{"id":"https://openalex.org/W7225340438","doi":"https://doi.org/10.4071/001c.173636","title":"CNN-Based Pressure Prediction for a Hybrid Pneumatic\u2013Electromagnetic Bonding System in the OLED Lamination Process","display_name":"CNN-Based Pressure Prediction for a Hybrid Pneumatic\u2013Electromagnetic Bonding System in the OLED Lamination Process","publication_year":2026,"publication_date":"2026-11-05","ids":{"openalex":"https://openalex.org/W7225340438","doi":"https://doi.org/10.4071/001c.173636"},"language":"en","primary_location":{"id":"doi:10.4071/001c.173636","doi":"https://doi.org/10.4071/001c.173636","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.173636","pdf_url":"https://imapsource.org/article/173636.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://imapsource.org/article/173636.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011962641","display_name":"Eun-ho Lee","orcid":"https://orcid.org/0000-0003-1270-7954","observed_orcids":["https://orcid.org/0000-0003-1270-7954"]},"institutions":[{"id":"https://openalex.org/I51504820","display_name":"San Jose State University","ror":"https://ror.org/04qyvz380","country_code":"US","type":"education","lineage":["https://openalex.org/I51504820"]},{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR","US"],"is_corresponding":false,"raw_author_name":"Eun-Ho Lee","raw_affiliation_strings":["San Jos\u00e9 State University","Sungkyunkwan University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"San Jos\u00e9 State University","institution_ids":["https://openalex.org/I51504820"]},{"raw_affiliation_string":"Sungkyunkwan University","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5160942304","display_name":"Taehun Ju","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taehun Ju","raw_affiliation_strings":["Samsung Institute of Technology","Sungkyunkwan University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Samsung Institute of Technology","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Sungkyunkwan University","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001857076","display_name":"Hohyun Lee","orcid":"https://orcid.org/0000-0002-2691-9360","observed_orcids":["https://orcid.org/0000-0002-2691-9360"]},"institutions":[{"id":"https://openalex.org/I51504820","display_name":"San Jose State University","ror":"https://ror.org/04qyvz380","country_code":"US","type":"education","lineage":["https://openalex.org/I51504820"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hohyun Lee","raw_affiliation_strings":["San Jos\u00e9 State University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"San Jos\u00e9 State University","institution_ids":["https://openalex.org/I51504820"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"2026","issue":"Symposium","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.06639999896287918,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.06639999896287918,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11372","display_name":"Hydraulic and Pneumatic Systems","score":0.047200001776218414,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14156","display_name":"Engineering Applied Research","score":0.04470000043511391,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/pressure-prediction","display_name":"pressure prediction","score":0.6370000243186951},{"id":"https://openalex.org/keywords/pressure-uniformity","display_name":"pressure uniformity","score":0.8679999709129333},{"id":"https://openalex.org/keywords/multiphysics-design","display_name":"multiphysics design","score":0.8560000061988831},{"id":"https://openalex.org/keywords/finite-element-analysis","display_name":"finite element analysis","score":0.6949999928474426},{"id":"https://openalex.org/keywords/display-manufacturing-equipment","display_name":"display manufacturing equipment","score":0.5130000114440918}],"concepts":[{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.7592999935150146},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6312999725341797},{"id":"https://openalex.org/C2777557983","wikidata":"https://www.wikidata.org/wiki/Q384943","display_name":"Lamination","level":3,"score":0.625},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.5360000133514404},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5011000037193298},{"id":"https://openalex.org/C150759737","wikidata":"https://www.wikidata.org/wiki/Q209593","display_name":"OLED","level":3,"score":0.49959999322891235},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4959999918937683},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.47850000858306885},{"id":"https://openalex.org/C2780428219","wikidata":"https://www.wikidata.org/wiki/Q16952335","display_name":"Cover (algebra)","level":2,"score":0.4291999936103821},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.3864000141620636},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.36570000648498535},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3650999963283539},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32850000262260437},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3118000030517578},{"id":"https://openalex.org/C80264047","wikidata":"https://www.wikidata.org/wiki/Q7424019","display_name":"Pressure measurement","level":2,"score":0.3068000078201294},{"id":"https://openalex.org/C34559072","wikidata":"https://www.wikidata.org/wiki/Q2334061","display_name":"Design of experiments","level":2,"score":0.29580000042915344},{"id":"https://openalex.org/C84907080","wikidata":"https://www.wikidata.org/wiki/Q320170","display_name":"Back pressure","level":2,"score":0.2809000015258789},{"id":"https://openalex.org/C2781384022","wikidata":"https://www.wikidata.org/wiki/Q1172383","display_name":"Datasheet","level":2,"score":0.2709999978542328},{"id":"https://openalex.org/C132943942","wikidata":"https://www.wikidata.org/wiki/Q2562511","display_name":"Footprint","level":2,"score":0.26510000228881836},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.2644999921321869},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.2612999975681305},{"id":"https://openalex.org/C76956256","wikidata":"https://www.wikidata.org/wiki/Q27610560","display_name":"Process modeling","level":3,"score":0.2597000002861023},{"id":"https://openalex.org/C2777521450","wikidata":"https://www.wikidata.org/wiki/Q43171778","display_name":"CRTS","level":2,"score":0.2556000053882599},{"id":"https://openalex.org/C500300565","wikidata":"https://www.wikidata.org/wiki/Q925667","display_name":"Computer simulation","level":2,"score":0.2538999915122986},{"id":"https://openalex.org/C67186912","wikidata":"https://www.wikidata.org/wiki/Q367664","display_name":"Data modeling","level":2,"score":0.25049999356269836}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/001c.173636","doi":"https://doi.org/10.4071/001c.173636","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.173636","pdf_url":"https://imapsource.org/article/173636.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4071/001c.173636","doi":"https://doi.org/10.4071/001c.173636","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.173636","pdf_url":"https://imapsource.org/article/173636.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7225340438.pdf","grobid_xml":"https://content.openalex.org/works/W7225340438.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7154478001","https://openalex.org/W2047767023","https://openalex.org/W4410175273","https://openalex.org/W2770801718","https://openalex.org/W2598087731","https://openalex.org/W7171972262","https://openalex.org/W1984927960","https://openalex.org/W2795528518","https://openalex.org/W7212225585","https://openalex.org/W4225910683"],"abstract_inverted_index":{"As":[0],"OLED":[1],"adoption":[2],"for":[3,13],"large":[4],"displays":[5],"continues":[6],"to":[7,65],"grow,":[8],"there":[9,115],"is":[10,107,116],"a":[11,33,70],"need":[12],"compact":[14],"equipment":[15],"designs":[16],"that":[17,57,75,104,114],"can":[18,76],"apply":[19],"uniform":[20],"pressure":[21,61,81],"during":[22,83],"display":[23],"and":[24,39,50,102,126],"cover":[25],"glass":[26],"adhesion.":[27],"In":[28],"this":[29,58],"study,":[30],"we":[31,55,68,112],"propose":[32],"multiphysics":[34],"design":[35],"methodology":[36],"using":[37],"electromagnetic":[38],"pneumatic":[40],"actuators,":[41],"which":[42],"offers":[43],"advantage":[44],"in":[45],"terms":[46],"of":[47,119],"actuator":[48],"size":[49],"fast":[51],"responsiveness.":[52],"Through":[53],"experiments,":[54],"confirmed":[56,113],"system":[59],"improves":[60],"uniformity":[62],"by":[63],"up":[64],"53.7%p.":[66],"Furthermore,":[67],"built":[69],"CNN-based":[71],"image":[72],"generation":[73],"model":[74],"help":[77],"us":[78],"predict":[79],"the":[80,84,95,99,105,124,127],"distribution":[82],"process":[85],"without":[86],"high-cost":[87],"experiments":[88],"or":[89],"time-consuming":[90],"simulations.":[91],"We":[92],"first":[93],"compared":[94],"experimental":[96],"data":[97],"with":[98],"FEM":[100],"simulation":[101,125],"found":[103],"error":[106,118],"approximately":[108],"4.6%.":[109],"After":[110],"that,":[111],"an":[117],"less":[120],"than":[121],"6%":[122],"between":[123],"CNN":[128],"model\u2019s":[129],"predictions.":[130]},"counts_by_year":[],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2026-11-06T00:00:00"}