{"id":"https://openalex.org/W8392652","doi":null,"title":"Etude des effets thermiques, structuraux et m\u00e9caniques sur la fiabilit\u00e9 des interconnexions des circuits int\u00e9gr\u00e9s par simulation num\u00e9rique","display_name":"Etude des effets thermiques, structuraux et m\u00e9caniques sur la fiabilit\u00e9 des interconnexions des circuits int\u00e9gr\u00e9s par simulation num\u00e9rique","publication_year":1993,"publication_date":"1993-01-01","ids":{"openalex":"https://openalex.org/W8392652","mag":"8392652"},"language":"fr","primary_location":{"id":"mag:8392652","doi":null,"is_oa":false,"landing_page_url":"http://www.theses.fr/1993ISAL0001","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null},"volume":null,"type":"dissertation","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5031586277","display_name":"Sa\u01ced Abdeslam","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Sa\u01ced Abdeslam","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5031586277"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0005000000237487257,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnect-reliability","display_name":"interconnect reliability","score":0.722000002861023},{"id":"https://openalex.org/keywords/integrated-circuits","display_name":"integrated circuits","score":0.5360000133514404},{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.8059999942779541},{"id":"https://openalex.org/keywords/metal-interconnects","display_name":"metal interconnects","score":0.6809999942779541},{"id":"https://openalex.org/keywords/thermal-effects","display_name":"thermal effects","score":0.574999988079071},{"id":"https://openalex.org/keywords/structural-heterogeneity","display_name":"structural heterogeneity","score":0.7829999923706055},{"id":"https://openalex.org/keywords/mechanical-effects","display_name":"mechanical effects","score":0.6909999847412109},{"id":"https://openalex.org/keywords/oxide-film","display_name":"oxide layer","score":0.4309999942779541},{"id":"https://openalex.org/keywords/current-density","display_name":"current density","score":0.4869999885559082},{"id":"https://openalex.org/keywords/microstructural-inhomogeneity","display_name":"microstructural inhomogeneity","score":0.5860000252723694}],"concepts":[{"id":"https://openalex.org/C15708023","wikidata":"https://www.wikidata.org/wiki/Q80083","display_name":"Humanities","level":1,"score":0.7893636226654053},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.7104811668395996},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.27998727560043335}],"mesh":[],"locations_count":1,"locations":[{"id":"mag:8392652","doi":null,"is_oa":false,"landing_page_url":"http://www.theses.fr/1993ISAL0001","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5378999710083008,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W853302357","https://openalex.org/W566163146","https://openalex.org/W4393368498","https://openalex.org/W2606381466","https://openalex.org/W156986010","https://openalex.org/W574344674","https://openalex.org/W6980204750","https://openalex.org/W7033916878","https://openalex.org/W126083840","https://openalex.org/W2542101764"],"abstract_inverted_index":{"Les":[0,87,127],"augmentations":[1],"de":[2,7,26,28,47,70,79,83,89,91,96,99,101,113,129,132,140,144,157,176,184,186,195,204,212,215,228,238],"la":[3,8,75,84,130,165,177],"densite":[4,100],"d'integration":[5],"et":[6,98,107,149,179,202,230],"complexite":[9],"des":[10,18,23,38,94,134,155,182,193,218],"circuits":[11],"integres":[12],"font":[13,137],"que":[14],"les":[15,61,111,122,146,160,170,222,226],"interconnexions":[16,39],"metalliques":[17],"niveaux":[19],"superieures":[20],"constituent":[21,164],"un":[22,45,153,236],"principaux":[24],"facteurs":[25],"limitation":[27],"leur":[29,232],"fiabilite.":[30],"Le":[31],"mecanisme":[32],"physique":[33],"a":[34,173,198,242],"l'origine":[35],"du":[36,68,180],"dysfonctionnement":[37],"en":[40,120,151,234],"service":[41],"est":[42],"l\u2019electro":[43,246],"migration":[44],"transfert":[46],"matiere":[48,71,158,239],"induit":[49],"par":[50,74,125,245],"le":[51],"passage":[52],"d'un":[53],"courant":[54,102],"electrique":[55],"continu.":[56],"Ce":[57],"sont,":[58],"plus":[59],"precisement,":[60],"heterogeneites":[62,207],"d'origine":[63],"structurales,":[64],"geometriques":[65],"ou":[66,78],"thermiques":[67],"flot":[69,237],"qui":[72,103,136,163,240],"induisent,":[73],"formation":[76],"d'excroissances":[77],"cavites,":[80],"une":[81,191],"augmentation":[82],"resistance":[85],"electrique.":[86],"tests":[88,115,183],"duree":[90,131,185],"vie":[92,133,196,229],"utilisent":[93],"conditions":[95,117],"temperature":[97],"permettent":[104,143],"d'accelerer":[105],"l'endommagement":[106],"il":[108],"convient":[109],"d'extrapoler":[110],"resultats":[112],"ces":[114],"aux":[116,206],"nominales":[118],"d'emploi":[119],"maitrisant":[121],"artefacts":[123],"introduits":[124],"l'acceleration.":[126],"simulations":[128],"interconnexions,":[135],"l'objet":[138],"principal":[139],"ce":[141],"travail,":[142],"separer":[145],"effets":[147],"structuraux":[148],"mecaniques":[150],"effectuant":[152],"bilan":[154],"flots":[156],"dans":[159],"differents":[161],"troncons":[162],"ligne.":[166],"L'etude":[167,188,209],"thermique":[168],"degage":[169],"principales":[171],"regles":[172],"respecter":[174],"lors":[175],"conduite":[178],"depouillement":[181],"vie.":[187],"structurale":[189],"prevoit":[190],"dispersion":[192,233],"durees":[194,227],"comparables":[197],"celles":[199],"obtenues":[200],"experimentalement":[201],"permet":[203,211],"l'attribuer":[205],"microstructurales.":[208],"mecanique":[210],"rendre":[213],"compte":[214],"l'effet":[216],"benefique":[217],"couches":[219],"d'oxyde":[220],"recouvrant":[221],"metallisations.":[223],"Elles":[224],"augmentent":[225],"reduisent":[231],"induisant":[235],"s'oppose":[241],"celui":[243],"engendre":[244],"migration.":[247]},"counts_by_year":[],"updated_date":"2026-08-08T07:41:36.138363","created_date":"2016-06-24T00:00:00"}