{"id":"https://openalex.org/W2980008517","doi":"https://doi.org/10.1002/aisy.201900080","title":"Robotic Hands with Intrinsic Tactile Sensing via 3D Printed Soft Pressure Sensors","display_name":"Robotic Hands with Intrinsic Tactile Sensing via 3D Printed Soft Pressure Sensors","publication_year":2019,"publication_date":"2019-10-09","ids":{"openalex":"https://openalex.org/W2980008517","doi":"https://doi.org/10.1002/aisy.201900080","mag":"2980008517"},"language":"en","primary_location":{"id":"doi:10.1002/aisy.201900080","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.201900080","pdf_url":null,"source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://doi.org/10.1002/aisy.201900080","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5042472675","display_name":"Markellos Ntagios","orcid":"https://orcid.org/0000-0002-1908-2494"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Markellos Ntagios","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK"],"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","institution_ids":["https://openalex.org/I7882870"]},{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074599230","display_name":"Habib Nassar","orcid":"https://orcid.org/0000-0003-2181-185X"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Habib Nassar","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK"],"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","institution_ids":["https://openalex.org/I7882870"]},{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033207144","display_name":"Abhilash Pullanchiyodan","orcid":"https://orcid.org/0000-0002-0192-2678"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Abhilash Pullanchiyodan","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK"],"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","institution_ids":["https://openalex.org/I7882870"]},{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075958632","display_name":"William Taube Navaraj","orcid":"https://orcid.org/0000-0003-4753-2015"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"William Taube Navaraj","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK"],"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","institution_ids":["https://openalex.org/I7882870"]},{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085150253","display_name":"Ravinder Dahiya","orcid":"https://orcid.org/0000-0002-3858-3841"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"Ravinder Dahiya","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK"],"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group School of Engineering University of Glasgow  G12 8QQ Glasgow UK","institution_ids":["https://openalex.org/I7882870"]},{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK","institution_ids":["https://openalex.org/I7882870"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5085150253"],"corresponding_institution_ids":["https://openalex.org/I7882870"],"apc_list":{"value":2750,"currency":"USD","value_usd":2750},"apc_paid":{"value":2750,"currency":"USD","value_usd":2750},"fwci":6.749,"has_fulltext":false,"cited_by_count":136,"citation_normalized_percentile":{"value":0.97606698,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":100},"biblio":{"volume":"2","issue":"6","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.7872215509414673},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.7574663162231445},{"id":"https://openalex.org/keywords/soft-robotics","display_name":"Soft robotics","score":0.7303029894828796},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.7090421319007874},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6046218872070312},{"id":"https://openalex.org/keywords/thermoplastic-polyurethane","display_name":"Thermoplastic polyurethane","score":0.5614914298057556},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.5563592910766602},{"id":"https://openalex.org/keywords/3d-printer","display_name":"3d printer","score":0.5292515158653259},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.5080454349517822},{"id":"https://openalex.org/keywords/tactile-sensor","display_name":"Tactile sensor","score":0.4666231870651245},{"id":"https://openalex.org/keywords/robotic-hand","display_name":"Robotic hand","score":0.44806209206581116},{"id":"https://openalex.org/keywords/inkwell","display_name":"Inkwell","score":0.4465911090373993},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35203883051872253},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.29800155758857727},{"id":"https://openalex.org/keywords/biomedical-engineering","display_name":"Biomedical engineering","score":0.2224450409412384},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.20214205980300903},{"id":"https://openalex.org/keywords/robot","display_name":"Robot","score":0.20061805844306946},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.1891627311706543},{"id":"https://openalex.org/keywords/elastomer","display_name":"Elastomer","score":0.18690863251686096},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1773872971534729},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17544519901275635}],"concepts":[{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.7872215509414673},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.7574663162231445},{"id":"https://openalex.org/C2776058767","wikidata":"https://www.wikidata.org/wiki/Q24327151","display_name":"Soft robotics","level":3,"score":0.7303029894828796},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.7090421319007874},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6046218872070312},{"id":"https://openalex.org/C2777069470","wikidata":"https://www.wikidata.org/wiki/Q7783228","display_name":"Thermoplastic polyurethane","level":3,"score":0.5614914298057556},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.5563592910766602},{"id":"https://openalex.org/C2984377249","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printer","level":2,"score":0.5292515158653259},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5080454349517822},{"id":"https://openalex.org/C46722567","wikidata":"https://www.wikidata.org/wiki/Q7674139","display_name":"Tactile sensor","level":3,"score":0.4666231870651245},{"id":"https://openalex.org/C2988191880","wikidata":"https://www.wikidata.org/wiki/Q40687","display_name":"Robotic hand","level":3,"score":0.44806209206581116},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.4465911090373993},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35203883051872253},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.29800155758857727},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.2224450409412384},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.20214205980300903},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.20061805844306946},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.1891627311706543},{"id":"https://openalex.org/C38052585","wikidata":"https://www.wikidata.org/wiki/Q252266","display_name":"Elastomer","level":2,"score":0.18690863251686096},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1773872971534729},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17544519901275635}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1002/aisy.201900080","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.201900080","pdf_url":null,"source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},{"id":"pmh:oai:eprints.gla.ac.uk:195108","is_oa":true,"landing_page_url":"http://eprints.gla.ac.uk/view/author/45010.html>","pdf_url":null,"source":{"id":"https://openalex.org/S4210235606","display_name":"ENLIGHTEN (Jurnal Bimbingan dan Konseling Islam)","issn_l":"2622-8912","issn":["2622-8912","2622-8920"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":null,"raw_type":"PeerReviewed"},{"id":"pmh:oai:irep.ntu.ac.uk:38961","is_oa":false,"landing_page_url":null,"pdf_url":null,"source":{"id":"https://openalex.org/S4306400559","display_name":"Nottingham Trent University's Institutional Repository (Nottingham Trent Repository)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I52590639","host_organization_name":"Nottingham Trent University","host_organization_lineage":["https://openalex.org/I52590639"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"acceptedVersion","is_accepted":true,"is_published":false,"raw_source_name":"","raw_type":"Article"},{"id":"pmh:oai:doaj.org/article:b595763c3c7a45d8ada8808c7e6abf73","is_oa":true,"landing_page_url":"https://doaj.org/article/b595763c3c7a45d8ada8808c7e6abf73","pdf_url":null,"source":{"id":"https://openalex.org/S112646816","display_name":"SHILAP Revista de lepidopterolog\u00eda","issn_l":"0300-5267","issn":["0300-5267","2340-4078"],"is_oa":true,"is_in_doaj":true,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Advanced Intelligent Systems, Vol 2, Iss 6, Pp n/a-n/a (2020)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1002/aisy.201900080","is_oa":true,"landing_page_url":"https://doi.org/10.1002/aisy.201900080","pdf_url":null,"source":{"id":"https://openalex.org/S4210212817","display_name":"Advanced Intelligent Systems","issn_l":"2640-4567","issn":["2640-4567"],"is_oa":true,"is_in_doaj":true,"is_core":true,"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advanced Intelligent Systems","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G5700227342","display_name":null,"funder_award_id":"EP/R512266/1","funder_id":"https://openalex.org/F4320334627","funder_display_name":"Engineering and Physical Sciences Research Council"}],"funders":[{"id":"https://openalex.org/F4320334627","display_name":"Engineering and Physical Sciences Research Council","ror":"https://ror.org/0439y7842"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":52,"referenced_works":["https://openalex.org/W815080081","https://openalex.org/W1515749184","https://openalex.org/W1656143830","https://openalex.org/W1782215331","https://openalex.org/W1972335412","https://openalex.org/W1980855375","https://openalex.org/W1983156320","https://openalex.org/W1995213905","https://openalex.org/W1999585120","https://openalex.org/W2002527773","https://openalex.org/W2012606450","https://openalex.org/W2025138352","https://openalex.org/W2029953460","https://openalex.org/W2038937326","https://openalex.org/W2045279221","https://openalex.org/W2053483979","https://openalex.org/W2059772445","https://openalex.org/W2064299621","https://openalex.org/W2064432492","https://openalex.org/W2070445316","https://openalex.org/W2084773197","https://openalex.org/W2098592741","https://openalex.org/W2103288831","https://openalex.org/W2120129481","https://openalex.org/W2129547735","https://openalex.org/W2139096963","https://openalex.org/W2143765114","https://openalex.org/W2145999635","https://openalex.org/W2151386142","https://openalex.org/W2171130677","https://openalex.org/W2172143926","https://openalex.org/W2227388478","https://openalex.org/W2294620227","https://openalex.org/W2343044516","https://openalex.org/W2525560340","https://openalex.org/W2531416156","https://openalex.org/W2553221934","https://openalex.org/W2565037204","https://openalex.org/W2584686014","https://openalex.org/W2598909259","https://openalex.org/W2615857549","https://openalex.org/W2755222108","https://openalex.org/W2762149733","https://openalex.org/W2789994810","https://openalex.org/W2793435880","https://openalex.org/W2904979905","https://openalex.org/W2906776524","https://openalex.org/W2906982451","https://openalex.org/W2911918145","https://openalex.org/W2947690398","https://openalex.org/W2973548844","https://openalex.org/W4255852758"],"related_works":["https://openalex.org/W3153919089","https://openalex.org/W1979945082","https://openalex.org/W4322731033","https://openalex.org/W2614950215","https://openalex.org/W4283740974","https://openalex.org/W4385482464","https://openalex.org/W3196562368","https://openalex.org/W4296901090","https://openalex.org/W3163518500","https://openalex.org/W2994723502"],"abstract_inverted_index":{"Herein,":[0],"the":[1,26,66,104,108,138,141,164,173],"development":[2],"of":[3,25,65,76,107,121,179],"complex":[4],"3D":[5,27,71,86,109,142,165],"intelligent":[6],"structures":[7],"such":[8,44],"as":[9,45,168],"robotic":[10,111],"hands":[11],"using":[12,68],"innovative":[13],"designs":[14],"and":[15,40,82,96,129,190],"multimaterial":[16],"additive":[17],"manufacturing":[18],"technology":[19],"is":[20,74,151],"presented.":[21],"The":[22,84,158],"distal":[23,105],"phalanges":[24,106],"printed":[28,87,110,143,166],"hand":[29,144],"presented":[30,169],"herein":[31],"have":[32],"inherent":[33],"soft":[34,88,97,147],"capacitive":[35,89,148],"touch":[36,90,149],"or":[37],"pressure":[38,126],"sensors":[39,67,114,150],"embedded":[41,146],"electronics.":[42],"Materials":[43],"thermoplastic":[46],"polyurethane":[47],"(TPU),":[48],"silver":[49,94],"paint,":[50],"conductive":[51,78],"polylactic":[52],"acid":[53],"composite,":[54],"graphite":[55],"ink,":[56,79],"etc.":[57],"are":[58,101],"explored":[59],"to":[60],"develop":[61],"five":[62],"different":[63],"variants":[64],"a":[69,116,176],"modified":[70],"printer,":[72],"which":[73],"capable":[75],"extruding":[77],"metal":[80],"paste,":[81],"polymers.":[83],"best\u2010performing":[85],"sensors,":[91],"formed":[92],"with":[93,119,145,155],"paint":[95],"rubber":[98],"(Ecoflex":[99],"00\u201030),":[100],"integrated":[102,160],"on":[103],"hand.":[112],"These":[113],"exhibit":[115],"stable":[117],"response":[118],"sensitivity":[120],"0.00348":[122],"kPa":[123,128,131],"\u22121":[124,132],"for":[125,133,153,175],"<10":[127],"0.00134":[130],"higher":[134],"pressure.":[135],"To":[136],"demonstrate":[137],"practical":[139],"applicability,":[140],"used":[152],"interacting":[154],"everyday":[156],"objects.":[157],"tightly":[159],"sensing":[161],"elements":[162],"within":[163],"structures,":[167],"herein,":[170],"can":[171,185],"pave":[172],"way":[174],"new":[177],"generation":[178],"truly":[180],"smart":[181],"material":[182],"systems":[183],"that":[184],"possibly":[186],"change":[187],"their":[188],"appearance":[189],"shape":[191],"autonomously.":[192]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":20},{"year":2024,"cited_by_count":16},{"year":2023,"cited_by_count":30},{"year":2022,"cited_by_count":20},{"year":2021,"cited_by_count":31},{"year":2020,"cited_by_count":18}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}