{"id":"https://openalex.org/W958025858","doi":"https://doi.org/10.7494/cmms.2013.1.0410","title":"Statistical and probabilistic techniques in modeling of epoxy cracking phenomena","display_name":"Statistical and probabilistic techniques in modeling of epoxy cracking phenomena","publication_year":2013,"publication_date":"2013-01-01","ids":{"openalex":"https://openalex.org/W958025858","doi":"https://doi.org/10.7494/cmms.2013.1.0410","mag":"958025858"},"language":"en","primary_location":{"id":"doi:10.7494/cmms.2013.1.0410","doi":"https://doi.org/10.7494/cmms.2013.1.0410","is_oa":true,"landing_page_url":"https://doi.org/10.7494/cmms.2013.1.0410","pdf_url":"https://www.cmms.agh.edu.pl/public_repo/2013_1_0410.pdf","source":{"id":"https://openalex.org/S4404674929","display_name":"Computer Methods in Materials Science.","issn_l":"1641-8581","issn":["1641-8581","2720-3948","2720-4081"],"is_oa":false,"is_in_doaj":true,"is_core":false,"listed_in":["ddh","doaj","norway-1","poland-40"],"host_organization":"https://openalex.org/P4310320333","host_organization_name":"Wydawnictwa AGH","host_organization_lineage":["https://openalex.org/P4310320333"],"host_organization_lineage_names":["Wydawnictwa AGH"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Computer Methods in Materials Science","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://www.cmms.agh.edu.pl/public_repo/2013_1_0410.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065662532","display_name":"Tomasz Nowak","orcid":"https://orcid.org/0000-0003-3018-0439","observed_orcids":["https://orcid.org/0000-0003-3018-0439"]},"institutions":[{"id":"https://openalex.org/I4210126596","display_name":"ABB (Poland)","ror":"https://ror.org/03dn6qp98","country_code":"PL","type":"company","lineage":["https://openalex.org/I4210126596","https://openalex.org/I885143765"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Tomasz Nowak","raw_affiliation_strings":["ABB Corporate Research Center, Krakow, Poland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ABB Corporate Research Center, Krakow, Poland","institution_ids":["https://openalex.org/I4210126596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5012540261","display_name":"Mateusz Ambrozi\u0144ski","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I686019","display_name":"AGH University of Krakow","ror":"https://ror.org/00bas1c41","country_code":"PL","type":"education","lineage":["https://openalex.org/I686019"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Mateusz Ambrozi\u0144ski","raw_affiliation_strings":["AGH University of Science and Technology, Krakow, Poland","AGH Univ. of Science and Technology, Krakow, Poland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AGH University of Science and Technology, Krakow, Poland","institution_ids":["https://openalex.org/I686019"]},{"raw_affiliation_string":"AGH Univ. of Science and Technology, Krakow, Poland","institution_ids":["https://openalex.org/I686019"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":0,"currency":"USD","value_usd":0},"apc_paid":{"value":0,"currency":"USD","value_usd":0},"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.05366195,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"13","issue":"1","first_page":"49","last_page":"55"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.48969998955726624,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.48969998955726624,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","score":0.09189999848604202,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.08590000122785568,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/process-induced-residual-stresses","display_name":"process-induced residual stress","score":0.8050000071525574},{"id":"https://openalex.org/keywords/weibull-distribution","display_name":"Weibull distribution","score":0.800000011920929},{"id":"https://openalex.org/keywords/failure-probability-model","display_name":"failure probability model","score":0.902999997138977},{"id":"https://openalex.org/keywords/probabilistic-fracture-mechanics","display_name":"probabilistic fracture mechanics","score":0.4269999861717224},{"id":"https://openalex.org/keywords/low-temperature-cracking","display_name":"low-temperature cracking","score":0.7940000295639038},{"id":"https://openalex.org/keywords/experimental-design","display_name":"experimental design","score":0.6769999861717224},{"id":"https://openalex.org/keywords/finite-element-analysis","display_name":"finite element analysis","score":0.7760000228881836},{"id":"https://openalex.org/keywords/electrical-insulation-materials","display_name":"electrical insulation materials","score":0.6290000081062317}],"concepts":[{"id":"https://openalex.org/C58396970","wikidata":"https://www.wikidata.org/wiki/Q212749","display_name":"Cracking","level":2,"score":0.7928690910339355},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.7702837586402893},{"id":"https://openalex.org/C49937458","wikidata":"https://www.wikidata.org/wiki/Q2599292","display_name":"Probabilistic logic","level":2,"score":0.6528874635696411},{"id":"https://openalex.org/C114289077","wikidata":"https://www.wikidata.org/wiki/Q3284399","display_name":"Statistical model","level":2,"score":0.5792286396026611},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.456946462392807},{"id":"https://openalex.org/C77595967","wikidata":"https://www.wikidata.org/wiki/Q3151013","display_name":"Forensic engineering","level":1,"score":0.36296790838241577},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.36152568459510803},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3515605926513672},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17258939146995544},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.151861310005188}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.7494/cmms.2013.1.0410","doi":"https://doi.org/10.7494/cmms.2013.1.0410","is_oa":true,"landing_page_url":"https://doi.org/10.7494/cmms.2013.1.0410","pdf_url":"https://www.cmms.agh.edu.pl/public_repo/2013_1_0410.pdf","source":{"id":"https://openalex.org/S4404674929","display_name":"Computer Methods in Materials Science.","issn_l":"1641-8581","issn":["1641-8581","2720-3948","2720-4081"],"is_oa":false,"is_in_doaj":true,"is_core":false,"listed_in":["ddh","doaj","norway-1","poland-40"],"host_organization":"https://openalex.org/P4310320333","host_organization_name":"Wydawnictwa AGH","host_organization_lineage":["https://openalex.org/P4310320333"],"host_organization_lineage_names":["Wydawnictwa AGH"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Computer Methods in Materials Science","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:c67dcb41e7014764b96e402e322855b6","doi":null,"is_oa":false,"landing_page_url":"https://doaj.org/article/c67dcb41e7014764b96e402e322855b6","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Computer Methods in Materials Science, Vol 13, Iss 1, Pp 49-55 (2013)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.7494/cmms.2013.1.0410","doi":"https://doi.org/10.7494/cmms.2013.1.0410","is_oa":true,"landing_page_url":"https://doi.org/10.7494/cmms.2013.1.0410","pdf_url":"https://www.cmms.agh.edu.pl/public_repo/2013_1_0410.pdf","source":{"id":"https://openalex.org/S4404674929","display_name":"Computer Methods in Materials Science.","issn_l":"1641-8581","issn":["1641-8581","2720-3948","2720-4081"],"is_oa":false,"is_in_doaj":true,"is_core":false,"listed_in":["ddh","doaj","norway-1","poland-40"],"host_organization":"https://openalex.org/P4310320333","host_organization_name":"Wydawnictwa AGH","host_organization_lineage":["https://openalex.org/P4310320333"],"host_organization_lineage_names":["Wydawnictwa AGH"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Computer Methods in Materials Science","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.428600013256073,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W958025858.pdf","grobid_xml":"https://content.openalex.org/works/W958025858.grobid-xml"},"referenced_works_count":4,"referenced_works":["https://openalex.org/W1996583965","https://openalex.org/W2062859188","https://openalex.org/W2145990172","https://openalex.org/W3002258095"],"related_works":["https://openalex.org/W1500500072","https://openalex.org/W4319226676","https://openalex.org/W196136775","https://openalex.org/W2029187765","https://openalex.org/W3204043125","https://openalex.org/W2495241638","https://openalex.org/W1603741258","https://openalex.org/W2058043011","https://openalex.org/W2322848245","https://openalex.org/W4407453526"],"abstract_inverted_index":{"Epoxy":[0],"resins":[1],"filled":[2,55],"with":[3],"mineral":[4],"particles,":[5],"such":[6],"as":[7,17,149,218,220],"silica":[8],"and":[9,14,28,32,36,158,188,237,247,260],"alumina,":[10],"are":[11,25,39,102,116],"well":[12,219],"known":[13],"extensively":[15],"used":[16,232],"insulating":[18],"materials":[19],"in":[20,45,185],"power":[21],"product":[22,244],"applications.":[23],"They":[24],"relatively":[26],"cheap":[27],"easy":[29],"to":[30,41,65,120,161,171,233,238],"process,":[31],"their":[33,43,189],"dielectric,":[34],"thermal":[35,114],"mechanical":[37,51],"properties":[38],"appropriate":[40],"maintain":[42],"functionality":[44],"different":[46],"electrical":[47],"devices.":[48],"However,":[49],"the":[50,72,75,83,92,99,113,138,145,163,167,206,212,225,241,248,252],"performance":[52],"of":[53,74,82,137,143,166,181,211,227,266],"particle":[54],"epoxy":[56,76,186],"systems":[57],"can":[58,126],"be":[59,172],"often":[60],"influenced":[61],"by":[62],"limited":[63],"resistance":[64,165],"cracking.":[66],"It":[67,105],"is":[68,106,176],"frequently":[69],"experienced":[70],"during":[71,88,109],"lifetime":[73],"cast":[77],"products":[78,125],"that":[79],"some":[80,156,255],"members":[81],"production":[84],"lot":[85],"will":[86,94],"crack":[87,127],"verification":[89],"tests,":[90,111],"while":[91,130],"others":[93,131],"remain":[95],"healthy,":[96],"even":[97],"if":[98],"test":[100],"loads":[101],"seriously":[103],"increased.":[104],"especially":[107],"seen":[108],"low-temperature":[110],"when":[112,122],"conditions":[115],"changed":[117],"from":[118],"+120\u00b0C":[119],"-60\u00b0C,":[121],"a":[123,150,179],"few":[124],"at":[128],"+10\u00b0C,":[129],"may":[132],"easily":[133],"survive":[134],"till":[135],"end":[136],"tests.":[139],"This":[140,174],"phenomenon":[141],"prohibits":[142],"using":[144],"classical":[146],"material":[147,169,192],"strength":[148],"failure":[151,197,249],"criterion.":[152],"For":[153],"this":[154],"reason,":[155],"statistical":[157,259],"probabilistic":[159,261],"approaches":[160],"describe":[162],"cracking":[164,193],"epoxy-based":[168],"have":[170],"considered.":[173],"work":[175],"focused":[177],"on":[178,191],"study":[180],"process-induced":[182],"residual":[183],"stresses":[184],"components":[187],"effect":[190],"likelihood.":[194,250],"The":[195,203],"proposed":[196],"probability":[198],"model":[199,214],"incorporates":[200],"Weibull":[201,213],"distribution.":[202],"paper":[204],"provides":[205],"experimental":[207],"procedure":[208],"for":[209,257],"estimation":[210],"parameters":[215,246],"(\uf061,":[216],"\uf062),":[217],"implementation":[221],"remarks.":[222],"In":[223],"addition,":[224],"Design":[226],"Experiment":[228],"(DoE)":[229],"method":[230],"was":[231],"support":[234],"FEM":[235,267],"calculations,":[236],"find":[239],"out":[240],"correlation":[242],"between":[243],"design":[245],"Finally,":[251],"article":[253],"outlines":[254],"recommendations":[256],"applying":[258],"methods":[262],"into":[263],"numerical":[264],"procedures":[265],"analysis.":[268]},"counts_by_year":[],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2016-06-24T00:00:00"}