],"acquiring":[120],"knowledge,":[123],"performance":[125],"substantially":[127],"improved":[128],"with":[129],"few":[130],"samples.":[131],"facilitate":[133],"study,":[135],"image":[139],"dataset,":[140],"PCBSPDefect,":[142],"built.":[144],"It":[145],"focuses":[146],"dual":[149],"in\u2010line":[150],"packages":[151],"(DIP)":[152],"at":[153,159],"PCB":[155,161],"back":[156],"side,":[157,163],"DIP":[158],"front":[162],"flat":[165],"flexible":[166],"cables.":[167],"Experimental":[168],"results":[169],"show":[170],"proposed":[173],"PCBMTL":[174],"outperforms":[175],"best":[177],"existing":[178],"by":[180],"over":[181],"5\u201317%":[182],"average":[184],"accuracy":[185],"different":[187],"datasets.":[188]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":9},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2026-03-27T14:29:43.386196","created_date":"2025-10-10T00:00:00"}