{"id":"https://openalex.org/W72910191","doi":"https://doi.org/10.1016/b978-185617451-0/50004-x","title":"Processes for the Deposition of Metallic Coatings","display_name":"Processes for the Deposition of Metallic Coatings","publication_year":2004,"publication_date":"2004-01-01","ids":{"openalex":"https://openalex.org/W72910191","doi":"https://doi.org/10.1016/b978-185617451-0/50004-x","mag":"72910191"},"language":"en","primary_location":{"id":"doi:10.1016/b978-185617451-0/50004-x","doi":"https://doi.org/10.1016/b978-185617451-0/50004-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/b978-185617451-0/50004-x","pdf_url":null,"source":{"id":"https://openalex.org/S4306463230","display_name":"Elsevier eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Electroplating","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W4234984583","display_name":"Electroplating"},"type":"book-chapter","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009358029","display_name":"Nasser Kanani","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Nasser Kanani","raw_affiliation_strings":["Atotech Deutschland GmbH, Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH, Berlin, Germany","institution_ids":["https://openalex.org/I4210098619"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5009358029"],"corresponding_institution_ids":["https://openalex.org/I4210098619"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.03741497,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"87","last_page":"140"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14382","display_name":"Electrophoretic Deposition in Materials Science","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13470","display_name":"Surface Treatment and Coatings","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/metallic-coatings","display_name":"metal coatings","score":0.9959999918937683},{"id":"https://openalex.org/keywords/electroless-plating","display_name":"electroless plating","score":0.8999999761581421},{"id":"https://openalex.org/keywords/chemical-deposition","display_name":"chemical deposition","score":0.9610000252723694},{"id":"https://openalex.org/keywords/electrodeposition","display_name":"electrodeposition","score":0.9869999885559082},{"id":"https://openalex.org/keywords/zero-valent-metals","display_name":"zero-valent metals","score":0.7080000042915344},{"id":"https://openalex.org/keywords/printed-circuit-board-metallization","display_name":"printed circuit board metallization","score":0.7639999985694885},{"id":"https://openalex.org/keywords/through-hole-plating","display_name":"through-hole plating","score":0.8349999785423279},{"id":"https://openalex.org/keywords/non-conductive-substrates","display_name":"non-conductive substrates","score":0.7409999966621399},{"id":"https://openalex.org/keywords/electroplating","display_name":"electroplating","score":0.5139999985694885}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6752229928970337},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.648150622844696},{"id":"https://openalex.org/C147120987","wikidata":"https://www.wikidata.org/wiki/Q2225","display_name":"Electron","level":2,"score":0.5603388547897339},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5409420728683472},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.5165902376174927},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.5086430311203003},{"id":"https://openalex.org/C193341735","wikidata":"https://www.wikidata.org/wiki/Q2988941","display_name":"Metallizing","level":3,"score":0.5018932819366455},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.46416428685188293},{"id":"https://openalex.org/C68801617","wikidata":"https://www.wikidata.org/wiki/Q162908","display_name":"Electrolyte","level":3,"score":0.4307197332382202},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.43002673983573914},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.41533416509628296},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.3681807219982147},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3062538504600525},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.28638434410095215},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.20816433429718018},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.15884599089622498},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06990289688110352},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.06645670533180237},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.06614011526107788},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/b978-185617451-0/50004-x","doi":"https://doi.org/10.1016/b978-185617451-0/50004-x","is_oa":false,"landing_page_url":"https://doi.org/10.1016/b978-185617451-0/50004-x","pdf_url":null,"source":{"id":"https://openalex.org/S4306463230","display_name":"Elsevier eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Electroplating","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W89079435","https://openalex.org/W1992920279","https://openalex.org/W2051349155","https://openalex.org/W2087127743","https://openalex.org/W2146072144","https://openalex.org/W2159897266","https://openalex.org/W2461847359","https://openalex.org/W2468074200","https://openalex.org/W2470013441","https://openalex.org/W2476829525","https://openalex.org/W2479671413","https://openalex.org/W2482295403","https://openalex.org/W2487552035","https://openalex.org/W2490094817","https://openalex.org/W2513265379","https://openalex.org/W2520751602","https://openalex.org/W2526046423","https://openalex.org/W2948027451","https://openalex.org/W2992183856","https://openalex.org/W4250374189","https://openalex.org/W4285719527","https://openalex.org/W6726613477","https://openalex.org/W6727902420","https://openalex.org/W6770723343","https://openalex.org/W6811914022"],"related_works":["https://openalex.org/W1666945360","https://openalex.org/W2740685301","https://openalex.org/W4211029004","https://openalex.org/W6901569260","https://openalex.org/W2932171686","https://openalex.org/W3091527089","https://openalex.org/W2538019218","https://openalex.org/W2899634019","https://openalex.org/W4239239121","https://openalex.org/W192431509"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}